Due to the remarkable growth rate compared to another growth methods for gallium nitride(GaN)growth,hydride vapor phase epitaxy(HVPE)is now the only method for mass product GaN substrates.In this review,commercial HVP...Due to the remarkable growth rate compared to another growth methods for gallium nitride(GaN)growth,hydride vapor phase epitaxy(HVPE)is now the only method for mass product GaN substrates.In this review,commercial HVPE systems and the GaN crystals grown by them are demonstrated.This article also illustrates some innovative attempts to develop homebuilt HVPE systems.Finally,the prospects for the further development of HVPE for GaN crystal growth in the future are also discussed.展开更多
For thermally stable or high-temperature operating,Schottky contact utilizing refractory metal nitride,TiN,MoN and ZrN,on n-GaN were evaluated.The refractory metal nitride films were formed by reactive sputtering in A...For thermally stable or high-temperature operating,Schottky contact utilizing refractory metal nitride,TiN,MoN and ZrN,on n-GaN were evaluated.The refractory metal nitride films were formed by reactive sputtering in Ar and N2 ambient.Current-voltage characteristics show that ideality factors of 1.09-1.22 and barrier heights of 0.66-0.75 eV was obtained for the three metal nitrides.For the ZrN contact,the ideality factor and barrier height of became 1.06 and 0.77 eV,respectively,after 800 ℃ annealing.AlGaN/GaN heterostructure FET with TiN gate was also investigated.No obvious degradation was found for the TiN-gate device even after thermal treatment at 850 ℃.This shows that Schottky contact utilizing refractory metal nitride on GaN has the potential for thermal stability or high-temperature operating.展开更多
Graphene on gallium nitride (GaN) will be quite useful when the graphene is used as transparent electrodes to improve the performance of gallium nitride devices. In this work, we report the direct synthesis of graph...Graphene on gallium nitride (GaN) will be quite useful when the graphene is used as transparent electrodes to improve the performance of gallium nitride devices. In this work, we report the direct synthesis of graphene on GaN without an extra catalyst by chemical vapor deposition. Raman spectra indicate that the graphene films are uniform and about 5-6 layers in thickness. Meanwhile, the effects of growth temperatures on the growth of graphene films are systematically studied, of which 950 ℃ is found to be the optimum growth temperature. The sheet resistance of the grown graphene is 41.1 Ω/square, which is close to the lowest sheet resistance of transferred graphene reported. The mechanism of graphene growth on GaN is proposed and discussed in detail. XRD spectra and photoluminescence spectra indicate that the quality of GaN epi-layers will not be affected after the growth of graphene.展开更多
Elucidating the complex interactions between the work material and abrasives during grinding of gallium nitride(GaN)single crystals is an active and challenging research area.In this study,molecular dynamics simulatio...Elucidating the complex interactions between the work material and abrasives during grinding of gallium nitride(GaN)single crystals is an active and challenging research area.In this study,molecular dynamics simulations were performed on double-grits interacted grinding of GaN crystals;and the grinding force,coefficient of friction,stress distribution,plastic damage behaviors,and abrasive damage were systematically investigated.The results demonstrated that the interacted distance in both radial and transverse directions achieved better grinding quality than that in only one direction.The grinding force,grinding induced stress,subsurface damage depth,and abrasive wear increase as the transverse interacted distance increases.However,there was no clear correlation between the interaction distance and the number of atoms in the phase transition and dislocation length.Appropriate interacted distances between abrasives can decrease grinding force,coefficient of friction,grinding induced stress,subsurface damage depth,and abrasive wear during the grinding process.The results of grinding tests combined with cross-sectional transmission electron micrographs validated the simulated damage results,i.e.amorphous atoms,high-pressure phase transition,dislocations,stacking faults,and lattice distortions.The results of this study will deepen our understanding of damage accumulation and material removal resulting from coupling between abrasives during grinding and can be used to develop a feasible approach to the wheel design of ordered abrasives.展开更多
