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Preparation of WO3 thin films by dip film-drawing for photoelectrochemical performance 被引量:1
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作者 Dongbo Xu Lili Li +4 位作者 Weiqiang Fan Fagen Wang Hongye Bai Baodong Mao Weidong Shi 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2019年第5期1207-1211,共5页
Here we report the WO3 thin films on F-doped SnO2 conducting glass (FTO) substrates which were prepared by using dip film-drawing method. Dip film-drawing was a simple, convenient, economical method and in largescale ... Here we report the WO3 thin films on F-doped SnO2 conducting glass (FTO) substrates which were prepared by using dip film-drawing method. Dip film-drawing was a simple, convenient, economical method and in largescale to prepare photoanodes for future applications. The FTO substrates were dipped in tungstic acid solution then film-drawn included 3, 6, 9, 12 and 15 times for prepared different thicknesses of WO3 thin film photoanodes. Then the photoa no des were employed as the electrodes in photoelectrochemical property Keywords: WO3 thin films Dip film-drawing Photoelectrochemical Thicknesses Large-scale measurements, which include scan linear sweep, repeated on/off illumination cycles, electrochemical impedanee spectroscopy and incident phot on to current conversion efficiency, respectively. The results showed that the WO3 thin films dipped 9 times with 175 nm thicknesses had the best photoelectrochemical performance of 0.067 mA·cm^-2 at 1.23 V versus RHE. 展开更多
关键词 WO3 THIN films DIP film-drawing PHOTOELECTROCHEMICAL Thicknesses Large-scale
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