Si and Mg pair-doped interlayers for improving performance of AlGaN/GaN heterostructure field effect transistors grown on Si substrate

We report a novel structure of A1GaN/GaN heterostructure field effect transistors （HFETs） with a Si and Mg pair- doped interlayer grown on Si substrate. By optimizing the doping concentrations of the pair-doped interlayers, the mobility of 2DEG increases by twice for the conventional structure under 5 K due to the improved crystalline quality of the conduction channel. The proposed HFET shows a four orders lower off-state leakage current, resulting in a much higher on/off ratio （ - 10^9）. Further temperature-dependent performance of Schottky diodes revealed that the inhibition of shallow surface traps in proposed HFETs should be the main reason for the suppression of leakage current.

Evaluation of a gate-first process for AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors with low ohmic annealing temperature

In this paper, TiN/A1Ox gated A1GaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors （MOS- HFETs） were fabricated for gate-first process evaluation. By employing a low temperature ohmic process, ohmic contact can be obtained by annealing at 600 ℃ with the contact resistance approximately 1.6 Ω.mm. The ohmic annealing process also acts as a post-deposition annealing on the oxide film, resulting in good device performance. Those results demonstrated that the TiN/A1Ox gated MOS-HFETs with low temperature ohmic process can be applied for self-aligned gate AIGaN/GaN MOS-HFETs.

Improvement of switching characteristics by substrate bias in AlGaN/AlN/GaN heterostructure field effect transistors

A simple and effective approach to improve the switching characteristics of AlGaN/AlN/GaN heterostructure field effect transistors （HFETs） by applying a voltage bias on the substrate is presented. With the increase of the substrate bias, the OFF-state drain current is much reduced and the ON-state current keeps constant. Both the ON/OFF current ratio and the subthreshold swing are demonstrated to be greatly improved. With the thinned substrate, the improvement of the switching characteristics with the substrate bias is found to be even greater. The above improvements of the switching characteristics are attributed to the interaction between the substrate bias induced electrical field and the bulk traps in the GaN buffer layer, which reduces the conductivity of the GaN buffer layer.

Parasitic source resistance at different temperatures for AlGaN/AlN/GaN heterostructure field-effect transistors

The parasitic source resistance（RS） of AlGaN/AlN/GaN heterostructure field-effect transistors（HFETs） is studied in the temperature range 300–500 K. By using the measured RSand both capacitance–voltage（C–V） and current–voltage（I–V） characteristics for the fabricated device at 300, 350, 400, 450, and 500 K, it is found that the polarization Coulomb field（PCF） scattering exhibits a significant impact on RSat the above-mentioned different temperatures. Furthermore, in the AlGaN/AlN/GaN HFETs, the interaction between the additional positive polarization charges underneath the gate contact and the additional negative polarization charges near the source Ohmic contact, which is related to the PCF scattering, is verified during the variable-temperature study of RS.

Electron mobility in the linear region of an AlGaN/AlN/GaN heterostructure field-effect transistor

We simulate the current-voltage （I-V） characteristics of AlGaN/AlN/GaN heterostructure field-effect transistors （HFETs） with different gate lengths using the quasi-two-dimensional （quasi-2D） model. The calculation results obtained using the modified mobility model are found to accord well with the experimental data. By analyzing the variation of the electron mobility for the two-dimensional electron gas （213EG） with the electric field in the linear region of the AlGaN/AlN/GaN HFET I-V output characteristics, it is found that the polarization Coulomb field scattering still plays an important role in the electron mobility of AlGaN/AlN/GaN HFETs at the higher drain voltage and channel electric field. As drain voltage and channel electric field increase, the 2DEG density reduces and the polarization Coulomb field scattering increases, as a result, the 2DEG electron mobility decreases.

Influence of the channel electric field distribution on the polarization Coulomb field scattering in In_(0.18) Al_(0.82) N/AlN/GaN heterostructure field-effect transistors

By making use of the quasi-two-dimensional （quasi-2D） model, the current-voltage （l-V） characteristics of In0AsA10.82N/A1N/GaN heterostructure field-effect transistors （HFETs） with different gate lengths are simulated based on the measured capacitance-voltage （C-V） characteristics and I-V characteristics. By analyzing the variation of the electron mobility for the two-dimensional electron gas （2DEG） with electric field, it is found that the different polarization charge distributions generated by the different channel electric field distributions can result in different polarization Coulomb field scatterings. The difference between the electron mobilities primarily caused by the polarization Coulomb field scatterings can reach up to 1522.9 cm2/V.s for the prepared In0.38AI0.82N/A1N/GaN HFETs. In addition, when the 2DEG sheet density is modulated by the drain-source bias, the electron mobility presents a peak with the variation of the 2DEG sheet density, the gate length is smaller, and the 2DEG sheet density corresponding to the peak point is higher.