It remains a big challenge to synthesize two-dimensional(2D)GaN material for applications in power nanodevices.Traditional synthetic methods require complex equipment and processes and time consuming.Here,we reported ...It remains a big challenge to synthesize two-dimensional(2D)GaN material for applications in power nanodevices.Traditional synthetic methods require complex equipment and processes and time consuming.Here,we reported a two-step route to prepare polycrystalline 2D GaN film.The amorphous ultrathin Ga_(2)O_(3)film was first exfoliated from the surface of liquid gallium.In a vapor phase reaction,2D Ga_(2)O_(3)film was then converted into 2D GaN film while maintaining the 2D morphology.Raman and high-resolution transmission electron microscope(HRTEM)analysis implies the successful synthesis of wurtzite-type GaN ultrathin film.This simple strategy proposed in this work will provide more opportunities for applications of GaN ultrathin film in many devices.展开更多
We introduce the first domestic in-situ multi-information measurement system for a gallium nitride (GaN) photo- cathode. This system can successfully fulfill heat cleaning and activation for GaN in an ultrahigh vacu...We introduce the first domestic in-situ multi-information measurement system for a gallium nitride (GaN) photo- cathode. This system can successfully fulfill heat cleaning and activation for GaN in an ultrahigh vacuum environment and produce a GaN photocathode with a negative electron affinity (NEA) status. Information including the heat clean- ing temperature, vacuum degree, photocurrent, electric current of cesium source, oxygen source, and the most important information about the spectral response, or equivalently, the quantum efficiency (QE) can be obtained during prepa- ration. The preparation of a GaN photocathode with this system indicates that the optimal heating temperature in a vacuum is about 700 ~C. We also develop a method of quickly evaluating the atomically clean surface with the vacuum degree versus wavelength curve to prevent possible secondary contamination when the atomic level cleaning surface is tested with X-ray photoelectron spectroscopy. The photocurrent shows a quick enhancement when the current ratio between the cesium source and oxygen source is 1.025. The spectral response of the GaN photocathode is flat in a wavelength range from 240 nm to 365 nm, and an abrupt decline is observed at 365 nm, which demonstrates that with the in-si$u multi-information measurement system the NEA GaN photocathode can be successfully prepared.展开更多
Thin tungsten nitride (WNx) films were produced by reactive DC magnetron sputtering of tungsten in an Ar-N2 gas mixture. The films were used as Schottky contacts on AlGaN/GaN heterostructures. The Schottky behaviour...Thin tungsten nitride (WNx) films were produced by reactive DC magnetron sputtering of tungsten in an Ar-N2 gas mixture. The films were used as Schottky contacts on AlGaN/GaN heterostructures. The Schottky behaviours of WNx contact was investigated under various annealing conditions by current-voltage (I-V) measurements. The results show that the gate leakage current was reduced to 10-6 A/cm2 when the N2 flow is 400 mL/min. The results also show that the WNx contact improved the thermal stability of Schottky contacts, Finally, the current transport mechanism in WNx/AlGaN/GaN Schottky diodes has been investigated by means of I-V characterisation technique at various temperatures between 300 K and 523 K. ATE model with a Gaussian distribution of Schottky barrier heights (SBHs) is thought to be responsible for the electrical behaviour at temperatures lower than 523 K.展开更多
为了实现对氮化镓高电子迁移率晶体管GaN HEMT(gallium nitride high electron mobility transistor)高速开关带来的开通过压、误导通、开关振荡和EMI噪声等问题展开定量的仿真分析,提出了一种基于建模数据和最优化算法的门极增强型GaN ...为了实现对氮化镓高电子迁移率晶体管GaN HEMT(gallium nitride high electron mobility transistor)高速开关带来的开通过压、误导通、开关振荡和EMI噪声等问题展开定量的仿真分析,提出了一种基于建模数据和最优化算法的门极增强型GaN HEMT电热行为模型建模方法。相比较于常规GaN HEMT行为模型,所提出的建模方法采用2个简单的建模公式实现了对GaN HEMT在第一和第三象限宽工作温度范围内的电热特性进行准确的建模。同时采用一个紧凑的建模公式实现对GaN HEMT非线性寄生电容的精确建模。此外,提出了一种遗传算法和Levenberg-Marquardt算法组合的优化算法,基于该优化算法和建模数据实现了对建模参数的快速提取,在较大程度上减小了建模时间和工作量。仿真表明,所提出的建模方法能够实现对不同公司多个型号的GaN HEMT器件展开精确的建模。最后通过吻合的动态仿真和实验数据验证了所提建模方法的正确性和有效性。展开更多
