Formation of Epitaxial Heavy-doped Silicon Films by PECVD Method

Plasma-enhanced CVD（PECVD） epitaxy at 200℃ was used to deposit heavy doped n-type silicon films. Post-annealing by rapid thermal processing was applied to improve the properties of the epitaxial layer. By analyzing the Raman spectra and the imaginary part of the dielectric constant spectra of the samples, it was found that high-quality heavy-doped epitaxial n-type silicon layer can be obtained by optimizing the parameters of the PECVD depositing process. Reducing the electrodes distance of the PECVD had a great effect on the crystallzation of the epitaxialed n-type silicon films. Sillicon films with high-crystallization were obtained with the electrodes distance of 18 mm. Post-annealing process can improve the crystallization and reduce the resistance of the epitaxial films. In our research, it was found that the sheet resistance（R□） of the post-annealed films with thickness of about 50 nm has a simple relationship with RPH3/SiH4（ratio of the flow rate of PH3 and SiH4） of the PECVD processing： R□=-184-125 lg（R（PH3/SiH4））. In the end, high-quality epitaxial n-type silicon film was obtained with R□ of 15 Ω/□ and thickness of ~50 nm.

Transfer-free chemical vapor deposition graphene for nitride epitaxy: challenges, current status and future outlook

Graphene, a two-dimensional material with outstanding electrical and mechanical properties, has attracted considerable attention in the field of semiconductor technologies due to its potential use as a buffer layer for the epitaxial Ⅲ-nitride growth. In recent years, significant progress has been made in the chemical vapor deposition growth of graphene on various insulating substrates for the nitride epitaxy, which offers a facile, inexpensive, and easily scalable methodology. However, certain challenges are still present in the form of producing high-quality graphene and achieving optimal interface compatibility with Ⅲ-nitride materials.In this review, we provide an overview of the bottlenecks associated with the transferred graphene fabrication techniques and the state-of-the-art techniques for the transfer-free graphene growth. The present contribution highlights the current progress in the transfer-free graphene growth on different insulating substrates, including sapphire, quartz, SiO_(2)/Si, and discusses the potential applications of transfer-free graphene in the Ⅲ-nitride epitaxy. Finally, it includes the prospects of the transfer-free graphene growth for the Ⅲ-nitride epitaxy and the challenges that should be overcome to realize its full potential in this field.

Effect of Precipitation on the Microhardness Distribution of Diode Laser Epitaxially Deposited IN718 Alloy Coating

The microhardness distribution of the diode laser epitaxially deposited IN718 alloy coating was investigated. The Laves concentration in different regions of the coating was measured by binarization processing. The strengthening phase of the coating was characterized by transmission electron microscopy （TEM）. The results showed that the microhardness increased along the depth of the coating. Part of Laves dissolved into austenitic matrix during the successive laser deposition, A little amount of strengthening phase was precipitated in the bottom region of the coating. It was attributed to the heat effect from the thermal cycle of successive deposition on the microstructure in the bottom region of the epitaxially deposited coating.