Laser-assisted Simulation of Dose Rate Effects of Wide Band Gap Semiconductor Devices

Laser-assisted simulation technique has played a crucial role in the investigation of dose rate effects of silicon-based devices and integrated circuits,due to its exceptional advantages in terms of flexibility,safety,convenience,and precision.In recent years,wide band gap materials,known for their strong bonding and high ionization energy,have gained increasing attention from researchers and hold significant promise for extensive applications in specialized environments.Consequently,there is a growing need for comprehensive research on the dose rate effects of wide band gap materials.In response to this need,the use of laser-assisted simulation technology has emerged as a promising approach,offering an effective means to assess the efficacy of investigating these materials and devices.This paper focused on investigating the feasibility of laser-assisted simulation to study the dose rate effects of wide band gap semiconductor devices.Theoretical conversion factors for laser-assisted simulation of dose rate effects of GaN-based and SiC-based devices were been provided.Moreover,to validate the accuracy of the conversion factors,pulsed laser and dose rate experiments were conducted on GaN-based and SiC-based PIN diodes.The results demonstrate that pulsed laser radiation andγ-ray radiation can produce highly similar photocurrent responses in GaN-based and SiC-based PIN diodes,with correlation coefficients of 0.98 and 0.974,respectively.This finding reaffirms the effectiveness of laser-assisted simulation technology,making it a valuable complement in studying the dose rate effects of wide band gap semiconductor devices.

Dose rate effects on shape memory epoxy resin during 1 Me V electron irradiation in air

The effects of 1 Me V electron irradiation in air at a fixed accumulated dose and dose rates of 393.8,196.9,78.8,and 39.4 Gy s^(-1)on a shape memory epoxy(SMEP)resin were studied.Under low-dose-rate irradiation,accelerated degradation of the shape memory performance was observed;specifically,the shape recovery ratio decreased exponentially with increasing irradiation time(that is,with decreasing dose rate).In addition,the glass transition temperature of the SMEP,as measured by dynamic mechanical analysis,decreased overall with decreasing dose rate.The dose rate effects of 1 Me V electron irradiation on the SMEP were confirmed by structural analysis using electron paramagnetic resonance(EPR)spectroscopy and Fourier transform infrared(FTIR)spectroscopy.The EPR spectra showed that the concentration of free radicals increased exponentially with increasing irradiation time.Moreover,the FTIR spectra showed higher intensities of the peaks at 1660 and 1720 cm^(-1),which are attributed to stretching vibrations of amide C=O and ketone/acid C=O,at lower dose rates.The intensities of the IR peaks at 1660 and 1720 cm^(-1) increased exponentially with increasing irradiation time,and the relative intensity of the IR peak at 2926 cm^(-1)decreased exponentially with increasing irradiation time.The solid-state13 C nuclear magnetic resonance(NMR)spectra of the SMEP before and after 1 Me V electron irradiation at a dose of 1970 k Gy and a dose rate of 78.8 Gy s^(-1) indicated damage to the CH_(2)–N groups and aliphatic isopropanol segment.This result is consistent with the detection of nitrogenous free radicals,a phenoxy-type free radical,and several types of pyrolytic carbon radicals by EPR.During the subsequent propagation process,the free radicals produced at lower dose rates were more likely to react with oxygen,which was present at higher concentrations,and form the more destructive peroxy free radicals and oxidation products such as acids,amides,and ketones.The increase in peroxy free radicals at lower dose rates was thought to accelerate the degradation of the macroscopic performance of the SMEP.

Study of the dose rate effect of 180 nm nMOSFETs

Radiation induced offstate leakage in the shallow trench isolation regions of SIMC 0.18 μm nMOSFETs is studied as a function of dose rate. A ＂true＂ dose rate effect （TDRE） is observed. Increased damage is observed at low dose rate （LDR） than at high dose rate （HDR） when annealing is taken into account. A new method of simulating radiation induced degradation in shallow trench isolation （STI） is presented. A comparison of radiation induced offstate leakage current in test nMOSFETs between total dose irradiation experiments and simulation results exhibits excellent agreement. The investigation results imply that the enhancement of the leakage current may be worse for the dose rate encountered in the environment of space.

Total ionizing dose effects on 12-bit CBCMOS digital-to-analog converters

A digital-to-analog converter （DAC） in CBCMOS technology was irradiated by 60Co F-rays at various dose rates and biases for investigating the ionizing radiation response of the DAC. The radiation responses show that the function curve and the key electrical parameters of the DAC in CBCMOS technology are sensitive to total dose and dose rates. Under different bias conditions, the radiation failure levels were different, and the radiation damage under operation bias conditions was more severe. Finally, test results were preliminarily analyzed by relating the failure mode to DAC architecture and process technology.

Monte Carlo simulation of indoor external exposure due to gamma-emitting radionuclides in building materials

The use of building materials containing naturally occurring radionuclides such as^40K,^238U,^232Th and their progeny, could lead to external exposures to the residents of such buildings. In this paper, a set of models are constructed to calculate the specific effective dose rates（the effective dose rate per Bq/kg of ^40K, the ^238U series,and the ^232Th series） imposed on residents by building materials with the MCNPX code. The effect of chemical composition, position concerned in the room and thickness as well as density of material is analyzed. In order to facilitate more precise assessment of indoor external dose due to gamma-emitting radionuclides in building materials,three regressive expressions are proposed and validated by measured data to calculate specific effective rates for40 K,the238U series and the232 Th series, respectively.

Experimental research on transient radiation effects in microprocessors based on SPARC-V8 architecture

An experimental system is developed for the transient radiation effects testing of an anti-radiation hardened processor. Based on this system, the transient radiation effects in a microprocessor based on SPARC-V8 architecture was investigated. The dose-rate-soft-error index parameters of the processor were determined according to the test results, as were the influences on the function and timing parameters of the processor. The power supply balance is affected, which caused the system to reset and be the main source of soft errors. The results showed the circuit recovery time is primarily determined by the internal PLL, while the core power and the output-low-IO ports are more sensitive to the transient dose rate effect. The power-integrity-hardened design is proposed to mitigate the transient radiation effect.

Non-equilibrium carrier capture,recombination and annealing in thick insulators and their impact on radiation hardness

This paper describes an approach to prediction of the thick insulators＇ radiation response based on modeling of the charge yield, which is dependent on irradiation temperature, dose rate, and electric field magnitudes. Temperature behavior of the charge yield and degradation saturation due to the interface precursor depletion has been modeled and simulated. Competition between the time-dependent and true dose rate （ELDRS） effects has been simulated and discussed within a framework of the rate-equation-based mathematical model. It was shown that the precursor trap in the thick insulating oxides can be important at high dose rates. It was also shown that full filling of the shallow hole traps in the insulating oxide bulk can cause suppression of dose-rate sensitivity at relatively high dose rates, especially in thick insulators.