High electron mobility transistor(HEMT)based on gallium nitride(GaN)is one of the most promising candidates for the future generation of high frequencies and high-power electronic applications.This research work aims ...High electron mobility transistor(HEMT)based on gallium nitride(GaN)is one of the most promising candidates for the future generation of high frequencies and high-power electronic applications.This research work aims at designing and characterization of enhancement-mode or normally-off GaN HEMT.The impact of variations in gate length,mole concentration,barrier variations and other important design parameters on the performance of normally-off GaN HEMT is thoroughly investigated.An increase in the gate length causes a decrease in the drain current and transconductance,while an increase in drain current and transconductance can be achieved by increasing the concentration of aluminium(Al).For Al mole fractions of 23%,25%,and 27%,within Al gallium nitride(AlGaN)barrier,the GaN HEMT devices provide a maximum drain current of 347,408 and 474 mA/μm and a transconductance of 19,20.2,21.5 mS/μm,respectively.Whereas,for Al mole fraction of 10%and 15%,within AlGaN buffer,these devices are observed to provide a drain current of 329 and 283 mA/μm,respectively.Furthermore,for a gate length of 2.4,3.4,and 4.4μm,the device is observed to exhibit a maximum drain current of 272,235,and 221 mA/μm and the transconductance of 16.2,14,and 12.3 mS/μm,respectively.It is established that a maximum drain current of 997 mA/μm can be achieved with an Al concentration of 23%,and the device exhibits a steady drain current with enhanced transconductance.These observations demonstrate tremendous potential for two-dimensional electron gas(2DEG)for securing of the normally-off mode operation.A suitable setting of gate length and other design parameters is critical in preserving the normally-off mode operation while also enhancing the critical performance parameters at the same time.Due to the normallyon depletion-mode nature of GaN HEMT,it is usually not considered as suitable for high power levels,frequencies,and temperature.In such settings,a negative bias is required to enter the blocking condition;however,in the before-mentioned normally-off devices,the negative bias can be avoided and the channel can be depleted without applying a negative bias.展开更多
With technology computer-aided design(TCAD)simulation software,we design a new structure of gallium oxide on gallium-nitride Schottky barrier diode(SBD).The parameters of gallium oxide are defined as new material para...With technology computer-aided design(TCAD)simulation software,we design a new structure of gallium oxide on gallium-nitride Schottky barrier diode(SBD).The parameters of gallium oxide are defined as new material parameters in the material library,and the SBD turn-on and breakdown behavior are simulated.The simulation results reveal that this new structure has a larger turn-on current than Ga2O3 SBD and a larger breakdown voltage than Ga N SBD.Also,to solve the lattice mismatch problem in the real epitaxy,we add a Zn O layer as a transition layer.The simulations show that the device still has good properties after adding this layer.展开更多
The strong polarization effect of GaN-based materials is widely used in high-performance devices such as white-lightemitting diodes(white LEDs),high electron mobility transistors(HEMTs),and GaN polarization superjunct...The strong polarization effect of GaN-based materials is widely used in high-performance devices such as white-lightemitting diodes(white LEDs),high electron mobility transistors(HEMTs),and GaN polarization superjunctions.However,the current researches on the polarization mechanism of GaN-based materials are not sufficient.In this paper,we studied the influence of polarization on electric field and energy band characteristics of Ga-face GaN bulk materials by using a combination of theoretical analysis and semiconductor technology computer-aided design(TCAD) simulation.The selfscreening effect in Ga-face bulk GaN under ideal and non-ideal conditions is studied respectively.We believe that the formation of high-density two-dimensional electron gas(2 DEG) in GaN is the accumulation of screening charges.We also clarify the source and accumulation of the screening charges caused by the GaN self-screening effect in this paper and aim to guide the design and optimization of high-performance GaN-based devices.展开更多
