Novel GaN-based double-channel p-heterostructure field-effect transistors with a p-GaN insertion layer

GaN-based p-channel heterostructure field-effect transistors(p-HFETs)face significant constraints on on-state currents compared with n-channel high electron mobility transistors.In this work,we propose a novel double heterostructure which introduces an additional p-GaN insertion layer into traditional p-HFETs.The impact of the device structure on the hole densities and valence band energies of both the upper and lower channels is analyzed by using Silvaco TACD simulations,including the thickness of the upper AlGaN layer and the doping impurities and concentration in the GaN buffer layer,as well as the thickness and Mg-doping concentration in the p-GaN insertion layer.With the help of the p-GaN insertion layer,the C-doping concentration in the GaN buffer layer can be reduced,while the density of the two-dimensional hole gas in the lower channel is enhanced at the same time.This work suggests that a double heterostructure with a p-GaN insertion layer is a better approach to improve p-HFETs compared with those devices with C-doped buffer layer alone.

High-performance junction field-effect transistor based on black phosphorus/β-Ga2O3 heterostructure

Black phosphorous(BP),an excellent two-dimensional(2D)monoelemental layered p-type semiconductor material with high carrier mobility and thickness-dependent tunable direct bandgap structure,has been widely applied in various devices.As the essential building blocks for modern electronic and optoelectronic devices,high quality PN junctions based on semiconductors have attracted widespread attention.Herein,we report a junction field-effect transistor(JFET)by integrating narrow-gap p-type BP and ultra-wide gap n-typeβ-Ga2O3 nanoflakes for the first time.BP andβ-Ga2O3 form a vertical van der Waals(vdW)heterostructure by mechanically exfoliated method.The BP/β-Ga2O3 vdW heterostructure exhibits remarkable PN diode rectifying characteristics with a high rectifying ratio about 107 and a low reverse current around pA.More interestingly,by using the BP as the gate andβ-Ga2O3 as the channel,the BP/β-Ga2O3 JFET devices demonstrate excellent n-channel JFET characteristics with the on/off ratio as high as 107,gate leakage current around as low as pA,maximum transconductance(gm)up to 25.3μS and saturation drain current(IDSS)of 16.5μA/μm.Moreover,it has a pinch-off voltage of–20 V and a minimum subthreshold swing of 260 mV/dec.These excellent n-channel JFET characteristics will expand the application of BP in future nanoelectronic devices.

Evaluation of a gate-first process for AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors with low ohmic annealing temperature

In this paper, TiN/A1Ox gated A1GaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors （MOS- HFETs） were fabricated for gate-first process evaluation. By employing a low temperature ohmic process, ohmic contact can be obtained by annealing at 600 ℃ with the contact resistance approximately 1.6 Ω.mm. The ohmic annealing process also acts as a post-deposition annealing on the oxide film, resulting in good device performance. Those results demonstrated that the TiN/A1Ox gated MOS-HFETs with low temperature ohmic process can be applied for self-aligned gate AIGaN/GaN MOS-HFETs.

Electron mobility in the linear region of an AlGaN/AlN/GaN heterostructure field-effect transistor

We simulate the current-voltage （I-V） characteristics of AlGaN/AlN/GaN heterostructure field-effect transistors （HFETs） with different gate lengths using the quasi-two-dimensional （quasi-2D） model. The calculation results obtained using the modified mobility model are found to accord well with the experimental data. By analyzing the variation of the electron mobility for the two-dimensional electron gas （213EG） with the electric field in the linear region of the AlGaN/AlN/GaN HFET I-V output characteristics, it is found that the polarization Coulomb field scattering still plays an important role in the electron mobility of AlGaN/AlN/GaN HFETs at the higher drain voltage and channel electric field. As drain voltage and channel electric field increase, the 2DEG density reduces and the polarization Coulomb field scattering increases, as a result, the 2DEG electron mobility decreases.

Parasitic source resistance at different temperatures for AlGaN/AlN/GaN heterostructure field-effect transistors

The parasitic source resistance（RS） of AlGaN/AlN/GaN heterostructure field-effect transistors（HFETs） is studied in the temperature range 300–500 K. By using the measured RSand both capacitance–voltage（C–V） and current–voltage（I–V） characteristics for the fabricated device at 300, 350, 400, 450, and 500 K, it is found that the polarization Coulomb field（PCF） scattering exhibits a significant impact on RSat the above-mentioned different temperatures. Furthermore, in the AlGaN/AlN/GaN HFETs, the interaction between the additional positive polarization charges underneath the gate contact and the additional negative polarization charges near the source Ohmic contact, which is related to the PCF scattering, is verified during the variable-temperature study of RS.

