Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Double-sided lapping is an precision machining method capable of obtaining high-precision surface.However,during the lapping process of thin pure copper substrate,the workpiece will be warped due to the influence of residual stress,including the machining stress and initial residual stress,which will deteriorate the flatness of the workpiece and ultimately affect the performance of components.In this study,finite element method(FEM)was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping.Considering the initial residual stress of the workpiece,the stress caused by the lapping and their distribution characteristics,a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters.The results showed that the primary cause of the warping deformation of the workpiece in the doublesided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces.The finite element simulation results were in good agreement with the experimental results.

Bulging Distortion of Austenitic Stainless Steel Sheet on the Partially Penetrated Side of Non-Penetration Lap Laser Welding Joint

Non-penetration laser welding of lap joints in austenitic stainless steel sheets is commonly preferred in fields where the surface quality is of utmost importance.However,the application of non-penetration welded austenitic stainless steel parts is limited owing to the micro bulging distortion that occurs on the back surface of the partial penetration side.In this paper,non-penetration lap laser welding experiments,were conducted on galvanized and SUS304 austenitic stainless steel plates using a fiber laser,to investigate the mechanism of bulging distortion.A comparative experiment of DC01 galvanized steel-Q235 carbon steel lap laser welding was carried out,and the deflection and distortion profile of partially penetrated side of the sheets were measured using a noncontact laser interferometer.In addition,the cold-rolled SUS304 was subjected to heat holding at different temperatures and water quenching after bending to characterize its microstructure under tensile and compressive stress.The results show that,during the heating stage of the thermal cycle of laser lap welding,the partial penetration side of the SUS304 steel sheet generates compressive stress,which extrudes the material in the heat-affected zone to the outside of the back of the SUS304 steel sheet,thereby forming a bulge.The findings of these experiments can be of great value for controlling the distortion of the partial penetrated side of austenitic stainless steel sheet during laser non-penetration lap welding.

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

CdZnTe wafers were machined by lapping and mechanical polishing processes,and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process.A new damage type,which is induced by the indentation of embedded abrasives,is found in the subsurface.When a floss pad is used to replace the lapping plate during machining,the surface damage is mainly induced by two-body abrasive and three-body abrasive wear,and the effect of embedded abrasives on the surface is greatly weakened.Moreover,this new damage type nearly disappears on the subsurface.

Optimization experiment on eccentric lapping of cylindrical rollers

Cylindrical rollers are important elements of bearings,and their machining accuracy and consistency affect the bearing quality.Using a GCr15 cylindrical roller ofФ11×12 as the processing object in this study,the effects of loading pressure,abrasive concentration,and speed combination on cylindrical roller machining precision were investigated using the orthogonal experimental design method on a double-side eccentric pendulum lapping and polishing machine.The machining parameters of the lapping stage were optimized,and the lapping optimal process parameters were determined by S/N response analysis and analysis of variance(ANOVA).The results show that when the experiment was optimized using loading pressure of 10 N/roller,abrasive concentrationof 20.0 wt%,and rotational speed combination,the material removal rate(MRR)of cylindrical roller reached 0.0896μm/min;the average roughness of the batch decreased from 0.056μm to 0.027μm,51.8%lower than the original batch average roughness,and the deviation decreased from the initial 0.022μm to 0.014μm;the batch average roundness error decreased from 0.47μm to 0.28μm,40.4%lower than the original batch average roundness error,and the deviation decreased from the initial 0.19μm to 0.038μm;and the batch average diameter variation decreased from 4.5μm to about 3.6μm,20%lower than the original batch average diameter variation.The double-side eccentric lapping of cylinder rollers does not only lead to improvement in the surface quality and shape accuracy of rollers,but also improvement in the batch consistency.