GaN nanorods are fabricated using inductively coupled plasma etching with Ni nano-island masks. The poly [2- methoxy-5-(2-ethyl)hexoxy-l,4-phenylenevinylene] (MEH-PPV)/GaN-nanorod hybrid structure is fabricated by...GaN nanorods are fabricated using inductively coupled plasma etching with Ni nano-island masks. The poly [2- methoxy-5-(2-ethyl)hexoxy-l,4-phenylenevinylene] (MEH-PPV)/GaN-nanorod hybrid structure is fabricated by depositing the MEH-PPV film on the GaN nanorods by using the spin-coating process. In the hybrid structure, the spatial separation is minimized to achieve high-emciency non-radiative resonant energy transfer. Optical properties of a novel device consisting of MEH-PPV/GaN-nanorod hybrid structure is studied by analyzing photoluminescenee (PL) spectra. Compared with the pure GaN nanorods, the PL intensity of the band edge emission of GaN in the MEH-PPV/GaN-nanorods is enhanced as much as three times, and the intensity of the yellow band is suppressed slightly. The obtained results are analyzed by energy transfer between the GaN nanorods and the MEH-PPV. An energy transfer model is proposed to explain the phenomenon.展开更多
Zinc oxide (ZnO) is one of the most promising and frequently used semiconductor materials. In-doped nanos- tructure ZnO thin films are grown on p-type gallium nitride substrates by employing the simultaneous rf and ...Zinc oxide (ZnO) is one of the most promising and frequently used semiconductor materials. In-doped nanos- tructure ZnO thin films are grown on p-type gallium nitride substrates by employing the simultaneous rf and dc magnetron co-sputtering technique. The effect of In-doping on structural, morphological and electrical properties is studied. The different dopant concentrations are accomplished by varying the direct current power of the In target while keeping the fixed radio frequency power of the ZnO target through the co-sputtering deposition technique by using argon as the sputtering gas at ambient temperature. The structural analysis confirms that all the grown thin films preferentially orientate along the c-axis with the wurtzite hexagonal crystal structure without having any kind of In oxide phases. The presenting Zn, 0 and In elements' chemical compositions are identified with EDX mapping analysis of the deposited thin films and the calculated M ratio has been found to decrease with the increasing In power. The surface topographies of the grown thin films are examined with the atomic force microscope technique. The obtained results reveal that the grown film roughness increases with the In power. The Hall measurements ascertain that all the grown films have n-type conductivity and also the other electrical parameters such as resistivity,mobility and carrier concentration are analyzed.展开更多
基金supported by the National Key Research and Development Plan (No. 2017YFB0404201)the National Science Foundation of China (Nos. 61774147, 61874108)
文摘Due to the remarkable growth rate compared to another growth methods for gallium nitride(GaN)growth,hydride vapor phase epitaxy(HVPE)is now the only method for mass product GaN substrates.In this review,commercial HVPE systems and the GaN crystals grown by them are demonstrated.This article also illustrates some innovative attempts to develop homebuilt HVPE systems.Finally,the prospects for the further development of HVPE for GaN crystal growth in the future are also discussed.
文摘For thermally stable or high-temperature operating,Schottky contact utilizing refractory metal nitride,TiN,MoN and ZrN,on n-GaN were evaluated.The refractory metal nitride films were formed by reactive sputtering in Ar and N2 ambient.Current-voltage characteristics show that ideality factors of 1.09-1.22 and barrier heights of 0.66-0.75 eV was obtained for the three metal nitrides.For the ZrN contact,the ideality factor and barrier height of became 1.06 and 0.77 eV,respectively,after 800 ℃ annealing.AlGaN/GaN heterostructure FET with TiN gate was also investigated.No obvious degradation was found for the TiN-gate device even after thermal treatment at 850 ℃.This shows that Schottky contact utilizing refractory metal nitride on GaN has the potential for thermal stability or high-temperature operating.
