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STUDY OF DEGRADATION MECHANISM AND PACKAGING OF ORGANIC LIGHT EMITTING DEVICES
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作者 Gu Xu Materials Science and Engineering McMaster University Hamilton, Ontario, L8S 4L7 Canada 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 2003年第5期527-531,共5页
Organic Light Emitting Devices (OLED) have attracted much attention recently, for their applications in futureFlat Panel Displays and lighting products. However, their fast degradation remained a major obstacle to the... Organic Light Emitting Devices (OLED) have attracted much attention recently, for their applications in futureFlat Panel Displays and lighting products. However, their fast degradation remained a major obstacle to theircommercialization. Here we present a brief summary of our studies on both extrinsic and intrinsic causes for the fastdegradation of OLEDs. In particular, we focus on the origin of the dark spots by 'rebuilding' cathodes, which confirms thatthe growth of dark spots occurs primarily due to cathode delamination. In the meantime, we recapture the findings from thesearch for suitable OLED packaging materials, in particular polymer composites, which provide both heat dissipation andmoisture resistance, in addition to electrical insulation. 展开更多
关键词 Organic light emitting devices Degradation mechanism Dark spots Cathode rebuilding Polymer composites Heat dissipation and moisture resistance
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Optimization of fin geometry in heat convection with entransy theory
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作者 程雪涛 张勤昭 +1 位作者 徐向华 新刚 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第2期139-144,共6页
The entransy theory developed in recent years is used to optimize the aspect ratio of a plate fin in heat convection.Based on a two-dimensional model,the theoretical analysis shows that the minimum thermal resistance ... The entransy theory developed in recent years is used to optimize the aspect ratio of a plate fin in heat convection.Based on a two-dimensional model,the theoretical analysis shows that the minimum thermal resistance defined with the concept of entransy dissipation corresponds to the maximum heat transfer rate when the temperature of the heating surface is fixed.On the other hand,when the heat flux of the heating surface is fixed,the minimum thermal resistance corresponds to the minimum average temperature of the heating surface.The entropy optimization is also given for the heat transfer processes.It is observed that the minimum entropy generation,the minimum entropy generation number,and the minimum revised entropy generation number do not always correspond to the best heat transfer performance.In addition,the influence factors on the optimized aspect ratio of the plate fin are also discussed.The optimized ratio decreases with the enhancement of heat convection,while it increases with fin thermal conductivity increasing. 展开更多
关键词 entransy dissipation thermal resistance heat convection optimization fin efficiency
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