Infiltration behavior of sintering liquid on nuclei ores during low-titanium ore sintering process

Sinter strength is dependent not only on the self-intensity of the residual rude and bonding phase but also on the bonding degree between them. The infiltration behavior of sintering liquid on nuclei ores influences the bonding degree, which ultimately determines the sinter strength. Infiltration tests were conducted using micro-sinter equipment. The infiltration area index of original liquid（IAO）, infiltration volume index of secondary liquid（IVS）, and sinter body bonding strength（SBS） were proposed to study the melt infiltration behavior. The results show that the IVS first increases and then decreases with increasing TiO2 content in adhering fines, whereas the IAO exhibits the opposite behavior. Compared with the original liquid, the secondary liquid shows lower porosity, smaller pores, and more uniform distribution. The SBS increases first and then decreases with increasing IAO and TiO2 content, and reaches a maximum when the IAO and TiO2 contents are approximately 0.5 and 2.0wt%, respectively. The SBS first increases and then tends to be stable with increasing IVS. The TiO2 content is suggested to be controlled to approximately 2.0wt% in low-titanium ore sintering.

Reactive spontaneous infiltration of Al-activated TiO_2 by molten aluminum

The reactive spontaneous infiltration of Al-activated TiO2 (anatase) was investigated. Pure Al powder was blended with TiO2 for activation. They were compacted into the preform and then sealed within 6060 alloy mould. The activation and infiltration were carried out in 6060 alloy bath for 1 h and comparative sintering experiments were carried out in an argon protected environment under the same conditions of temperature and duration. X-ray diffraction analysis proved that the Al sealed environment was superior to the argon protection on activating the reaction between Al and TiO2. The blending ratio of TiO2 to Al and the temperature were found to play the most important role in infiltration by affecting infiltration and reaction kinetics. Three main types of microstructures were observed after infiltration: full infiltration, partial infiltration with the formation of cracks and no infiltration. The formation of these microstructures was explained on the basis of reaction kinetics and local volume changes due to the reactions. Ultimately, it is found that to obtain an overall good spontaneous infiltration, a TiO2 to Al blending ratio around 3:7 in volume and an infiltration temperature around 900 °C are the most suitable.

Research of Copper Foam Prepared by Forming-Knitting and Infiltration

Using forming-knitting technology and organic materials, copper foam with high porosity (>80%) and open-pore structure was successfully prepared. According to the method of immersion, the technical characteristics of metal paste performance and influence factors of sinter process were discussed. The pore morphology and compressibility of copper foam were detected simultaneously, and the structural property of copper foam prepared by the process of once-infiltrating was compared with the one of copper foam prepared by the process of twice-infiltrating. The results show that pH value of metal paste has a large influence on rheological properties of slurry. By twice-infiltrating process, the microstructure of copper foam was altered. In case of the porosity dropping indistinctly, the compression stress of copper foam platform was raised from 0.5 MPa to 1 Mpa which was of great significance to improve the energy absorption capacity of the material.

高压断路器用CuW触头材料研究进展

CuW合金已作为触头材料被广泛用作高压SF6断路器和气体绝缘组合电器中,其抗侵蚀性能决定着开关设备的使用寿命。CuW触头材料主要的制备工艺包括熔渗法和粉末烧结法,最新的研究进展发现熔渗CuW合金的关键点在于W骨架的连接强度,而液相烧结CuW合金的关键在于熔融Cu与W颗粒之间的润湿性,明确了两种工艺的研究方向;对基于铝热还原工艺制备CuW合金的研究进行概述,提出思路是进行前驱体的烧结,降低反应物的活化能,从而促进自蔓延反应的进行;同时总结了目前CuW合金的改性研究在于增强相的添加和变形加工,旨在对工业上技术改进提供指导,但如何更好地应用于工业上仍需要一定时间的探索;最后着眼于弧触头的整体研究,明确CuW和CrCu之间的结合强度是弧触头整体材料的关键因素,也对后续整体材料的改进与发展提供新的方向。