Modeling and Validation of Indentation Depth of Abrasive Grain into Lithium Niobate Wafer by Fixed-Abrasive Lapping

The prediction of indentation depth of abrasive grain in hydrophilic fixed-abrasive(FA)lapping is crucial for controlling material removal rate and surface quality of the work-piece being machined.By applying the theory of contact mechanics,a theoretical model of the indentation depth of abrasive grain was developed and the relationships between indentation depth and properties of contact pairs and abrasive back-off were studied.Also,the average surface roughness(Ra)of lapped wafer was approximately calculated according to the obtained indentation depth.To verify the rationality of the proposed model,a series of lapping experiments on lithium niobate(LN)wafers were carried out,whose average surface roughness Ra was measured by atomic force microscope(AFM).The experimental results were coincided with the theoretical predictions,verifying the rationality of the proposed model.It is concluded that the indentation depth of the fixed abrasive was primarily affected by the applied load,wafer micro hardness and pad Young′s modulus and so on.Moreover,the larger the applied load,the more significant the back-off of the abrasive grain.The model established in this paper is helpful to the design of FA pad and its machining parameters,and the prediction of Ra as well.

Characterization of CIAE developed double-sided silicon strip detector for charged particles

A double-sided silicon strip detector(DSSD)with active area of 48 mm x 48 mm and thickness of300μm has been developed. Each side of DSSD consists of48 strips, each with width of 0.9 mm and inter-strip separation of 0.1 mm. Electrical properties and detection performances including full depletion bias voltage, reverse leakage current, rise time, energy resolution and cross talk have been studied. At a bias of 80 V, leakage current in each strip is less than 15 nA, and rise time for alpha particle at 5157 keV is approximately 15 ns on both sides.Good energy resolutions have been achieved with0.65-0.80% for the junction strips and 0.85-1.00% for the ohmic strips. The cross talk is found to be negligible on both sides. The overall good performance of DSSD indicates its readiness for various nuclear physics experiments.

MINITYPE MACHINING SYSTEM FOR DIAMOND LAPPING & POLISHING BY USING BRUSHLESS DIRECT CURRENT MOTOR AS PRECISE SPINDLE

A minitype precise spindle system which can machine precisely and stably in the process of diamond lapping and polishing is designed. In such minitype spindle system, the brushless DC spindle motor is used to drive the lapping finish table, which is built with fluid dynamic bearings. Some measures have been taken to make the lapping system dynamic balance, and a servo controller which can adjust the speed of motor from 1200 r/min to 5400 r/min is designed. Experiments show that the spindle system is reliable and stable for diamond polishing, and the detection results by atomic force microscope（AFM） show that the surfaces of diamond edge＇s Ra is 6.725 nm and whole diamond average Ra is 3.25 nm.

High Speed Lapping of SiC Ceramic Material with Solid (Fixed) Abrasives

An experimental investigation is carried out to machine SiC ceramic material through the method of high speed plane lapping with solid(fixed) abrasives after the critical condition of brittle-ductile transition is theoretically analyzed. The results show that the material removal mechanism and the surface roughness are chiefly related to the granularity of abrasives for brittle materials such as SiC ceramic. It is easily realized to machine SiC ceramic in the ductile mode using W3.5 grit and a high efficiency, low cost and smooth surface with a surface roughness of R_a 2.4?nm can be achieved.

Keyhole Double-Sided Arc Welding Process

In the proposed method, the current/arc is guided through the keyhole so that the energy of the plasma jet is compensated while it is consumed in heating the workpiece along the keyhole. As a result, deep narrow penetration has been achieved on 12.7 mm (1/2') thick stainless steel plates using 70 A welding current.

Numerical Simulation of Current Density Distribution in Keyhole Double-Sided Arc Welding

In the double-sided arc welding system (DSAW) composing of PAW+TIG arcs, the PAW arc is guided by the TIG arc so that the current mostly flows through the direction of the workpiece thickness and the penetration is greatly improved. To analyze the current density distribution in DSAW is beneficial to understanding of this process. Considering all kinds of dynamic factors acting on the weldpool, this paper discusses firstly the surface deformation of the weldpool and the keyhole formation in PAW+TIG DSAW process on the basis of the magnetohydrodynamic theory and variation principles. Hence, a model of the current density distribution is developed. Through numerical simulation, the current density distribution in PAW+TIG DSAW process is quantitatively analyzed. It shows that the minimal radius of keyhole formed in PAW+TIG DSAW process is 0.5 mm and 89.5 percent of current flows through the keyhole.

