Three-dimensional(3D)printing technology is expected to solve the organ shortage problem.However,owing to the accuracy limitations,it is difficult for the current bioprinting technology to achieve an accurate control ...Three-dimensional(3D)printing technology is expected to solve the organ shortage problem.However,owing to the accuracy limitations,it is difficult for the current bioprinting technology to achieve an accurate control of the spatial position and distribution of a single cell or single component droplet.In this study,to accurately achieve the directional deposition of different cells and biological materials in the spatial position for the construction of large transplantable tissues and organs,a high-precision multichannel 3D bioprinter with submicron-level motion accuracy is designed,and concurrent and synergistic printing methods are proposed.Based on the high-precision motion characteristics of the gantry structure and the requirements of concurrent and synergistic printing,a 3D bioprint-ing system with a set of 6 channels is designed to achieve six-in-one printing.Based on the Visual C++environ-ment,a control system software that integrates the programmable multi-axis controller(PMAC)motion,pneumatic,and temperature control subsystems was developed and designed.Finally,based on measurements and experiments,the 3D bioprinter and its control system was verified to fulfil the requirements of multichannel,concurrent,and syn-ergistic printing with submicron-level motion accuracy,significantly shortening the printing time and improving the printing efficiency.This study not only provides an equipment basis for printing complex heterogeneous tissue structures,but also improves the flexibility and functionality of bioprinting,and ultimately makes the construction of complex multicellular tissues or organs possible.展开更多
The main targets of seismic exploration research in Leijia carbonatite tight sandstone oil area of Liaohe depression are thin reservoirs prediction and minor faults identification, which is one of the important repres...The main targets of seismic exploration research in Leijia carbonatite tight sandstone oil area of Liaohe depression are thin reservoirs prediction and minor faults identification, which is one of the important representatives of complex exploration objects in Liaohe depression. High precision 3D seismic exploration has significantly improved the ability of thin reservoirs prediction and minor faults identification of this area. Reducing the cost of high precision 3D seismic exploration through optimizing the acquisition parameters is very important for the next step exploration and development of Liaohe depression and similar areas. Based on high precision 3D seismic acquisition data in Leijia tight sandstone oil area, multiple sub-geometries are obtained with different bin sizes, different folds, different aspect ratio, different line intervals by extracting receiver points and shot points, and PSTM processing is performed respectively, obtained PSTM datasets of the sub-geometries, extract time slices, amplitude slices along the layer, coherent slices and so on. We evaluate the data results of the sub-geometries from the aspects of signal-to-noise ratio, thin reservoirs resolution, acquisition footprint and so on. Considering the exploration cost and data effect of each sub-geometry, the optimal direction of the main parameters of high precision seismic exploration in Liaohe depression is put forward, and the acquisition effect of adjacent area by the optimized parameters is given.展开更多
Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing(HVM)maturity.In this pa...Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing(HVM)maturity.In this paper,flip-chip and wire bonding are compared,then flip-chip bonding techniques are compared to examine advantages for scaling and speed.Specific recent 3-year trends in flip-chip die-to-wafer bonding are reviewed to address the key gaps and challenges to HVM adoption.Finally,some thoughts on the care needed by the packaging technology for successful HVM introduction are reviewed.展开更多
基金Supported by National Key Research and Development Program of China(Grant No.2018YFA0703000)National Natural Science Foundation of China(Grant No.51875518)Fundamental Research Funds for the Central Universities of China(Grant Nos.2019XZZX003-02,2019FZA4002).
文摘Three-dimensional(3D)printing technology is expected to solve the organ shortage problem.However,owing to the accuracy limitations,it is difficult for the current bioprinting technology to achieve an accurate control of the spatial position and distribution of a single cell or single component droplet.In this study,to accurately achieve the directional deposition of different cells and biological materials in the spatial position for the construction of large transplantable tissues and organs,a high-precision multichannel 3D bioprinter with submicron-level motion accuracy is designed,and concurrent and synergistic printing methods are proposed.Based on the high-precision motion characteristics of the gantry structure and the requirements of concurrent and synergistic printing,a 3D bioprint-ing system with a set of 6 channels is designed to achieve six-in-one printing.Based on the Visual C++environ-ment,a control system software that integrates the programmable multi-axis controller(PMAC)motion,pneumatic,and temperature control subsystems was developed and designed.Finally,based on measurements and experiments,the 3D bioprinter and its control system was verified to fulfil the requirements of multichannel,concurrent,and syn-ergistic printing with submicron-level motion accuracy,significantly shortening the printing time and improving the printing efficiency.This study not only provides an equipment basis for printing complex heterogeneous tissue structures,but also improves the flexibility and functionality of bioprinting,and ultimately makes the construction of complex multicellular tissues or organs possible.
文摘The main targets of seismic exploration research in Leijia carbonatite tight sandstone oil area of Liaohe depression are thin reservoirs prediction and minor faults identification, which is one of the important representatives of complex exploration objects in Liaohe depression. High precision 3D seismic exploration has significantly improved the ability of thin reservoirs prediction and minor faults identification of this area. Reducing the cost of high precision 3D seismic exploration through optimizing the acquisition parameters is very important for the next step exploration and development of Liaohe depression and similar areas. Based on high precision 3D seismic acquisition data in Leijia tight sandstone oil area, multiple sub-geometries are obtained with different bin sizes, different folds, different aspect ratio, different line intervals by extracting receiver points and shot points, and PSTM processing is performed respectively, obtained PSTM datasets of the sub-geometries, extract time slices, amplitude slices along the layer, coherent slices and so on. We evaluate the data results of the sub-geometries from the aspects of signal-to-noise ratio, thin reservoirs resolution, acquisition footprint and so on. Considering the exploration cost and data effect of each sub-geometry, the optimal direction of the main parameters of high precision seismic exploration in Liaohe depression is put forward, and the acquisition effect of adjacent area by the optimized parameters is given.
文摘Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing(HVM)maturity.In this paper,flip-chip and wire bonding are compared,then flip-chip bonding techniques are compared to examine advantages for scaling and speed.Specific recent 3-year trends in flip-chip die-to-wafer bonding are reviewed to address the key gaps and challenges to HVM adoption.Finally,some thoughts on the care needed by the packaging technology for successful HVM introduction are reviewed.
