Simulated and experimental investigation on discontinuous dynamic recrystallization of a near-α TA15 titanium alloy during isothermal hot compression in βsingle-phase field

A cellular automaton（CA） modeling of discontinuous dynamic recrystallization（DDRX） of a near-α Ti-6Al-2Zr-1Mo-1V（TA15） isothermally compressed in the β single phase field was presented.In the CA model,nucleation of the β-DDRX and the growth of recrystallized grains（re-grains） were considered and visibly simulated by the CA model.The driving force of re-grain growth was provided by dislocation density accumulating around the grain boundaries.To verify the CA model,the predicted flow stress by the CA model was compared with the experimental data.The comparison showed that the average relative errors were10.2%,10.1%and 6%,respectively,at 1.0,0.1 and 0.01 s^-1 of 1020 ℃,and were 10.2%,11.35%and 7.5%,respectively,at 1.0,0.1and 0.01 s^-1 of 1050 ℃.The CA model was further applied to predicting the average growth rate,average re-grain size and recrystallization kinetics.The simulated results showed that the average growth rate increases with the increasing strain rate or temperature,while the re-grain size increases with the decreasing strain rate;the volume fraction of recrystallization decreases with the increasing strain rate or decreasing temperature.

A discontinuous dynamic recrystallization model incorporating characteristics of initial microstructure

In order to describe and predict the kinetic process of discontinuous dynamic recrystallization （DDRX） during hot workingfor metals with low to medium stacking fault energies quantitatively, a new physically-based model was proposed by considering thecharacteristics of grain size distribution, capillary effect of initial grain boundaries （GBs） and continuous consumption of GBs. UsingIncoloy 028 alloy as a model system, experiments aiming to provide kinetic data （e.g., the size and volume fraction of recrystallizedgrain） and the associated microstructure were performed. Good agreement is obtained between model predictions and experimentalresults, regarding flow stress, recrystallized fraction and grain size evolution. On this basis, a thermo-kinetic relationship upon thegrowth of recrystallized grain was elucidated, i.e., with increasing thermodynamic driving force, the activation energy barrierdecreases.

Microstructural evolution and dynamic recrystallization mechanisms of additively manufactured TiAl alloy with heterogeneous microstructure during hot compression

Microstructural evolution and dynamic recrystallization(DRX)mechanisms of a Ti-48Al-2Cr-2Nb(at.%)alloy prepared by selective electron beam melting(SEBM)during hot deformation at 1150℃and 0.1 s^(-1)were investigated by hot compression tests,optical microscope(OM),scanning electron microscope(SEM),electron back-scattered diffraction(EBSD)and transmission electron microscope(TEM).The results show that the initial microstructure of the as-SEBMed alloy exhibits layers of coarseγgrains and fineγ+α_(2)+(α_(2)/γ)lamellar mixture grains alternately along the building direction.During the early stage of hot deformation,deformation twins tend to form within the coarse grains,facilitating subsequent deformation,and a small number of DRX grains appear in the fine-grained regions.With the increase of strain,extensive DRX grains are formed through different DRX mechanisms in both coarse and fine-grained regions,involving discontinuous dynamic recrystallization mechanism(DDRX)in the fine-grained regions and a coexistence of DDRX and continuous dynamic recrystallization(CDRX)in the coarsegrained regions.

Effect of Si and Ti on dynamic recrystallization of high-performance Cu-15Ni-8Sn alloy during hot deformation

Effect of Si and Ti on dynamic recrystallization(DRX)of Cu-15Ni-8 Sn alloy was studied using hot compression tests over deformation temperature range of 750-950℃and strain rate range of 0.001-10 s^-1.The results show that the dynamic recrystallization behavior during hot deformation is significantly affected by the trace elements of Si and Ti.The addition of Si and Ti promotes the formation of Ni16Si7Ti6 particles during hot deformation,which promotes the nucleation of dynamic recrystallization by accelerating the transition from low-angle boundaries(LABs)to high-angle boundaries(HABs).Ni16Si7Ti6 particles further inhibit the growth of recrystallized grains through the pinning effect.Based on the dynamic recrystallization behavior,a processing map of the alloy is built up to obtain the optimal processing parameters.Guided by the processing map,a hot-extruded Cu-15 Ni-8Sn alloy with a fine-grained microstructure is obtained,which shows excellent elongation of 30%and ultimate tensile strength of 910 MPa.

Grain refinement and weak-textured structures based on the dynamic recrystallization of Mg–9.80Gd–3.78Y–1.12Sm–0.48Zr alloy

We utilized electron backscatter diffraction to investigate the microstructure evolutions of a newly developed magnesium-rare earth alloy(Mg–9.80 Gd–3.78 Y–1.12 Sm–0.48 Zr)during instantaneous hot indirect extrusion.An equiaxed fine-grained(average grain size of 3.4±0.2μm)microstructure with a weak texture was obtained.The grain refinement was mainly attributed to the discontinuous dynamic recrystallization(DDRX)and continuous DRX(CDRX)processes during the hot indirect extrusion process.The twin boundaries formed during the initial deformation stage effectively increased the number of high angle grain boundaries(HAGBs),which provided sites for new grain nuclei,and hence,resulted in an improved DDRX process.Along with DDRX,CDRX processes characterized by low angle grain boundary(LAGB)networks were also observed in the grain interior due to effective dynamic recovery(DRV)at a relatively high temperature of 773 K and high strain rates.Thereafter,LAGB networks were transformed into HAGB networks by the progressive rotation of subgrains during the CDRX process.

Deformation Behavior of 6063 Aluminum Alloy During High-Speed Compression

The deformation behavior characteristics of 6063 aluminum alloy were studied experimentally by isothermal compression tests on a Gleeble- 1500 thermal-mechanical simulator. Cylindrical specimens of 14mm in height and 10mm in diameter were compressed dynamically at temperatures ranging from 473 to 723K and at higher strain rntes from 5 to 30s^-1. It is fouud that the flow curves not only depend on the strain rate and temperature but nlso on the dynamic recovery aud recrystallization behavior. The results show that the flow stress decreased with the increase of temperature, while increased with the increase of strain rate. The discontinuous dynamic recrystallization （DDRX） may take place at a high strain rate of 20s^-1 under the tested conditions. At 30s^-1 , the flow curve can exhibit,flow softening due to the effect of temperature rise that raised the temperature by aboat 32K in less than 0.05s.

Interface healing mechanism of fine-grained Ni-Co-based superalloy during hot-compression bonding

The interface healing mechanism of fine-grained Ni-Co-based superalloy during hot-compression bonding(HCB)is investigated.During HCB,the incompatibility of deformation between theγand the primary γ′leads to a large number of dislocation pairs(DP),stacking faults(SF),and micro-twins(MT)in the primary γ′.These defects act as fast channels for elemental diffusion,leading to supersaturation of the primary γ′and promoting the growth of the γ-shell.On the one hand,the primary γ′with a γ-shell moves towards the bonding interface due to anomalous yielding phenomena of the primary γ′and plastic flow during HCB process.The increase in the number of defects leads to the growth of γ-γ′heterogeneous epitaxial recrystallization(HERX)grain with coherent structure at the bonding interface,which promotes the bulge of the interface grain boundaries(IGBs).On the other hand,the nucleation and growth of a necklace-like distribution of discontinuous dynamic recrystallization(DDRX)grain at the interface lead to the healing of IGBs.With the synergistic action of DDRX and HERX,the mechanical properties of Ni-Co-based superalloy joints through HCB achieve the same level as the base material.This finding further enriches the theory of interface healing in HCB.