Nonlinear optical properties in double-sided nonlinear media with Z-scan technique based on the Huygens-Fresnel principle

We present a theoretical model to analyse the propagation of a Gaussian laser beam through double-sided nonlinear media. This model is based on the Huygens-Fresnel diffraction integral method. This theoretical model is not only consistent with the cascade structure model for a small nonlinear phase-shift but also can be used for a large nonlinear phase-shift. It has been verified that it is suitable to characterize the double-sided nonlinear media compared with the cascade structure model. A good agreement between the experimental data and the results from the theoretical model is obtained. It will be useful for the design of multi-sided nonlinear materials.

EFFECT OF LAP SURFACE PROFILE ON LAPPING EFFICIENCY

To meet the requirements of improving the efficiency in lapping operat ion, the effect of lap surface profile on the efficiency is analyzed theoretical ly and an experimental study is carried out on lapping of Mn Zn ferrite. It is f ound that the profile of lap surface affects significantly the efficiency by mea ns of its capacity to keep loose grains and fixed grains during lapping, and tha t the efficiency can be increased by several times by using a lap with proper surface profile, while the same work surface roughness can be finally obtained.

CVD Micro-diamond Coated Tool Lapping with Sapphire Wafer

Micro-diamond films were prepared on YG6 substrate by hot filament chemical vapor deposition method.An innovative micro-diamond coated tool was used to the lap sapphire wafer.The effect of load,rotating speed,and lapping time on material removal rate(MRR)and surface roughness was investigated.The results showed that the best process parameters were 3N,100r/min and 15 min.The surface quality of sapphire improved significantly after lapping.The coating after lapping adhered well and did not show any peeling.The innovative micro-diamond coated tool was feasible and suitable for the lapping of the single crystal sapphire wafer.

Finite Element Analysis for Grinding and Lapping of Wire-sawn Silicon Wafers

Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing processes. A critical issue in wafer production is the waviness induced by wire sawing. If this waviness is not removed, it will affect wafer flatness and semiconductor performance. In practice, both lapping and grinding have been used to flatten wire-sawn wafers. Although grinding is not as effective as lapping in removing waviness, it has many other advantages over lapping (such as higher throughput, fully automatic, and more benign to environment) and has great potential to reduce manufacturing cost of silicon wafers. This paper presents a finite element analysis (FEA) study on grinding and lapping of wire-sawn silicon wafers. An FEA model is first developed to simulate the waviness deformation of wire-sawn wafers in grinding and lapping processes. It is then used to explain how the waviness is removed or reduced by lapping and grinding and why the effectiveness of grinding in removing waviness is different from that of lapping. Furthermore, the model is used to study the effects of various parameters including active-grinding-zone orientation, grinding force, waviness wavelength, and waviness height on the reduction and elimination of waviness. Finally, the results of pilot experiments to verify the model are discussed.

Subsurface Damage of Monocrystalline Germanium Wafers by Fixed and Free Abrasive Lappings

The subsurface damage(SSD)layers of monocrystalline germanium wafers lapped by three different ways were measured and compared by the method of nanoindentation and micro morphology.Three ways such as ice-fixed abrasive,thermosetting fixed abrasive and free abrasive lappings are adopted to lap monocrystalline germanium wafers.The SSD depth was measured by a nanoindenter,and the morphology of SSD layer was observed by an atomic force microscopy(AFM).The results show that the SSD layer of monocrystalline germanium wafer is mainly composed of soft corrosion layer and plastic scratch and crack growth layer.Compared with thermosetting fixed abrasive and free abrasive lappings,the SSD depth lapped with ice-fixed abrasive is shallower.Moreover,the SSD morphology of monocrystalline germanium wafer lapped with ice-fixed abrasive is superior to those of two other processing ways.