Two-Dimensional Transition Metal Dichalcogenides and Their Charge Carrier Mobilities in Field-Effect Transistors

Two-dimensional(2D) materials have attracted extensive interest due to their excellent electrical, thermal,mechanical, and optical properties. Graphene has been one of the most explored 2D materials. However, its zero band gap has limited its applications in electronic devices. Transition metal dichalcogenide(TMDC), another kind of 2D material,has a nonzero direct band gap(same charge carrier momentum in valence and conduction band) at monolayer state,promising for the efficient switching devices(e.g., field-effect transistors). This review mainly focuses on the recent advances in charge carrier mobility and the challenges to achieve high mobility in the electronic devices based on 2DTMDC materials and also includes an introduction of 2D materials along with the synthesis techniques. Finally, this review describes the possible methodology and future prospective to enhance the charge carrier mobility for electronic devices.

Monolithic integration of an AlGaN/GaN metal-insulator field-effect transistor with an ultra-low voltage-drop diode for self-protection

In this paper, we present a monolithic integration of a self-protected AlGaN/GaN metal-insulator field-effect transistor （MISFET）. An integrated field-controlled diode on the drain side of the AlGaN/GaN MISFET features a self- protected function for a reverse bias. This diode takes advantage of the recessed-barrier enhancement-mode technique to realize an ultra-low voltage drop and a low turn-ON voltage. In the smart monolithic integration, this integrated diode can block a reverse bias （〉 70 V/μm） and suppress the leakage current （〈 5 × 10-11 A/mm）. Compared with conventional monolithic integration, the numerical results show that the MISET integrated with a field-controlled diode leads to a good performance for smart power integration. And the power loss is lower than 50% in conduction without forward current degeneration.

Effect of the side-Ohmic contact processing on the polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

Using the measured capacitance–voltage and current–voltage characteristics of the rectangular AlN/GaN heterostructure field-effect transistors（HFETs） with the side-Ohmic contacts, it was found that the polarization Coulomb field scattering in the AlN/GaN HFETs was greatly weakened after the side-Ohmic contact processing, however, it still could not be ignored. It was also found that, with side-Ohmic contacts, the polarization Coulomb field scattering was much stronger in AlN/GaN HFETs than in Al GaN/AlN/GaN and In0：17Al0：83N/AlN/GaN HFETs, which was attributed to the extremely thinner barrier layer and the stronger polarization of the AlN/GaN heterostructure.

有机-有机界面效应的原位及非原位研究

有机-有机异质结构已被广泛应用于各种有机电子器件,包括有机发光二极管(OLEDs)、有机场效应晶体管(OFETs)和有机太阳能电池等。全面理解有机-有机异质结构的界面效应,对于器件的设计和性能优化具有重要意义。然而由于有机半导体具有多样的化学特性以及分子间较弱的范德华力,界面电荷传输特性与有机-有机电子结构、环境气氛等密切相关。在此,我们报道了随着顶层半导体并五苯(pentacene)的沉积,并五苯/酞菁氧钒(VOPc)异质结构的原位实时电学性能监测。结果显示,异质结构晶体管的p型迁移率从0.4 cm2∙V−1∙s^(−1)下降至0.2 cm2∙V−1∙s^(−1),而n型迁移率从0.01 cm2∙V−1∙s^(−1)迅速增加至约0.9 cm2∙V−1∙s^(−1)。这种n型输运行为的增强归因于pentacene向VOPc的界面电子转移效应以及由此导致的VOPc层中陷阱态的填充。此外,非原位实验对比表明,当晶体管制备过程暴露于大气时会明显抑制这种界面电荷转移效应,导致沉积pentacene后n型输运几乎没有得到改善。薄膜形态、开尔文探针力显微镜(KPFM)和X射线光电子能谱(XPS)的结果表明,界面处存在从pentacene到VOPc的电子转移。进一步的密度泛函理论(DFT)计算表明,由于pentacene/VOPc之间较强的相互作用,pentacene往VOPc的电荷转移量约为0.15 e。此外,O_(2)/H2O的存在会抑制这种界面电荷转移效应,这与我们的实验结果一致。本研究通过原位电学表征对有机-有机界面之间的电荷转移效应给出了深入解释,有利于进一步的器件性能优化及界面效应分析。