基金supported by the National Natural Science Foundation of China(Grant Nos.61274040 and 51102226)the National Basic Research Program of China(Grant No.2011CB301904)+2 种基金the National High Technology Program of China(Grant Nos.2011AA03A103 and 2011AA03A105)the National Science Foundation of China(Grant Nos.10774032 and 90921001)the Key Knowledge Innovation Project of the Chinese Academy of Sciences on Water Science Research,Instrument Developing Project of the Chinese Academy of Sciences(Grant No.Y2010031)
文摘Graphene on gallium nitride (GaN) will be quite useful when the graphene is used as transparent electrodes to improve the performance of gallium nitride devices. In this work, we report the direct synthesis of graphene on GaN without an extra catalyst by chemical vapor deposition. Raman spectra indicate that the graphene films are uniform and about 5-6 layers in thickness. Meanwhile, the effects of growth temperatures on the growth of graphene films are systematically studied, of which 950 ℃ is found to be the optimum growth temperature. The sheet resistance of the grown graphene is 41.1 Ω/square, which is close to the lowest sheet resistance of transferred graphene reported. The mechanism of graphene growth on GaN is proposed and discussed in detail. XRD spectra and photoluminescence spectra indicate that the quality of GaN epi-layers will not be affected after the growth of graphene.
基金supported by the National Natural Science Foundation of China(52375420,52005134 and51675453)Natural Science Foundation of Heilongjiang Province of China(YQ2023E014)+5 种基金Self-Planned Task(No.SKLRS202214B)of State Key Laboratory of Robotics and System(HIT)China Postdoctoral Science Foundation(2022T150163)Young Elite Scientists Sponsorship Program by CAST(No.YESS20220463)State Key Laboratory of Robotics and System(HIT)(SKLRS-2022-ZM-14)Open Fund of Key Laboratory of Microsystems and Microstructures Manufacturing(HIT)(2022KM004)Fundamental Research Funds for the Central Universities(Grant Nos.HIT.OCEF.2022024 and FRFCU5710051122)。
文摘Elucidating the complex interactions between the work material and abrasives during grinding of gallium nitride(GaN)single crystals is an active and challenging research area.In this study,molecular dynamics simulations were performed on double-grits interacted grinding of GaN crystals;and the grinding force,coefficient of friction,stress distribution,plastic damage behaviors,and abrasive damage were systematically investigated.The results demonstrated that the interacted distance in both radial and transverse directions achieved better grinding quality than that in only one direction.The grinding force,grinding induced stress,subsurface damage depth,and abrasive wear increase as the transverse interacted distance increases.However,there was no clear correlation between the interaction distance and the number of atoms in the phase transition and dislocation length.Appropriate interacted distances between abrasives can decrease grinding force,coefficient of friction,grinding induced stress,subsurface damage depth,and abrasive wear during the grinding process.The results of grinding tests combined with cross-sectional transmission electron micrographs validated the simulated damage results,i.e.amorphous atoms,high-pressure phase transition,dislocations,stacking faults,and lattice distortions.The results of this study will deepen our understanding of damage accumulation and material removal resulting from coupling between abrasives during grinding and can be used to develop a feasible approach to the wheel design of ordered abrasives.
基金Funded by the National Natural Science Foundation of China(No.52172124)the Fundamental Research Funds for the Central Universities(WUT:2021III019JC)。
文摘It remains a big challenge to synthesize two-dimensional(2D)GaN material for applications in power nanodevices.Traditional synthetic methods require complex equipment and processes and time consuming.Here,we reported a two-step route to prepare polycrystalline 2D GaN film.The amorphous ultrathin Ga_(2)O_(3)film was first exfoliated from the surface of liquid gallium.In a vapor phase reaction,2D Ga_(2)O_(3)film was then converted into 2D GaN film while maintaining the 2D morphology.Raman and high-resolution transmission electron microscope(HRTEM)analysis implies the successful synthesis of wurtzite-type GaN ultrathin film.This simple strategy proposed in this work will provide more opportunities for applications of GaN ultrathin film in many devices.
