In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi...In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.展开更多
In this paper, a 3D model of a flat circuit board with a heat generating electronic chip mounted on it has been studied numerically. The conjugate heat transfer including the conduction in the chip and convection with...In this paper, a 3D model of a flat circuit board with a heat generating electronic chip mounted on it has been studied numerically. The conjugate heat transfer including the conduction in the chip and convection with the surrounding fluid has been investigated numerically. Computational fluid dynamics using the finite volume method has been used for modeling the conjugate heat transfer through the chip and the circuit board. Conjugate heat transfer has broad applications in engineering and industrial applications in design of cooling off electronic components. Effects of various inlet velocities have been studied on the heat transfer variation and temperature of the circuit board. Numerical results show that the temperature of the chip reduces as the velocity of the inlet fluid flow increases.展开更多
The 45。heat spreading angle is familiar among thermal designers. This angle has been used for thermal design of electronic devices, and provides a heat spreading area inside a board, e.g. printed circuit board, which...The 45。heat spreading angle is familiar among thermal designers. This angle has been used for thermal design of electronic devices, and provides a heat spreading area inside a board, e.g. printed circuit board, which is placed between a heat dissipating element and a relatively large heat sink. By using this angle, the heat transfer behavior can be estimated quickly without using high-performance computers. In addition, the rough design can be made easily by changing design parameters. This angle is effective in a practical situation;however, the discussion has not been made sufficiently on the applicability of the 45。heat spreading angle. In the present study, therefore, the extensive numerical investigation is conducted for the rational thermal design using the 45。heat spreading angle. The two-dimensional mathematical model of the board is considered;the center of the top is heated by a heat source while the bottom is entirely cooled by a heat sink. The temperature distribution is obtained by solving the heat conduction equation numerically with the boundary conditions. From the numerical results, the heat transfer behavior inside the board is shown and its relation with the design parameters is clarified. The heat transfer behavior inside the 45。heat spreading area is also evaluated. The applicability is moreover discussed on the thermal resistance of the board obtained by the 45。heat spreading angle. It is confirmed that the 45。heat spreading angle is applicable when the Biot number is large, and then the equations are proposed to calculate the Biot number index to use the 45。angle. Furthermore, the validity of the 45。heat spreading angle is also confirmed when the isothermal boundary condition is used at the cooled section of the board.展开更多
基金Special Fund Project of Science and Technology Innovation of Dongli District(21090302)Research Projectof Applied Basic and Front Technologies of Tianjin(10JCZDJC15400)
文摘In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.
文摘In this paper, a 3D model of a flat circuit board with a heat generating electronic chip mounted on it has been studied numerically. The conjugate heat transfer including the conduction in the chip and convection with the surrounding fluid has been investigated numerically. Computational fluid dynamics using the finite volume method has been used for modeling the conjugate heat transfer through the chip and the circuit board. Conjugate heat transfer has broad applications in engineering and industrial applications in design of cooling off electronic components. Effects of various inlet velocities have been studied on the heat transfer variation and temperature of the circuit board. Numerical results show that the temperature of the chip reduces as the velocity of the inlet fluid flow increases.
文摘The 45。heat spreading angle is familiar among thermal designers. This angle has been used for thermal design of electronic devices, and provides a heat spreading area inside a board, e.g. printed circuit board, which is placed between a heat dissipating element and a relatively large heat sink. By using this angle, the heat transfer behavior can be estimated quickly without using high-performance computers. In addition, the rough design can be made easily by changing design parameters. This angle is effective in a practical situation;however, the discussion has not been made sufficiently on the applicability of the 45。heat spreading angle. In the present study, therefore, the extensive numerical investigation is conducted for the rational thermal design using the 45。heat spreading angle. The two-dimensional mathematical model of the board is considered;the center of the top is heated by a heat source while the bottom is entirely cooled by a heat sink. The temperature distribution is obtained by solving the heat conduction equation numerically with the boundary conditions. From the numerical results, the heat transfer behavior inside the board is shown and its relation with the design parameters is clarified. The heat transfer behavior inside the 45。heat spreading area is also evaluated. The applicability is moreover discussed on the thermal resistance of the board obtained by the 45。heat spreading angle. It is confirmed that the 45。heat spreading angle is applicable when the Biot number is large, and then the equations are proposed to calculate the Biot number index to use the 45。angle. Furthermore, the validity of the 45。heat spreading angle is also confirmed when the isothermal boundary condition is used at the cooled section of the board.