黏结剂喷射成形技术研究进展

黏结剂喷射成形是一种基于粉末床的增材制造技术,通过液态黏结剂的沉积以选择性地连接粉末颗粒,实现近净成形,最后通过烧结进行固结。该技术因为工艺简单、材料适应性广、成形效率高、批量化生产潜力大而受到关注。本文对黏结剂喷射成形的工艺流程进行了概述,总结了影响黏结剂喷射成形过程的因素。粉末特性、铺粉方式、黏结剂种类及其与粉床的相互作用是控制生坯密度、尺寸精度的关键。烧结及熔渗是主要的后处理方式,借助助烧剂、分步烧结工艺、超固相线液相烧结等方式可实现更高程度的致密化。黏结剂喷射成形已在铸造、医疗器械、3C行业等得到了广泛的应用,通过进一步优化黏结剂体系、全流程自动化设备和提升致密化及后处理技术可推动黏结剂喷射成形技术的大规模产业化。

钎焊材料预处理及烧结气氛对铁基粉末冶金零件烧结钎焊的影响

采用水雾化Ancorbraze 72(AB72)粉为钎焊料,对铁基粉末冶金材料进行烧结钎焊。通过钎焊料预处理和改变烧结气氛研究钎焊料润湿性及其在母体材料中的渗入深度。结果表明:随着钎焊料预处理温度的上升,钎焊料在母体表面残留物的最大直径明显减少,钎焊料在距离润湿面1000μm处的扩散范围逐渐降低。当预处理温度为800℃时,钎焊料残留物最少,距润湿面1000μm处扩散范围最小,预处理效果最好。当预处理温度为800℃,处理时间长度为2 h,处理气氛为75%N_(2)+25%H_(2)(体积分数)时,烧结钎焊后钎焊料表面残留较少,距润湿面1000μm处钎焊料的扩散范围最小。烧结钎焊时通入一定量的吸热性气氛可以明显改善钎焊料在基体中的渗入情况,当通入吸热性气氛流量为20 m^(3)·h^(-1)时,对润湿角和渗入深度的改善效果最好。

硼酸碳热还原-渗硅反应烧结制备碳化硼陶瓷复合材料

碳化硼性能优良,应用广泛,但制备成本较高。为了从源头解决碳化硼陶瓷材料制备成本高的问题,本工作直接以碳热还原法合成的碳化硼-C复合粉体为原料,无需进行破碎提纯,通过渗硅反应烧结制备碳化硼复合材料,所得材料性能与以市售碳化硼粉体为原料制备的材料性能相当,有效降低了其制备成本。主要研究了原料碳硼摩尔比对合成粉体以及碳化硼复合材料物相、显微组织和性能的影响,并探讨了碳化硼陶瓷复合材料的强韧化机理。结果表明:随着碳硼摩尔比增加,合成粉体中碳化硼粉体的碳硼原子比增加,且合成粉体中游离C含量增加;当碳硼摩尔比为2.01时,游离C包覆在碳化硼粉体颗粒表面。复合材料相组成均为B_(12)(C,Si,B)_(3)、SiC和Si,随着碳硼摩尔比的增加,复合材料中碳化硼和游离Si含量降低,SiC含量、大尺寸SiC区域的尺寸、大尺寸SiC区域和纳米SiC颗粒的数量均增加。大尺寸SiC区域的产生会降低材料的强度和韧性,而SiC纳米颗粒的形成有利于提高材料的强度和韧性。当碳硼摩尔比为1.35时,复合材料的抗弯强度和断裂韧性最高,分别为338 MPa和4.06 MPa·m^(1/2)。

Microstructures,Strength Characteristics and Wear Behavior of the Fe-based P/M Composites after Sintering or Infiltration with Cu–Sn Alloy

Some properties of the Fe-based P/M composites sintered and reinforced by infiltration with Cu-Sn alloy were described.It is shown that the hardness of the sintered material is 2.5 times lower,tensile strength is 1.7 times lower and the wear resistance is 2.5-3.3 times lower in comparison with those of the infiltrated material.The presence of pores on the friction surface of the sintered material affects the features of the wear process.Due to the specific morphology of copper in the infiltrated material,the phenomenon of selective mass transfer is observed and worn surfaces have a spongy-capillary texture.

Electrical Conductivity of Spark Plasma Sintered W-Cu and Mo-Cu Composites for Electrical Contact Applications

Tungsten copper and molybdenum copper composites, with weight percent copper in the range of 20% - 40%, have been produced using the spark plasma sintering (SPS) technique. Other specimens having similar compositions were also developed using the conventional techniques of Liquid Phase Sintering (LPS) and Infiltration. Electrical conductivity measurements showed that the specimens produced by the SPS process had substantially higher levels of electrical conductivity than those produced by the other methods. Relative density measurements showed that the SPS specimens achieved very high densification, with relative densities in the range of 99.1% - 100%. On the other hand, the specimens produced by LPS and infiltration had relative densities in the range of 88% - 92% and 96% - 98% respectively. The superior conductivity of the SPS specimens has been attributed to the virtually full densification achieved by the process. The effect of porosity on electrical conductivity has been discussed and three standard models were assessed using results from porous sintered skeletons of pure tungsten and pure molybdenum.