Influence of the channel electric field distribution on the polarization Coulomb field scattering in In_(0.18) Al_(0.82) N/AlN/GaN heterostructure field-effect transistors

By making use of the quasi-two-dimensional （quasi-2D） model, the current-voltage （l-V） characteristics of In0AsA10.82N/A1N/GaN heterostructure field-effect transistors （HFETs） with different gate lengths are simulated based on the measured capacitance-voltage （C-V） characteristics and I-V characteristics. By analyzing the variation of the electron mobility for the two-dimensional electron gas （2DEG） with electric field, it is found that the different polarization charge distributions generated by the different channel electric field distributions can result in different polarization Coulomb field scatterings. The difference between the electron mobilities primarily caused by the polarization Coulomb field scatterings can reach up to 1522.9 cm2/V.s for the prepared In0.38AI0.82N/A1N/GaN HFETs. In addition, when the 2DEG sheet density is modulated by the drain-source bias, the electron mobility presents a peak with the variation of the 2DEG sheet density, the gate length is smaller, and the 2DEG sheet density corresponding to the peak point is higher.

Si and Mg pair-doped interlayers for improving performance of AlGaN/GaN heterostructure field effect transistors grown on Si substrate

We report a novel structure of A1GaN/GaN heterostructure field effect transistors （HFETs） with a Si and Mg pair- doped interlayer grown on Si substrate. By optimizing the doping concentrations of the pair-doped interlayers, the mobility of 2DEG increases by twice for the conventional structure under 5 K due to the improved crystalline quality of the conduction channel. The proposed HFET shows a four orders lower off-state leakage current, resulting in a much higher on/off ratio （ - 10^9）. Further temperature-dependent performance of Schottky diodes revealed that the inhibition of shallow surface traps in proposed HFETs should be the main reason for the suppression of leakage current.

Improvement of switching characteristics by substrate bias in AlGaN/AlN/GaN heterostructure field effect transistors

A simple and effective approach to improve the switching characteristics of AlGaN/AlN/GaN heterostructure field effect transistors （HFETs） by applying a voltage bias on the substrate is presented. With the increase of the substrate bias, the OFF-state drain current is much reduced and the ON-state current keeps constant. Both the ON/OFF current ratio and the subthreshold swing are demonstrated to be greatly improved. With the thinned substrate, the improvement of the switching characteristics with the substrate bias is found to be even greater. The above improvements of the switching characteristics are attributed to the interaction between the substrate bias induced electrical field and the bulk traps in the GaN buffer layer, which reduces the conductivity of the GaN buffer layer.

Two-Dimensional Transition Metal Dichalcogenides and Their Charge Carrier Mobilities in Field-Effect Transistors

Two-dimensional(2D) materials have attracted extensive interest due to their excellent electrical, thermal,mechanical, and optical properties. Graphene has been one of the most explored 2D materials. However, its zero band gap has limited its applications in electronic devices. Transition metal dichalcogenide(TMDC), another kind of 2D material,has a nonzero direct band gap(same charge carrier momentum in valence and conduction band) at monolayer state,promising for the efficient switching devices(e.g., field-effect transistors). This review mainly focuses on the recent advances in charge carrier mobility and the challenges to achieve high mobility in the electronic devices based on 2DTMDC materials and also includes an introduction of 2D materials along with the synthesis techniques. Finally, this review describes the possible methodology and future prospective to enhance the charge carrier mobility for electronic devices.

Monolithic integration of an AlGaN/GaN metal-insulator field-effect transistor with an ultra-low voltage-drop diode for self-protection

In this paper, we present a monolithic integration of a self-protected AlGaN/GaN metal-insulator field-effect transistor （MISFET）. An integrated field-controlled diode on the drain side of the AlGaN/GaN MISFET features a self- protected function for a reverse bias. This diode takes advantage of the recessed-barrier enhancement-mode technique to realize an ultra-low voltage drop and a low turn-ON voltage. In the smart monolithic integration, this integrated diode can block a reverse bias （〉 70 V/μm） and suppress the leakage current （〈 5 × 10-11 A/mm）. Compared with conventional monolithic integration, the numerical results show that the MISET integrated with a field-controlled diode leads to a good performance for smart power integration. And the power loss is lower than 50% in conduction without forward current degeneration.

