It is noted that the behavior of most piezoelectric materials is temperaturedependent and such piezo-thermo-elastic coupling phenomenon has become even more pronounced in thecase of finite deformation. On the other ha...It is noted that the behavior of most piezoelectric materials is temperaturedependent and such piezo-thermo-elastic coupling phenomenon has become even more pronounced in thecase of finite deformation. On the other hand, for the purpose of precise shape and vibrationcontrol of piezoelectric smart structures, their deformation under external excitation must beideally modeled. This demands a thorough study of the coupled piezo-thermo-elastic response underfinite deformation. In this study, the governing equations of piezoelectric structures areformulated through the theory of virtual displacement principle and a finite element method isdeveloped. It should be emphasized that in the finite element method the fully coupledpiezo-thermo-elastic behavior and the geometric non-linearity are considered. The method developedis then applied to simulate the dynamic and steady response of a clamped plate to heat flux actingon one side of the plate to mimic the behavior of a battery plate of satellite irradiated under thesun. The results obtained are compared against classical solutions, whereby the thermal conductivityis assumed to be independent of deformation. It is found that the full-coupled theory predicts lesstransient response of the temperature compared to the classic analysis. In the steady state limit,the predicted temperature distribution within the plate for small heat flux is almost the same forboth analyses. However, it is noted that increasing the heat flux will increase the deviationbetween the predictions of the temperature distribution by the full coupled theory and by theclassic analysis. It is concluded from the present study that, in order to precisely predict thedeformation of smart structures, the piezo-thermo-elastic coupling, geometric non-linearity and thedeformation dependent thermal conductivity should be taken into account.展开更多
基金the National Natural Science Foundation of China (Nos.10132010 and 50135030)the Foundation of In-service Doctors of Xi'an Jiaotong University
文摘It is noted that the behavior of most piezoelectric materials is temperaturedependent and such piezo-thermo-elastic coupling phenomenon has become even more pronounced in thecase of finite deformation. On the other hand, for the purpose of precise shape and vibrationcontrol of piezoelectric smart structures, their deformation under external excitation must beideally modeled. This demands a thorough study of the coupled piezo-thermo-elastic response underfinite deformation. In this study, the governing equations of piezoelectric structures areformulated through the theory of virtual displacement principle and a finite element method isdeveloped. It should be emphasized that in the finite element method the fully coupledpiezo-thermo-elastic behavior and the geometric non-linearity are considered. The method developedis then applied to simulate the dynamic and steady response of a clamped plate to heat flux actingon one side of the plate to mimic the behavior of a battery plate of satellite irradiated under thesun. The results obtained are compared against classical solutions, whereby the thermal conductivityis assumed to be independent of deformation. It is found that the full-coupled theory predicts lesstransient response of the temperature compared to the classic analysis. In the steady state limit,the predicted temperature distribution within the plate for small heat flux is almost the same forboth analyses. However, it is noted that increasing the heat flux will increase the deviationbetween the predictions of the temperature distribution by the full coupled theory and by theclassic analysis. It is concluded from the present study that, in order to precisely predict thedeformation of smart structures, the piezo-thermo-elastic coupling, geometric non-linearity and thedeformation dependent thermal conductivity should be taken into account.