基于60nmT型栅f_T&f_(max)为170&210 GHz的InAlN/GaN HFETs器件（英文）

基于蓝宝石衬底InAlN/GaN异质结材料研制具有高电流增益截止频率(f_T)和最大振荡频率(f_(max))的InAlN/GaN异质结场效应晶体管(HFETs).基于再生长n+GaN欧姆接触工艺实现了器件尺寸的缩小,有效源漏间距(Lsd)缩小至600nm.此外,采用自对准栅工艺制备60nmT型栅.由于器件尺寸的缩小,在Vgs=1V时,器件最大饱和电流(Ids)达到1.89A/mm,峰值跨导达到462mS/mm.根据小信号测试结果,外推得到器件的f_T和f_(max)分别为170GHz和210GHz,该频率特性为国内InAlN/GaNHFETs器件频率的最高值.

The influence of the channel electric field distribution on the polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

Based on the measured capacitance–voltage（C–V） curves and current–voltage（I–V） curves for the prepared differently-sized AlN/GaN heterostructure field-effect transistors（HFETs）, the I–V characteristics of the AlN/GaN HFETs were simulated using the quasi-two-dimensional（quasi-2D） model. By analyzing the variation in the electron mobility for the two-dimensional electron gas（2DEG） with the channel electric field, it is found that the different polarization charge distribution generated by the different channel electric field distribution can result in different polarization Coulomb field（PCF） scattering. The 2DEG electron mobility difference is mostly caused by the PCF scattering which can reach up to 899.6 cm^2/（V·s）（sample a）, 1307.4 cm^2/（V·s）（sample b）,1561.7 cm^2/（V s）（sample c） and 678.1 cm^2/（V·s）（sample d）, respectively. When the 2DEG sheet density is modulated by the drain–source bias, the electron mobility for samples a, b and c appear to peak with the variation of the 2DEG sheet density, but for sample d, no peak appears and the electron mobility rises with the increase in the2 DEG sheet density.

GaN基HFET电力电子器件的研究

作为第三代宽禁带半导体器件,GaN基HFET功率器件具耐高压、高频、导通电阻小等优良特性,在电力电子器件方面也具有卓越的优势。概述了基于电力电子方面应用的AlGaN/GaN HFET功率器件的研究进展。从器件的结构入手,介绍了AlGaN/GaN HEMT的研究现状,从栅材料的选取以及栅介质层的结构对器件性能的影响着手,对AlGaN/GaN MIS-HFET的研究进行了详细的介绍。分析了场板改善器件击穿特性的原理以及各种场板结构AlGaN/GaNHFET器件的研究进展。论述了实现增强型器件不同的方法。阐述了GaN基HFET功率器件在材料、器件结构、稳定性、工艺等方面所面临的挑战。最后探讨了GaN基HFET功率器件未来的发展趋势。

GaN HFET研究中的钝化、场板和异质结构设计

从AlGaN/GaN沟道阱电子状态出发,深入研究了GaNHFET研究中的钝化和场板电极。提出了用低、高Al组分比势垒制成复合势垒,来抬高势垒和增大势垒宽度,强化沟道阱的量子限制。强调了负极化电荷在强化沟道阱量子限制和能带剪裁中的重要作用。依据内沟道、外沟道和欧姆接触对势垒的不同要求设计出二维异质结构。通过特殊的异质结构设计和后工艺剪裁制成了满足肖特基势垒和欧姆接触的两种不同的异质结构。把优质Si3N4钝化膜同复合势垒结合起来塑造出满足外沟道要求的异质结构,从而实现了HFET二维异质结构的优化设计。证实了这种新沟道阱中的电子在三种不同栅压下的强二维特性,强调了背场板和背势垒在器件研究中的重要作用。

