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Efficient generation of non-classical photon pairs in a hot atomic ensemble
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作者 Chengyuan Wang Yan Gu +4 位作者 Ya Yu Dong Wei Pei Zhang Hong Gao Fuli Li 《Chinese Optics Letters》 SCIE EI CAS CSCD 2018年第8期71-74,共4页
We demonstrate the generation of non-classical photon pairs in a warm S-Rb atomic vapor ('ell with no buffer gas or polarization preserving coatings via spontaneous four-wave mixing. We obtain the photon pairs with ... We demonstrate the generation of non-classical photon pairs in a warm S-Rb atomic vapor ('ell with no buffer gas or polarization preserving coatings via spontaneous four-wave mixing. We obtain the photon pairs with a 1/e correlation time of 40 ns and the violation of Cauchy-Sehwartz inequality by a factor of 23 - 3. This provides a convenient and efficient method to generate photon pair sources based on an atomic ensemble. 展开更多
关键词 Efficient generation of non-classical photon pairs in a hot atomic ensemble
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Technological Aspect of Processing Maps for the AA2099 Alloy 被引量:2
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作者 Aneta Lukaszek-Solek 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2015年第1期22-31,共10页
Results of an experimental and modelling study of forming processes in the AA2099 Al–Cu–Li alloy, for a wide range of temperatures, strains and strain rates, are presented. The analyses are based on tensile testing ... Results of an experimental and modelling study of forming processes in the AA2099 Al–Cu–Li alloy, for a wide range of temperatures, strains and strain rates, are presented. The analyses are based on tensile testing at 20 °C at a strain rate of 0.02 s-1and uniaxial compression testing in the temperature range 400–550 °C at strain rates ranging from0.001 to 100 s-1, for constant values of true strain of 0.5 and 0.9. The stability of plastic deformation and its relationship with a sensitivity of stress to strain rate are considered. The power dissipation efficiency coefficient, g(%), and the flow instability parameter, n B 0, were determined. The complex processing maps for hot working were determined and quantified, including process frames for basic forging processes: conventional forging and for near-superplastic and isothermal conditions. A significant aspect is the convergence of power dissipation when passing through the 500 °C peak.Deformation, temperature and strain-rate-dependent microstructures at 500 °C for strain rates of 0.1, 1, 10 and 100 s-1are described and analysed for the conventional die forging process frame, corresponding to 465–523 °C and strain rates of50–100 s-1. 展开更多
关键词 Al–Cu–Li alloy Power dissipation efficiency Processing maps Microstructure hot deformation
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