基金Project supported by the National Natural Science Foundation of China (Grant No. 60871012)the Natural Science Foundation of Shandong Province,China (Grant No. ZR2011FQ027)
文摘We introduce the first domestic in-situ multi-information measurement system for a gallium nitride (GaN) photo- cathode. This system can successfully fulfill heat cleaning and activation for GaN in an ultrahigh vacuum environment and produce a GaN photocathode with a negative electron affinity (NEA) status. Information including the heat clean- ing temperature, vacuum degree, photocurrent, electric current of cesium source, oxygen source, and the most important information about the spectral response, or equivalently, the quantum efficiency (QE) can be obtained during prepa- ration. The preparation of a GaN photocathode with this system indicates that the optimal heating temperature in a vacuum is about 700 ~C. We also develop a method of quickly evaluating the atomically clean surface with the vacuum degree versus wavelength curve to prevent possible secondary contamination when the atomic level cleaning surface is tested with X-ray photoelectron spectroscopy. The photocurrent shows a quick enhancement when the current ratio between the cesium source and oxygen source is 1.025. The spectral response of the GaN photocathode is flat in a wavelength range from 240 nm to 365 nm, and an abrupt decline is observed at 365 nm, which demonstrates that with the in-si$u multi-information measurement system the NEA GaN photocathode can be successfully prepared.
文摘Thin tungsten nitride (WNx) films were produced by reactive DC magnetron sputtering of tungsten in an Ar-N2 gas mixture. The films were used as Schottky contacts on AlGaN/GaN heterostructures. The Schottky behaviours of WNx contact was investigated under various annealing conditions by current-voltage (I-V) measurements. The results show that the gate leakage current was reduced to 10-6 A/cm2 when the N2 flow is 400 mL/min. The results also show that the WNx contact improved the thermal stability of Schottky contacts, Finally, the current transport mechanism in WNx/AlGaN/GaN Schottky diodes has been investigated by means of I-V characterisation technique at various temperatures between 300 K and 523 K. ATE model with a Gaussian distribution of Schottky barrier heights (SBHs) is thought to be responsible for the electrical behaviour at temperatures lower than 523 K.
文摘High electron mobility transistor(HEMT)based on gallium nitride(GaN)is one of the most promising candidates for the future generation of high frequencies and high-power electronic applications.This research work aims at designing and characterization of enhancement-mode or normally-off GaN HEMT.The impact of variations in gate length,mole concentration,barrier variations and other important design parameters on the performance of normally-off GaN HEMT is thoroughly investigated.An increase in the gate length causes a decrease in the drain current and transconductance,while an increase in drain current and transconductance can be achieved by increasing the concentration of aluminium(Al).For Al mole fractions of 23%,25%,and 27%,within Al gallium nitride(AlGaN)barrier,the GaN HEMT devices provide a maximum drain current of 347,408 and 474 mA/μm and a transconductance of 19,20.2,21.5 mS/μm,respectively.Whereas,for Al mole fraction of 10%and 15%,within AlGaN buffer,these devices are observed to provide a drain current of 329 and 283 mA/μm,respectively.Furthermore,for a gate length of 2.4,3.4,and 4.4μm,the device is observed to exhibit a maximum drain current of 272,235,and 221 mA/μm and the transconductance of 16.2,14,and 12.3 mS/μm,respectively.It is established that a maximum drain current of 997 mA/μm can be achieved with an Al concentration of 23%,and the device exhibits a steady drain current with enhanced transconductance.These observations demonstrate tremendous potential for two-dimensional electron gas(2DEG)for securing of the normally-off mode operation.A suitable setting of gate length and other design parameters is critical in preserving the normally-off mode operation while also enhancing the critical performance parameters at the same time.Due to the normallyon depletion-mode nature of GaN HEMT,it is usually not considered as suitable for high power levels,frequencies,and temperature.In such settings,a negative bias is required to enter the blocking condition;however,in the before-mentioned normally-off devices,the negative bias can be avoided and the channel can be depleted without applying a negative bias.