影响AlGaN/GaN HFET器件二维电子气的若干因素

基于Sentaurus Workbench(SWB)TCAD可制造性设计平台进行AlGaN/GaN器件的结构设计和仿真,并对影响二维电子气的重要参数因素进行了研究及优化,诸如AlGaN势垒层中Al组分x、AlGaN势垒层厚度h、应变弛豫度r和栅偏压Vg等因素。参数相关性的制约结果,无疑会反映在对器件物理特性的制约及影响上。研究结果表明,在一定条件下增大势垒层中Al组分和势垒层厚度可以提高器件的电流传输特性。然而随着二者的不断增大将会引起应变弛豫的发生,而应变弛豫的发生会降低器件的性能。

高工作电压GaAs HFET

通过对结构和性能的分析与优化,设计并研制了不同场板和宽槽条件下的高工作电压GaAs HFET器件。直流和射频测试结果表明:提升场板长度和宽槽宽度可以有效提高器件的工作电压。器件在南京电子器件研究所流片,最终制备出的器件性能为:击穿电压大于84 V,在20 V工作电压下截止频率为9 GHz,3 GHz时功率增益为15.87 dB、功率附加效率为53%。

基于FC技术的AlGaN/GaN HEMT

采用FC技术将管芯倒扣至AlN基板散热的AlGaN/GaN HEMTs,并通过热阻模型分析了FC方式的散热机理.从测试结果看,器件的热阻可大幅降到14 .9K·mm/W,直流特性明显增加,饱和电流提高33%.表明采用FC技术有效改善了器件散热,而且引入的寄生电感较小,可获得更大输出功率.如果进一步完善频率特性的优化,可以加快FC技术的AlGaN/GaN大功率HEMT器件的实用化进程.

高性能1mm AlGaN/GaN功率HEMTs研制

报道了基于蓝宝石衬底的高性能 1mmAlGaN/GaNHEMTs功率器件 .为了提高微波功率器件性能 ,采用新的欧姆接触和新型空气桥方案 .测试表明 ,器件电流密度为 0 784A/mm ,跨导 197mS/mm ,击穿电压大于 4 0V ,截止态漏电较小 ,1mm栅宽器件的单位截止频率达到 2 0GHz,最大振荡频率为 2 8GHz ,功率增益为 11dB ,功率密度为 1 2W/mm ,PAE为 32 % 。

分子束外延AlGaN/GaN异质结场效应晶体管材料

用自组装的氨源分子束外延 (NH3-MBE)系统和射频等离子体辅助分子束外延 (PA-MBE)系统在 C面蓝宝石衬底上外延了优质 Ga N以及 Al Ga N/Ga N二维电子气材料。Ga N膜 (1 .2 μm厚 )室温电子迁移率达3 0 0 cm2 /V· s,背景电子浓度低至 2× 1 0 1 7cm- 3。双晶 X射线衍射 (0 0 0 2 )摇摆曲线半高宽为 6arcmin。 Al Ga N/Ga N二维电子气材料最高的室温和 77K二维电子气电子迁移率分别为 73 0 cm2 /V·s和 1 2 0 0 cm2 /V· s,相应的电子面密度分别是 7.6× 1 0 1 2 cm- 2和 7.1× 1 0 1 2 cm- 2 ;用所外延的 Al Ga N/Ga N二维电子气材料制备出了性能良好的 Al Ga N/Ga N HFET(异质结场效应晶体管 ) ,室温跨导为 5 0 m S/mm(栅长 1 μm) ,截止频率达 1 3 GHz(栅长 0 .5μm)。该器件在 3 0 0°C出现明显的并联电导 。

蓝宝石衬底AlGaN/GaN功率HEMTs研制

基于蓝宝石衬底的高微波特性 Al Ga N/Ga N HEMTs功率器件 ,器件采用了新的欧姆接触和新型空气桥方案。测试表明 ,器件电流密度 0 .784A/mm,跨导 1 97m S/mm,关态击穿电压 >80 V,截止态漏电很小 ,栅宽 1 mm的器件的单位截止频率 ( f T)达到 2 0 GHz,最大振荡频率 ( fmax) 2 8GHz,2 GHz脉冲测试下 ,栅宽 0 .75 mm器件 ,功率增益1 1 .8d B,输出功率 3 1 .2 d Bm,功率密度 1 .75 W/mm。