基于60nmT型栅f_T&f_(max)为170&210 GHz的InAlN/GaN HFETs器件（英文）

基于蓝宝石衬底InAlN/GaN异质结材料研制具有高电流增益截止频率(f_T)和最大振荡频率(f_(max))的InAlN/GaN异质结场效应晶体管(HFETs).基于再生长n+GaN欧姆接触工艺实现了器件尺寸的缩小,有效源漏间距(Lsd)缩小至600nm.此外,采用自对准栅工艺制备60nmT型栅.由于器件尺寸的缩小,在Vgs=1V时,器件最大饱和电流(Ids)达到1.89A/mm,峰值跨导达到462mS/mm.根据小信号测试结果,外推得到器件的f_T和f_(max)分别为170GHz和210GHz,该频率特性为国内InAlN/GaNHFETs器件频率的最高值.

影响AlGaN/GaN HFET器件二维电子气的若干因素

基于Sentaurus Workbench(SWB)TCAD可制造性设计平台进行AlGaN/GaN器件的结构设计和仿真,并对影响二维电子气的重要参数因素进行了研究及优化,诸如AlGaN势垒层中Al组分x、AlGaN势垒层厚度h、应变弛豫度r和栅偏压Vg等因素。参数相关性的制约结果,无疑会反映在对器件物理特性的制约及影响上。研究结果表明,在一定条件下增大势垒层中Al组分和势垒层厚度可以提高器件的电流传输特性。然而随着二者的不断增大将会引起应变弛豫的发生,而应变弛豫的发生会降低器件的性能。

Dual-channel type tunable field-effect transistors based on vertical bilayer WS2(1−x)Se2x/SnS2 heterostructures

Layered semiconductor heterostructures are essential elements in modern electronic and optoelectronic devices.Dynamically engineering the composition of these heterostructures may enable the flexible design of the properties of heterostructure-based electronics and optoelectronics as well as their optimization.Here,we report for the first time a two-step chemical vapor deposition approach for a series of WS2(1−x)Se2x/SnS2 vertical heterostructures with high-quality and large areas.The steady-state photoluminescence results exhibit an obvious composition-related quenching ratio,revealing a strong coherence between the band offset and the charge transfer efficiency at the junction interface.Based on the achieved heterostructures,dual-channel backgate field-effect transistors were successfully designed and exhibited typical composition-dependent transport behaviors,and pure n-type unipolar transistors to ambipolar transistors were realized in such systems.The direct vapor growth of these novel vertical WS2(1−x)Se2x/SnS2 heterostructures could offer an interesting system for probing new physical properties and provide a series of layered heterostructures for high-quality devices.

The influence of the channel electric field distribution on the polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

Based on the measured capacitance–voltage（C–V） curves and current–voltage（I–V） curves for the prepared differently-sized AlN/GaN heterostructure field-effect transistors（HFETs）, the I–V characteristics of the AlN/GaN HFETs were simulated using the quasi-two-dimensional（quasi-2D） model. By analyzing the variation in the electron mobility for the two-dimensional electron gas（2DEG） with the channel electric field, it is found that the different polarization charge distribution generated by the different channel electric field distribution can result in different polarization Coulomb field（PCF） scattering. The 2DEG electron mobility difference is mostly caused by the PCF scattering which can reach up to 899.6 cm^2/（V·s）（sample a）, 1307.4 cm^2/（V·s）（sample b）,1561.7 cm^2/（V s）（sample c） and 678.1 cm^2/（V·s）（sample d）, respectively. When the 2DEG sheet density is modulated by the drain–source bias, the electron mobility for samples a, b and c appear to peak with the variation of the 2DEG sheet density, but for sample d, no peak appears and the electron mobility rises with the increase in the2 DEG sheet density.

In-plane epitaxial growth of 2D CoSe-WSe2 metalsemiconductor lateral heterostructures with improved WSe2 transistors performance

The two-dimensional(2D)in-plane(lateral)heterostructures have attracted increasing interest for potential applications in the atomically thin electronics and optoelectronics.While most studies focus on semiconductorsemiconductor lateral heterostructures with highly similar lattice structures between the constituent components,the synthesis of metal-semiconductor lateral heterostructures is much less explored and usually more challenging due to more distinct lattice structures or chemical properties.Herein,a vapor phase epitaxy growth method of high-quality metal-semiconductor lateral heterostructures between tetragonal CoSe and hexagonal WSe2 is reported.The 2D CoSe can selectively nucleate at the edge of pre-grown WSe2 nanosheets to form CoSe-WSe2 metal-semiconductor lateral heterostructures.Optical microscopy(OM),scanning electron microscopy(SEM),and atomic force microscopy(AFM)studies reveal distinct contrast across the heterostructure interface.High-resolution transmission electron microscopy(HRTEM)and selected area electron diffraction(SAED)studies further confirm the microstructure modulation across the heterostructure interface.The field-effect transistors(FETs)of CoSe-WSe2 lateral heterostructures show satisfactory Ohmic contacts and considerably better FET performance over those with deposited Cr/Au contacts,suggesting the in-plane metal-semiconductor junctions may function as improved contacts for the atomically thin electronics.

