In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi...In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.展开更多
Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected ...Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.展开更多
To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature...To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temperature of the LEDs decreases by 30oC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.展开更多
Sluggish storage kinetics is considered as the main bottleneck of cathode materials for fast-charging aqueous zinc-ion batteries(AZIBs).In this report,we propose a novel in-situ self-etching strategy to unlock the Pal...Sluggish storage kinetics is considered as the main bottleneck of cathode materials for fast-charging aqueous zinc-ion batteries(AZIBs).In this report,we propose a novel in-situ self-etching strategy to unlock the Palm tree-like vanadium oxide/carbon nanofiber membrane(P-VO/C)as a robust freestanding electrode.Comprehensive investigations including the finite element simulation,in-situ X-ray diffraction,and in-situ electrochemical impedance spectroscopy disclosed it an electrochemically induced phase transformation mechanism from VO to layered Zn_(x)V_(2)O_5·nH_(2)O,as well as superior storage kinetics with ultrahigh pseudocapacitive contribution.As demonstrated,such electrode can remain a specific capacity of 285 mA h g^(-1)after 100 cycles at 1 A g^(-1),144.4 mA h g^(-1)after 1500 cycles at 30 A g^(-1),and even 97 mA h g^(-1)after 3000 cycles at 60 A g^(-1),respectively.Unexpectedly,an impressive power density of 78.9 kW kg^(-1)at the super-high current density of 100 A g^(-1)also can be achieved.Such design concept of in-situ self-etching free-standing electrode can provide a brand-new insight into extending the pseudocapacitive storage limit,so as to promote the development of high-power energy storage devices including but not limited to AZIBs.展开更多
The high power light emitting diode （LED） array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat t...The high power light emitting diode （LED） array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat transfer and fluid mechanics, the calculation of the thermal resistance for the microchannel heat sink is obtained, and the thermal resis- tance is minimized. Finally the simulation with FLUENT software is developed to verify the theoretical analysis. Established analysis and simulation show that the width of the cooling channel is 0.1 mm, and the cooling water flow rate is 1 m/s. On the other hand, the system acquires the best heat dissipation effect, and the minimum of thermal resis- tance is 0.019 W/℃.展开更多
This paper summarizes different kinds of heat sinks on the market for high power LED lamps. Analysis is made on the thermal model of LED, PCB and heat sink separately with a simplified mode provided. Two examples of s...This paper summarizes different kinds of heat sinks on the market for high power LED lamps. Analysis is made on the thermal model of LED, PCB and heat sink separately with a simplified mode provided. Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design.展开更多
基金Special Fund Project of Science and Technology Innovation of Dongli District(21090302)Research Projectof Applied Basic and Front Technologies of Tianjin(10JCZDJC15400)
文摘In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.
基金Key Scientific and Technological Research Projects of Henan Province(072102240027)Dr Foundation of Henan Polytechnic University(648602)Postgraduate Degree Thesis Innovation Foundation of Henan Polytechnic University(644005)
文摘Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.
文摘To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temperature of the LEDs decreases by 30oC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.
基金financially supported by the Shenzhen Science and Technology Program (JCYJ20200109105805902,JCYJ20220818095805012)the National Natural Science Foundation of China (22208221,22178221,42377487)+2 种基金the Scientific and Technological Plan of Guangdong Province (2019B090905005,2019B090911004)the Natural Science Foundation of Guangdong Province (2021A1515110751)the Guangdong Basic and Applied Basic Research Foundation (2022A1515110477,2021B1515120004)。
文摘Sluggish storage kinetics is considered as the main bottleneck of cathode materials for fast-charging aqueous zinc-ion batteries(AZIBs).In this report,we propose a novel in-situ self-etching strategy to unlock the Palm tree-like vanadium oxide/carbon nanofiber membrane(P-VO/C)as a robust freestanding electrode.Comprehensive investigations including the finite element simulation,in-situ X-ray diffraction,and in-situ electrochemical impedance spectroscopy disclosed it an electrochemically induced phase transformation mechanism from VO to layered Zn_(x)V_(2)O_5·nH_(2)O,as well as superior storage kinetics with ultrahigh pseudocapacitive contribution.As demonstrated,such electrode can remain a specific capacity of 285 mA h g^(-1)after 100 cycles at 1 A g^(-1),144.4 mA h g^(-1)after 1500 cycles at 30 A g^(-1),and even 97 mA h g^(-1)after 3000 cycles at 60 A g^(-1),respectively.Unexpectedly,an impressive power density of 78.9 kW kg^(-1)at the super-high current density of 100 A g^(-1)also can be achieved.Such design concept of in-situ self-etching free-standing electrode can provide a brand-new insight into extending the pseudocapacitive storage limit,so as to promote the development of high-power energy storage devices including but not limited to AZIBs.
文摘The high power light emitting diode （LED） array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat transfer and fluid mechanics, the calculation of the thermal resistance for the microchannel heat sink is obtained, and the thermal resis- tance is minimized. Finally the simulation with FLUENT software is developed to verify the theoretical analysis. Established analysis and simulation show that the width of the cooling channel is 0.1 mm, and the cooling water flow rate is 1 m/s. On the other hand, the system acquires the best heat dissipation effect, and the minimum of thermal resis- tance is 0.019 W/℃.
文摘This paper summarizes different kinds of heat sinks on the market for high power LED lamps. Analysis is made on the thermal model of LED, PCB and heat sink separately with a simplified mode provided. Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design.
