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Device parameter optimization for sub-20nm node HK/MG-last bulk FinFETs 被引量:1
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作者 许淼 殷华湘 +19 位作者 朱慧珑 马小龙 徐唯佳 张永奎 赵治国 罗军 杨红 李春龙 孟令款 洪培真 项金娟 高建峰 徐强 熊文娟 王大海 李俊峰 赵超 陈大鹏 杨士宁 叶甜春 《Journal of Semiconductors》 EI CAS CSCD 2015年第4期66-69,共4页
Sub-20 nm node bulk FinFET PMOS devices with an all-last high-k/metal gate (HK/MG) process are fabricated and the influence of a series of device parameters on the device scaling is investigated. The high and thin F... Sub-20 nm node bulk FinFET PMOS devices with an all-last high-k/metal gate (HK/MG) process are fabricated and the influence of a series of device parameters on the device scaling is investigated. The high and thin Fin structure with a tapered sidewall shows better performance than the normal Fin structure. The punch through stop layer (PTSL) and source drain extension (SDE) doping profiles are carefully optimized. The device without SDE annealing shows a larger drive current than that with SDE annealing due to better Si crystal regrowth in the amorphous Fin structure after source/drain implantation. The band-edged MG has a better short channel effect immunity, but the lower effective work function (EWF) MG shows a larger driveability. A tradeoff choice for different EWF MGs should be carefully designed for the device's scaling. 展开更多
关键词 bulk FinFET effective work function (EWF) extension thermal budget metal gate
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