Nowadays,the utilization rate of electronic products is increasing while showing no obvious sign of reaching a limit.To solve the associated“internal heat generation problem”,scientists have proposed two methods or ...Nowadays,the utilization rate of electronic products is increasing while showing no obvious sign of reaching a limit.To solve the associated“internal heat generation problem”,scientists have proposed two methods or strategies.The first approach consists of replacing the heat exchange medium with a nanofluid.However,the high surface energy of the nanoparticles makes them prone to accumulate along the heat transfer surface.The second method follows a different approach.It tries to modify the surface structure of the electronic components in order to reduce the fluid-dynamic drag and improve the rate of heat exchange.This article reviews these effects considering different types of nanofluid and different shapes,sizes,and arrangements of“biomimetic grooves”.The idea to use these two methods in a combined fashion(to improve heat transfer and reduce flow resistance at the same time)is also developed and discussed critically to a certain extent.展开更多
基金This work is financially supported by“National Natural Science Foundation of China”(Grant No.51606214).
文摘Nowadays,the utilization rate of electronic products is increasing while showing no obvious sign of reaching a limit.To solve the associated“internal heat generation problem”,scientists have proposed two methods or strategies.The first approach consists of replacing the heat exchange medium with a nanofluid.However,the high surface energy of the nanoparticles makes them prone to accumulate along the heat transfer surface.The second method follows a different approach.It tries to modify the surface structure of the electronic components in order to reduce the fluid-dynamic drag and improve the rate of heat exchange.This article reviews these effects considering different types of nanofluid and different shapes,sizes,and arrangements of“biomimetic grooves”.The idea to use these two methods in a combined fashion(to improve heat transfer and reduce flow resistance at the same time)is also developed and discussed critically to a certain extent.
