This paper presents a high-efficiency technique based on dielectrophoresis (DEP) for assembling metal, semiconductor, and polymer nanorods, which are synthesized by electrochemical deposition (ECD). The assembly patte...This paper presents a high-efficiency technique based on dielectrophoresis (DEP) for assembling metal, semiconductor, and polymer nanorods, which are synthesized by electrochemical deposition (ECD). The assembly patterns of these nanorods (width: 20 nm; length: 7 μm) were designed using a finite element method (FEM) simulation tool. Further, these nanorods were used in our experiment after their assembly patterns were fabricated. The assembly yield was found to be approximately 70% at an AC voltage of 30 Vp-p and at frequencies of 20 and 30 kHz, and the DC voltage prevented the random alignment of the nanorods at the edge of the assembly pattern. Moreover, the above-mentioned nanorods, which had different permittivities, were found to have similar assembly yields. The proposed method can be improved and applied to nanostructure device fabrication.展开更多
基金Project supported by the Basic Research Program of the Korea Science & Engineering Foundation (No. R0120060001027202006)the Basic Science Research Program through the National Research Foundation of Korea (No. 2010-0001882)
文摘This paper presents a high-efficiency technique based on dielectrophoresis (DEP) for assembling metal, semiconductor, and polymer nanorods, which are synthesized by electrochemical deposition (ECD). The assembly patterns of these nanorods (width: 20 nm; length: 7 μm) were designed using a finite element method (FEM) simulation tool. Further, these nanorods were used in our experiment after their assembly patterns were fabricated. The assembly yield was found to be approximately 70% at an AC voltage of 30 Vp-p and at frequencies of 20 and 30 kHz, and the DC voltage prevented the random alignment of the nanorods at the edge of the assembly pattern. Moreover, the above-mentioned nanorods, which had different permittivities, were found to have similar assembly yields. The proposed method can be improved and applied to nanostructure device fabrication.