Numerical Simulation of Electromagnetic Force in Double-Sided Arc Welding Process

Up till now, most of the researchers believe that there are four kinds of forces in the weld pool convection, they aresurface tension, electromagnetic force, buoyancy and gas shear stress. So electromagnetic force is very important,especially when large current is applied. In most of previous models, the electromagnetic force is calculated analytically,in which only the axial component of current is considered. Actually the radial component of current has thesame effect, and may be advanced in some locations. In double-sided arc welding process, instead of the earthclamp, another torch is placed on the opposite side; the current will go from one torch, through the weld zone,to another torch. In this case, the current is more concentrated in the weld zone; the electromagnetic force willhave significant effect compared with conventional welding process. In this paper, a new method of numericalcalculation for electromagnetic force is developed, in which both axial and radial components are considered. And asan example, the distribution of electromagnetic force in double-sided arc welding is calculated. It demonstrates thatthis new method could give more accurate simulation of electromagnetic force, and is close to the actual process.

ANALYSIS ON LAPPING AND POLISHING PRESSURE DISTRIBUTION OF HARD MAGNETIC DISK SUBSTRATE

The contact model of lapping and polishing for magnetic disk substrate is presented. Based on elastic contact theory, pressure distribution for this model are analyzed. Further, the effects of various parameters, such as the material properties of the PVA(polyvinyl acetate),grinding stone, the polishing pad and the base plate, the thickness of the pad or the stone on the pressure distribution have been discussed.

DISCUSSING ON SOLID ABRASIVE LAPPING PATH

Relative motion path between lapping tool and workpiece in plane solid abrasive lapping is dis- cussed and its path model is set up. The paths simulate. by this model are compared with the one got in experiments. The changing relationship of workpiece rotating speed with the main spindle rotating speed and eccentricity is also discussed.

Characteristic studies on positive and negative streamers of double-sided pulsed surface dielectric barrier discharge

The mechanisms of streamer generation and propagation in double-sided pulsed surface dielectric barrier discharge(SDBD)on both sides have been analyzed and investigated by experiment and numerical simulation.The fully exposed asymmetric SDBD has two discharge processes located on the high voltage electrode(HVE)side and the ground electrode(GE)side.Discharge images of the HVE side and GE side are taken by a digital camera under continuous pulse and ICCD(Intensified Charge Coupled Device)is utilized to diagnose the generation and propagation of streamers in single pulse discharge.In order to understand the physical mechanisms of streamer evolution more deeply,we establish a 2D simulation model and analyze it from the aspects of electron density,ion density,reduced electric field and electron impact ionization source term.The results show that the primary and secondary discharges on the HVE side and the GE side of the double-sided SDBD are composed of positive streamer and negative streamer,respectively.On the HVE side,the accumulation of positive charges on the dielectric surface causes the direction of the electric field to reverse,which is the principal factor for the polarity reversal of the streamer.On the GE side,both the negative charges accumulated on the dielectric surface and the falling voltage are the key factors for the streamer polarity switch.

Penetration mechanism of aluminum alloy in double-sided GTAW process

The penetration mechanism of aluminum alloy in double-sided gas tungsten arc welding (GTAW) process was probed by means of theoretical analysis, experimentation and numerical simulation. The results show that, firstly, the welding current goes straight through the weld zone, forms a stronger electromagnetic force field, and causes a stronger fluid flow in the weld pool. Secondly, during double-sided GTAW process, when the weld is partial penetrated, a heat-congregated zone forms between the bottoms of the two weld pools, where the temperature can increase quickly even though only a small amount of heat is input. Thirdly, the buoyancy force causes an inward flow in the bottom weld pool, which can drive the hot liquid on the surface to the bottom of the pool.