基于无压浸渗工艺的铁-铌酸锂功能梯度材料制备

功能梯度材料(FGM)是一种新型的功能复合材料,通过控制其厚度方向上组分体积含量、化学构成,使材料的宏观特性呈现连续梯度变化,可解决两种不同材料之间的界面突变问题。本文提出一种结合粉末叠层、无压浸渗与真空热压烧结的方法,制备了组分分布连续变化的铁-铌酸锂功能梯度材料。该方法通过分层控制材料体积分布,利用高温金属自重以及黏结剂蒸发所留空隙,使液态金属沿空隙从上到下浸渗,达到消除层间界面的效果,通过真空热压烧结的方法使其达到致密化,最终得到材料体积分布可控的连续功能梯度材料。实验结果表明:经过烧结温度900℃、保温时间120 min的无压浸渗和烧结温度800℃、保温时间120 min并加压35 MPa的真空热压烧结后,所制备的铁-铌酸锂功能梯度材料体积分数沿厚度方向呈线性连续分布。

变速器换挡固定块烧结钎焊失效分析

采用宏观观察、金相检验、力学性能试验、扫描电子显微镜分析和能谱分析等方法,对某平台烧结钎焊换挡固定块钎缝失效原因进行了分析。结果表明,由于烧结工艺和母材的影响,生产过程中存在烧结后钎料流失到母材表面,热处理后钎料过多熔渗进入母材,从而导致钎缝中存在的钎料不足;同时存在热处理后的变形现象,两者均未形成钎缝圆角,钎缝中冶金反应不足,接头有效承载面积小,强度较低。建议严格控制烧结钎焊零件生产过程,改善钎焊工艺,提高成品率。

纯碳坯渗硅制备反应烧结碳化硅的研究

以石油焦粉制备纯碳素坯高温渗硅的方法制备了反应烧结碳化硅陶瓷。研究表明 ,素坯的碳含量 (或孔隙率 )对材料的最终物相组成有决定性的影响 ;合成 Si C时的热效应以及反应过程中的体积效应 ,是影响石油焦坯体烧结的根本原因 ;烧结时间短使晶粒细化 ,是材料强度提高的主要原因。 90 %理论碳含量的素坯渗硅后 ,所得材料的密度为 3.0 8～ 3.12 g/ cm3,强度为 (5 5 0± 30 )

两种铜基触头材料的电弧侵蚀性能研究

电接触材料在工作过程中会受到机械磨损、环境腐蚀及电弧侵蚀,其中,电弧侵蚀对电接触材料影响最大,它是影响接触材料的电寿命和可靠性的最重要因素。笔者对采用熔渗法制备的CuCr50与电弧法制备的CuCr45电接触材料分别进行DC 50 V,20、30、40、50 A的电接触试验,并通过扫描电镜观察材料在电弧侵蚀后的形貌,对这两种材料在直流、阻性负载条件下的电弧侵蚀特征进行对比研究。结果表明,CuCr45与CurCr50在DC 50 V,20、30、40、50 A条件下,材料都由阳极向阴极转移;之后归纳出电弧侵蚀后两种材料的表面形貌特征,最后分析了两种材料的燃弧能量与熔焊力。

选择性激光烧结复合粉末法制造合金零件

通过混合Fe,Ni,C单质和粘接剂粉末配制了选择性激光烧结(SLS)用复合粉末,并利用间接SLS方法制备了复合粉末毛坯.经过脱脂、高温烧结和渗铜处理,制造了致密的渗铜Fe-Ni-C合金材料.对零件毛坯的成型与后处理工艺及合金的微观组织和机械性能进行了研究.结果表明:高温烧结中Ni和C能够通过固态扩散固溶到-γFe中,且合金元素分布均匀;合金经900℃固溶并在330℃等温处理1 h后,室温下由下贝氏体组织、沉淀析出的-αCu和Fe-Ni构成;合金材料的极限拉伸强度超过350 MPa,延伸率小于4%.