N极性GaN/AlGaN异质结和场效应晶体管（英文）

由于晶格的反转和随之而来的极化场的反转,N极性面氮化物材料已经成为微波功率器件应用的理想材料之一。在2英寸(1英寸=2.54cm)偏角度4H-SiC衬底上通过金属有机物化学气相沉积(MOCVD)的方法生长了N极性面GaN/AlGaN异质结材料,使用X射线衍射仪(HR-XRD)、原子力显微镜(AFM)、Raman光谱仪和扫描电子显微镜(SEM)等对材料进行了表征。结果表明,N极性面GaN/AlGaN异质结材料的二维电子气面密度和迁移率分别为0.92×1013cm^(-2)和1035cm^2/(V·s)。制备了N极性GaN/AlGaN异质结场效应晶体管(HFET)。测试结果表明,1μm栅长的n极性面GaN/AlGa NHFET器件峰值跨导为88.9mS/mm,峰值电流为128mA/mm。

Ka波段InAlN/GaN/AlGaN双异质结场效应晶体管

InAlN/GaN/AlGaN双异质结材料可以兼顾较高的二维电子气浓度和较好的载流子限域性,适宜制备Ka波段及以上微波功率器件。使用金属有机物气相外延方法,在SiC衬底上生长高性能InAlN/GaN/AlGaN双异质结构材料并制备了栅长为0.2μm的异质结场效应晶体管。测试结果表明,在栅压+2 V时器件的最大电流密度为1.12 A/mm,直流偏置条件VDS为+15 V和VGS为-1.6 V时,最高输出功率密度为2.1 W/mm,29 GHz下实现功率附加效率(ηPAE)为22.3%,截止频率fT达到60 GHz,最高振荡频率fmax为105 GHz。就功率密度和功率附加效率而言,是目前报道的Ka波段InAlN/GaN/AlGaN双异质结场效应晶体管研究的较好结果。

ZnO/ZnMgO异质结场效应管的制备与性能研究

利用等离子体增强化学气相沉积(PECVD)技术,在ZnO/ZnMgO异质结构上制备SiO2作为栅绝缘层,采用光刻与腐蚀工艺制备ZnO/ZnMgO异质结场效应管。电学性能测试及计算结果表明器件栅压调控作用明显。发现栅端漏电流对器件性能造成一定影响。在低温条件下,栅绝缘层产生钝化,从而能够改善器件的性能。

SnSe field-effect transistors with improved electrical properties

Low-symmetry two-dimensional(2D)materials,with unique in-plane direction-dependent optical,electrical,and thermoelectric properties,have been intensively studied for their potential application values in advanced electronic and optoelectronic devices.However,since anisotropic 2D materials are highly sensitive to the environmental factors,researches on their high-performance field-effect transistors(FETs)are still limited.Here,we report a high-performance SnSe FET based on a van der Waals(vdWs)heterostructure of SnSe encapsulated in hexagonal boron nitride(/7BN)together with graphene contacts.The device exhibits a high on/off ratio exceeding 1 × 10^(9),and a carrier mobility of 118 cm^(2)·V^(-1)s^(-1).Our work highlights low-symmetry 2D SnSe holds potential to be used for designing excellent electronic devices.

外延生长范德华金属-半导体NbS2/MoS2异质结用于增强晶体管和光电探测器性能

基于过渡金属硫族化合物的二维材料异质结,由于其在下一代高性能集成光电子器件中的潜在应用而备受关注.虽然目前异质结制备很广泛,但是外延生长具有干净锐利界面的原子级别厚度金属-半导体异质结仍然备受挑战.另外,基于金属-半导体异质结的光电性能还鲜有研究.这里,我们报道了高质量垂直金属-半导体异质结的合成,其中金属性质的单层NbS2外延生长于单层MoS2表层.使用NbS2作为电极接触的MoS2晶体管,其迁移率和电流开关比相对于Ti/Au接触的MoS2晶体管分别提升了6倍和2个数量级.另外,基于NbS2作为电极接触的MoS2光电探测器,其响应时间和光响应可以分别提升至少30倍和20倍.本工作通过简单的化学气相沉积(CVD)方法制备的原子级别厚度的金属-半导体异质结和二维金属材料在接触方面的作用为其在光电子器件中的应用奠定了基础.