A facile route for preparation of gradient wettability surface on copper substrate with contact angle changing from 90.3°to4.2°was developed.The Cu（OH）2 nanoribbon arrays were electrochemically deposited o...A facile route for preparation of gradient wettability surface on copper substrate with contact angle changing from 90.3°to4.2°was developed.The Cu（OH）2 nanoribbon arrays were electrochemically deposited on copper foil via a modified anodization technology,and the growth degree and density of the Cu（OH）2 arrays may be controlled varying with position along the substrate by slowly adding aqueous solution of KOH into the two-electrode cell of an anodization system to form the gradient surface.The prepared surface was water resistant and thermal stable,which could keep its gradient wetting property after being immersed in water bath at 100℃ for 10 h.The results of scanning electron microscopy（SEM）,X-ray diffraction（XRD） and X-ray photoelectron spectroscopy（XPS） demonstrate that the distribution of Cu（OH）2 nanoribbon arrays on copper surface are responsible for the gradient wettability.展开更多
Loop heat pipes(LHPs),as high-efficiency heat dissipation components,are considered to be superior thermal conductors beyond any known materials.To apply LHPs to mobile electronics,a small,thin and compact system need...Loop heat pipes(LHPs),as high-efficiency heat dissipation components,are considered to be superior thermal conductors beyond any known materials.To apply LHPs to mobile electronics,a small,thin and compact system needs to be designed.However,with the trend of miniaturization,the heat transfer performance of LHPs degrades rapidly due to the significant increase of working fluid backflow resistance.This work aims to propose an effective solution to this problem.In this work,the surface wettability gradient(SWG)is introduced into the ultra-thin LHP,and the influence of SWG on mass and heat transfer performance is studied comprehensively by using a transient three-dimensional numerical model.It is observed that the SWG can significantly increase the vapor-liquid circulation efficiency and improve heat transfer performance.Numerical experiments have been performed to compare the two kinds of LHPs with and without SWG.At the heat load of 4–6 W,the start-up time for LHP with SWG is shortened by 11.5%and the thermal resistance is reduced by about 44.3%,compared with the LHP without SWG.This work provides a solution for the performance-degradation problem caused by miniaturization,as a numerical reference for experiments.展开更多
基金Project(S2012010010417)supported by the Guangdong Natural Science Foundation,ChinaProject(20130172110008)supported by the Specialized Research Fund for the Doctoral Program of Higher Education of China
文摘A facile route for preparation of gradient wettability surface on copper substrate with contact angle changing from 90.3°to4.2°was developed.The Cu（OH）2 nanoribbon arrays were electrochemically deposited on copper foil via a modified anodization technology,and the growth degree and density of the Cu（OH）2 arrays may be controlled varying with position along the substrate by slowly adding aqueous solution of KOH into the two-electrode cell of an anodization system to form the gradient surface.The prepared surface was water resistant and thermal stable,which could keep its gradient wetting property after being immersed in water bath at 100℃ for 10 h.The results of scanning electron microscopy（SEM）,X-ray diffraction（XRD） and X-ray photoelectron spectroscopy（XPS） demonstrate that the distribution of Cu（OH）2 nanoribbon arrays on copper surface are responsible for the gradient wettability.
基金financial supports from the Science and Technology Innovation Commission of Shenzhen(Grant No.JCYJ20190809154007586)National Key Research and Development Program of China(Grant No.2017YFE0120800)+1 种基金National Natural Science Foundation of China(Grant No.U20A20241 and No.51702277)Science and Technology Development Fund of the Macao Special Administrative Region(Grant No.FDCT/013/2017/AMJ)。
文摘Loop heat pipes(LHPs),as high-efficiency heat dissipation components,are considered to be superior thermal conductors beyond any known materials.To apply LHPs to mobile electronics,a small,thin and compact system needs to be designed.However,with the trend of miniaturization,the heat transfer performance of LHPs degrades rapidly due to the significant increase of working fluid backflow resistance.This work aims to propose an effective solution to this problem.In this work,the surface wettability gradient(SWG)is introduced into the ultra-thin LHP,and the influence of SWG on mass and heat transfer performance is studied comprehensively by using a transient three-dimensional numerical model.It is observed that the SWG can significantly increase the vapor-liquid circulation efficiency and improve heat transfer performance.Numerical experiments have been performed to compare the two kinds of LHPs with and without SWG.At the heat load of 4–6 W,the start-up time for LHP with SWG is shortened by 11.5%and the thermal resistance is reduced by about 44.3%,compared with the LHP without SWG.This work provides a solution for the performance-degradation problem caused by miniaturization,as a numerical reference for experiments.