碳含量对反应烧结SiC/B_4C力学性能的影响(英文)

采用渗硅反应烧结工艺制备了SiC/B4C复合材料,并研究了碳含量对复合材料的力学性能及微观结构的影响。结果表明,SiC/B4C复合材料的力学性能(硬度、抗弯强度、韧性)随着碳含量的增加呈先增强后减弱的趋势。在碳含量为10vol%的条件下,复合材料的综合性能最佳,其硬度、抗弯强度和韧性分别为19.63 Gpa、358 MPa和3.96 MPa?m1/2。此外,当碳含量不足10vol%,复合材料的组织随碳含量增加均匀性提高;当碳含量超过10vol%,显微组织均匀性变差,并且添加碳粉后,复合材料由沿晶、穿晶混合断裂向穿晶断裂转变,最终导致SiC/B4C复合材料力学性能的改变。

熔渗和液相法烧结Mo-Cu合金的组织和性能

研究熔渗和液相烧结法制得Mo-Cu合金的显微组织、电导率、致密度、热导率。结果表明,Mo-Cu合金组织两相分布均匀,钼颗粒之间相互连接。球磨过程中引入杂质Fe,形成新相Fe2Mo3,导致导热系数降低,球磨处理后的烧结试样密度都很高。随成型压力增大,合金径向收缩率减小,相对密度、硬度和电导率几乎不变。

PDC材料烧结过程中钴在金刚石层中的扩散熔渗迁移机制

讨论了PDC材料烧结过程中钴在金刚石层中的固相扩散、钴液熔渗、两次钴高浓度峰的"波浪"式迁移过程中的运动规律及其作用机制,并根据实验观测的数据进行了有关计算。结果表明:在5.8GPa、1300℃条件下,钴的扩散系数D≈1.6×10-7cm2/s,是一般常压及相同温度条件下钴固相扩散系数(3×10-10cm2/s)和相同压力条件下钴的液相扩散系数(5×10-5cm2/s)的中间值;对于粒度W≥10μm的金刚石烧结体系,钴液熔渗作用时间非常短暂,略大于0.5s,而对于W≤1μm的超细金刚石烧结体系而言,钴熔渗作用时间为28s,比粒度W≥10μm的金刚石烧结要长得多;两次钴高浓度峰的迁移速度分别约为50μm/s和100μm/s。

铸造烧结VC-Fe基表面复合材料

利用铸造烧结新技术 ,在铸件表面原位生成 1层厚为 3～ 4mm由大量VC颗粒和Cr的碳化物组成的复合材料 ;通过对复合材料层组织结构的研究和热力学分析 ,对铸造烧结机理作了初步研究 ;指出铸造烧结与铸渗原理是不同的。

熔渗烧结Ti_3SiC_2陶瓷材料的摩擦磨损性能研究

采用熔渗烧结技术制备Ti3SiC2陶瓷材料,利用XRD-7000型X射线衍射仪、INSTRON-1195型电子万能试验机、HST-100型销-盘式摩擦磨损试验机和JSM-6700F型扫描电子显微镜对Ti3SiC2陶瓷烧结试样的相成分、抗弯强度、带电干摩擦条件下的摩擦磨损性能进行了试验分析.结果表明:随着烧结试样中Ti3SiC2含量的增加,材料的抗弯强度增大,摩擦系数与磨损率降低,材料表现出良好的摩擦学性能,磨损机制以黏着磨损为主.当Ti3SiC2质量分数达到76%左右时,材料抗弯强度开始明显增加;摩擦系数与磨损率明显减小.

B_4C/Al-Si复合材料的制备

采用真空无压烧结法,制备了多孔碳化硼(B4C)骨架,致密度为46.8%。然后采用真空无压浸渗法,以A356铝合金为渗体,与B4C骨架进行复合。制备了B4C/Al-Si复合材料,致密度达99%以上,抗压强度为453MPa,弯曲强度为294MPa。微观结构分析结果表明,制备的复合材料组织致密,形成的Al、Si、Al3BC相分布均匀,界面复合良好。Al主要分布在B4C颗粒间,Si相主要分布在B4C和Al的界面处,使B4C和Al紧密结合,且试样的表面和心部均有分布均匀的Al存在。制备的B4C/Al-Si复合材料中B4C形成连续的骨架结构,而孔隙处的金属相则起到增韧、增强的作用。