The three dimensional displacements fields in a surface mounted plastic quad flat pack (PQFP) assembly are measured during power cycling using a combination of holographic interferometry and high sensitivity moire int...The three dimensional displacements fields in a surface mounted plastic quad flat pack (PQFP) assembly are measured during power cycling using a combination of holographic interferometry and high sensitivity moire interferometry. Detailed in plane and out of plane whole field displacement data of the top and bottom ends of the gull wing leads and their distributions along the edge of PQFP are provided. The maximum deformations of the gull wing leads occur at the four corners of the PQFP. The experimental results are used as displacement boundary condition in a linear elastic analysis of the thermal stresses of the corner lead and its solder joint using a 3 D finite element method (FEM). The highest stresses occur in the area connecting the lead and the solder joint. The results should be useful in the evaluation of thermal fatigue damage of surface mount assemblies.展开更多
文摘The three dimensional displacements fields in a surface mounted plastic quad flat pack (PQFP) assembly are measured during power cycling using a combination of holographic interferometry and high sensitivity moire interferometry. Detailed in plane and out of plane whole field displacement data of the top and bottom ends of the gull wing leads and their distributions along the edge of PQFP are provided. The maximum deformations of the gull wing leads occur at the four corners of the PQFP. The experimental results are used as displacement boundary condition in a linear elastic analysis of the thermal stresses of the corner lead and its solder joint using a 3 D finite element method (FEM). The highest stresses occur in the area connecting the lead and the solder joint. The results should be useful in the evaluation of thermal fatigue damage of surface mount assemblies.
