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Dynamic recrystallization of electroformed copper liners of shaped charges in high-strain-rate plastic deformation
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作者 WenhuaiTian QiSun 《Journal of University of Science and Technology Beijing》 CSCD 2002年第5期343-346,共4页
The microstructures in the electroformed copper liners of shapedcharges after high-strain-rate plastic deformation were in-vestigated by transmission electron microscopy(TEM). Meanwhile, theorientation distribution of... The microstructures in the electroformed copper liners of shapedcharges after high-strain-rate plastic deformation were in-vestigated by transmission electron microscopy(TEM). Meanwhile, theorientation distribution of the grains in the recovered slug wasexamined by the electron backscattering Kikuchipattern(EBSP)technique. EBSP analysis illustrated that unlike theas-formed electro- formed copper liners of shaped charges the grainorientations in the recovered slug are distributed along randomly allthe directions after undergoing heavily strain deformation athigh-strain rate. Optical microscopy shows a typicalrecrystallization structure, and TEM exam- ination revealsdislocation cells existed in the thin foil specimen. These resultsindicate that dynamic recovery and recrystallization occur duringthis plastic deformation process, and the associated deformationtemperature is considered to be higher than 0.6 times the meltingpoint of copper. 展开更多
关键词 ELECTROFORMATION high-strain-rate deformation dynamic recovery andrecrystallization transmission electron microscopy
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