Huaibei Falcon Electronic Foil Co.Ltd.

The Huaibei Falcon Electronic Foil Co.Ltd. is a large Sino-foreign joint ventureelectronic raw materials enterpriseestablished in 1994. Its key equipment wasintroduced from Japan, and the equipment’sgrade and technological software are of thethe early 1990s world’s advanced level. Itwas listed as a state small key constructionproject programme in 1993 and also an AnhuiProvince’s "Three Highs" (hi-tech, high-addedvalue and high benefits) project programme.At present, the Company is in full production,with annual production of electronic foilsused for aluminium electrolytic

Response of structural and magnetic properties of ultra-thin FeCo–V foils to high-energy beam welding processes

Microstructural evolutions and grain-boundary-character distribution during high-energy-beam welding of ultra-thin Fe Co-V foils were studied. Detailed data about the boundaries, coincidence site lattice（CSL） relationships, grain sizes, and microstructural features were acquired from electron-backscatter diffraction（EBSD） maps. Moreover, the evolution of the magnetic properties during high-energy-beam welding was studied using vibrating sample magnetometry（VSM）. The fraction of low-angle boundaries was observed to increase in the fusion zones of both electron- and laser-beam-welded foils. The results showed that the fractions of low-Σ CSL boundaries（particularly twin boundaries, Σ3） in the fusion zones of the welded foils are higher than those in the base metal. Because the strain rates produced during high-energy-beam welding are very high（because of the extremely high cooling rate）, grain deformation by a slip mechanism is limited; therefore, deformation by grain twinning is dominant. VSM analysis showed that the magnetic properties of the welded foils, i.e., their remanence, coercive force, and energy product, changed significantly. The formation of large grains with preferred orientation parallel to the easy axis of magnetization was the main reason for the diminished magnetic properties.

PREPARATION OF TEM THIN FOIL CONTAINING POWDER PARTICLE BY ELECTRODEPOSITION METHOD

A practical technique to prepare transmission electron microscopy （TEM） thin foil containing powder particle was described and the data for the codeposition of two type particles with copper in the electroplating were presented. By depositing the particles which were distributed in CuSO4 electrolyte on cathode together with Cu^2＋ in electrodeposition bath, composite coating with suitable thickness could be formed. The thin coating was separated from the substrate and cut into a disc with diameter of 3mm for electropolishing. When the Cu matrix was thinned during electropolishing, the particles contained in the coating plate were also thinned to meet the suitable thickness for TEM observation. Various experimental results revealed that during electrodepositing the current density, pH-value of electrolyte and stirring mode all have significant effects on the distribution of particles in composite coating and the surface quality of the composite coating. The proper parameters used during electrodepositing to prepare TEM thin foil containing powder particle were discussed.

Research and Analysis of Production and New Capacity of China's Electronic Copper Foil Enterprises in 2017

In the light of current fast development of new and expanded copper foil projects of electronic copper foil enterprises and recent adjustment of the main copper foil categories set to be developed by some companies(generally from lithium foil to PCB foil).The secretariat of China Electronics Materials Industry Association e-copper foil branch conducted in March,2017 an extensive and in-depth