The paper briefly introduces the Contamination Line Method for foil thickness measurement in transmission electron microscopy and compares it with four conventional methods: the convergent beam diffraction method, the...The paper briefly introduces the Contamination Line Method for foil thickness measurement in transmission electron microscopy and compares it with four conventional methods: the convergent beam diffraction method, the contamination spot method, the methods hased on characteristic X-ray emission and continuous X-ray emission on the application, aperation and accuracy etc.展开更多
Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure an...Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.展开更多
文摘The paper briefly introduces the Contamination Line Method for foil thickness measurement in transmission electron microscopy and compares it with four conventional methods: the convergent beam diffraction method, the contamination spot method, the methods hased on characteristic X-ray emission and continuous X-ray emission on the application, aperation and accuracy etc.
文摘Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.