文摘With technology computer-aided design(TCAD)simulation software,we design a new structure of gallium oxide on gallium-nitride Schottky barrier diode(SBD).The parameters of gallium oxide are defined as new material parameters in the material library,and the SBD turn-on and breakdown behavior are simulated.The simulation results reveal that this new structure has a larger turn-on current than Ga2O3 SBD and a larger breakdown voltage than Ga N SBD.Also,to solve the lattice mismatch problem in the real epitaxy,we add a Zn O layer as a transition layer.The simulations show that the device still has good properties after adding this layer.
基金Project supported by the Key Research and Development Program of Guangdong Province,China(Grant No.2020B010174003)。
文摘The strong polarization effect of GaN-based materials is widely used in high-performance devices such as white-lightemitting diodes(white LEDs),high electron mobility transistors(HEMTs),and GaN polarization superjunctions.However,the current researches on the polarization mechanism of GaN-based materials are not sufficient.In this paper,we studied the influence of polarization on electric field and energy band characteristics of Ga-face GaN bulk materials by using a combination of theoretical analysis and semiconductor technology computer-aided design(TCAD) simulation.The selfscreening effect in Ga-face bulk GaN under ideal and non-ideal conditions is studied respectively.We believe that the formation of high-density two-dimensional electron gas(2 DEG) in GaN is the accumulation of screening charges.We also clarify the source and accumulation of the screening charges caused by the GaN self-screening effect in this paper and aim to guide the design and optimization of high-performance GaN-based devices.
基金Supported by the National Key Technology Research and Development Program under Grant No 2016YFB0400100the National Basic Research Program of China under Grant No 2012CB619304+4 种基金the High-Technology Research and Development Program of China under Grant Nos 2014AA032605 and 2015AA033305the National Natural Science Foundation of China under Grant Nos61274003,61422401,51461135002 and 61334009the Key Technology Research of Jiangsu Province under Grant No BE2015111the Solid State Lighting and Energy-Saving Electronics Collaborative Innovation Centerthe Research Funds from NJU-Yangzhou Institute of Opto-electronics
文摘GaN nanorods are fabricated using inductively coupled plasma etching with Ni nano-island masks. The poly [2- methoxy-5-(2-ethyl)hexoxy-l,4-phenylenevinylene] (MEH-PPV)/GaN-nanorod hybrid structure is fabricated by depositing the MEH-PPV film on the GaN nanorods by using the spin-coating process. In the hybrid structure, the spatial separation is minimized to achieve high-emciency non-radiative resonant energy transfer. Optical properties of a novel device consisting of MEH-PPV/GaN-nanorod hybrid structure is studied by analyzing photoluminescenee (PL) spectra. Compared with the pure GaN nanorods, the PL intensity of the band edge emission of GaN in the MEH-PPV/GaN-nanorods is enhanced as much as three times, and the intensity of the yellow band is suppressed slightly. The obtained results are analyzed by energy transfer between the GaN nanorods and the MEH-PPV. An energy transfer model is proposed to explain the phenomenon.
基金Supported by the RU Top-Down under Grant No 1001/CSS/870019
文摘Zinc oxide (ZnO) is one of the most promising and frequently used semiconductor materials. In-doped nanos- tructure ZnO thin films are grown on p-type gallium nitride substrates by employing the simultaneous rf and dc magnetron co-sputtering technique. The effect of In-doping on structural, morphological and electrical properties is studied. The different dopant concentrations are accomplished by varying the direct current power of the In target while keeping the fixed radio frequency power of the ZnO target through the co-sputtering deposition technique by using argon as the sputtering gas at ambient temperature. The structural analysis confirms that all the grown thin films preferentially orientate along the c-axis with the wurtzite hexagonal crystal structure without having any kind of In oxide phases. The presenting Zn, 0 and In elements' chemical compositions are identified with EDX mapping analysis of the deposited thin films and the calculated M ratio has been found to decrease with the increasing In power. The surface topographies of the grown thin films are examined with the atomic force microscope technique. The obtained results reveal that the grown film roughness increases with the In power. The Hall measurements ascertain that all the grown films have n-type conductivity and also the other electrical parameters such as resistivity,mobility and carrier concentration are analyzed.