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Improvement of Environment Stability of an i-Line Chemically Amplified Photoresist
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作者 Haibo Li Qian Yang +3 位作者 Jia Sun Jie Li Meng Guo Bing Li 《Journal of Microelectronic Manufacturing》 2021年第2期1-7,共7页
An i-Line chemically amplified(ICA)thick film positive resist is reported in this paper.The impact of process conditions on photoresist performance was investigated.Pre-apply bake temperature and post exposure bake te... An i-Line chemically amplified(ICA)thick film positive resist is reported in this paper.The impact of process conditions on photoresist performance was investigated.Pre-apply bake temperature and post exposure bake temperature affect acid diffusion and deblocking reactions,thus playing an integral role in defining the resist profile.Both pre-apply bake delay and post exposure delay(PED)affect critical dimension(CD)variation,but PED is more sensitive to contact with airborne contaminants.Different polymers and different photo-acid generators(PAG)are also illustrated in this work.By optimizing the structure and concentration of key components,an ICA resist with good environment stability and excellent lithographic performance was demonstrated. 展开更多
关键词 Chemical amplification thick film i-line environment stability Poly(p-hydroxyl styrene) PAB PEB
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I-Line光刻胶材料的研究进展 被引量:11
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作者 郑金红 《影像科学与光化学》 CAS CSCD 北大核心 2012年第2期81-90,共10页
酚醛树脂-重氮萘醌正型光刻胶由于其优异的光刻性能,在g-line(436nm)、i-line(365nm)光刻中被广泛使用.g-line光刻胶胶、i-line光刻胶,两者虽然都是用线型酚醛树脂做成膜树脂,重氮萘醌型酯化物作感光剂,但当曝光波长从g-line发展到i-lin... 酚醛树脂-重氮萘醌正型光刻胶由于其优异的光刻性能,在g-line(436nm)、i-line(365nm)光刻中被广泛使用.g-line光刻胶胶、i-line光刻胶,两者虽然都是用线型酚醛树脂做成膜树脂,重氮萘醌型酯化物作感光剂,但当曝光波长从g-line发展到i-line时,为适应对应的曝光波长以及对高分辨率的追求,酚醛树脂及感光剂的微观结构均有变化.在i-line光刻胶中,酚醛树脂的邻-邻′相连程度高,感光剂酯化度高,重氮萘醌基团间的间距远.溶解促进剂是i-line光刻胶的一个重要组分,本文对其也进行了介绍. 展开更多
关键词 i-line 光刻胶 酚醛树脂 感光剂 溶解促进剂
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高分辨率I-line正性光刻胶的制备及应用性能研究 被引量:6
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作者 曹昕 《广州化学》 CAS 2015年第2期1-6,共6页
利用两种不同重均分子量的改性酚醛树脂(PF)与一种三个酯化度的四羟基二苯甲酮―重氮萘醌磺酸酯光敏剂(PAC)按比例配制,加入适量助剂优化感光性能,制备出一种应用于电子触屏加工领域的I-line正性光刻胶,其具有刻蚀精度高、工艺性能优良... 利用两种不同重均分子量的改性酚醛树脂(PF)与一种三个酯化度的四羟基二苯甲酮―重氮萘醌磺酸酯光敏剂(PAC)按比例配制,加入适量助剂优化感光性能,制备出一种应用于电子触屏加工领域的I-line正性光刻胶,其具有刻蚀精度高、工艺性能优良、单位成本较低等优势特点。 展开更多
关键词 酚醛树脂 重氮萘醌磺酸酯 光刻胶
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A Transparent Photoresist Made of Titanium Dioxide Nanoparticle-Embedded Acrylic Resin with a Tunable Refractive Index for UV-Imprint Lithography
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作者 Yinglu Liu Dan Wang +7 位作者 Changlin Liu Qianqian Hao Jian Li Jie-Xin Wang Xiuyun Chen Peng Zhong Xibin Shao Jian-Feng Chen 《Engineering》 SCIE EI CAS CSCD 2024年第6期96-104,共9页
Transparent photoresists with a high refractive index(RI)and high transmittance in visible wavelengths have promising functionalities in optical fields.This work reports a kind of tunable optical material composed of ... Transparent photoresists with a high refractive index(RI)and high transmittance in visible wavelengths have promising functionalities in optical fields.This work reports a kind of tunable optical material composed of titanium dioxide nanoparticles embedded in acrylic resin with a high RI for ultraviolet(UV)-imprint lithography.The hybrid film exhibits a tunable RI of up to 1.67(589 nm)after being cured by UV light,while maintaining both a high transparency of over 98%in the visible light range and a low haze of less than 0.05%.The precision machining of optical microstructures can be imprinted easily and efficiently using the hybrid resin,which acts as a light guide plate(LGP)to guide the light from the side to the top in order to conserve the energy of the display device.These preliminary studies based on both laboratory and commercial experiments pave the way for exploiting the unparalleled optical properties of nanocomposite resins and promoting their industrial application. 展开更多
关键词 photoresist Tunable refractive index Hanson solubility Ultraviolet imprint Organic-inorganic composites
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Synthesis and Properties of UV-curable Hyperbranched Polyurethane and Its Application in the Negative-type Photoresist 被引量:3
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作者 刘敬成 LIN Licheng +3 位作者 JIA Xiuli LIU Ren ZHANG Shengwen 刘晓亚 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2014年第1期208-212,共5页
UV-curable hyperbranched polyurethane (UV-HBPU) containing carboxyl groups was synthesized from isophorone diisocyanate (IPDI), diethanolamine (DEOA), polyethylene glycol (PEG-400), hydroxyethyl acrylate (HEA... UV-curable hyperbranched polyurethane (UV-HBPU) containing carboxyl groups was synthesized from isophorone diisocyanate (IPDI), diethanolamine (DEOA), polyethylene glycol (PEG-400), hydroxyethyl acrylate (HEA), and 2,2-his (hydroxymethyl) propionic acid (DMPA). The UV-HBPU was used as a negative-type photoresist for a printed circuit board (PCB). Fourier-transform infrared spectroscopy (FTIR) and proton nuclear magnetic resonance (1HNMR) spectroscopy of UV-HBPUs indicated that the synthesis was successful. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) showed that the thermal stability of the UV-HBPUs decreased as the HEA content increased. The polymer exhibited excellent photoresist properties, and the resolution of circuits based on this negative-type photoresist reached 10 μm. 展开更多
关键词 UV-CURABLE hyperbranched polyurethane photoresist
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Simulations of Ion Behaviors in a Photoresist Trench During Plasma Etching Driven by a Radio-Frequency Source 被引量:1
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作者 戴忠玲 岳光 王友年 《Plasma Science and Technology》 SCIE EI CAS CSCD 2012年第3期240-244,共5页
Ion's behavior plays an important role in plasma etching processes and is determined by the local electric potential in the etched trenches. In this study, with the trench powered by a radio frequency (rf) source, ... Ion's behavior plays an important role in plasma etching processes and is determined by the local electric potential in the etched trenches. In this study, with the trench powered by a radio frequency (rf) source, the Laplace equation is solved to obtain the electric potential. The ion trajectories and the ion energy distribution (IED) at the bottom of the trench are obtained self-consistently by tracking the ions in the trench. The results show that the aspect ratio of depth- to-width of the photoresist trench and the voltage amplitude of the rf source applied to the electrode are important parameters. The larger the aspect ratio and the smaller the amplitude are, the more ions hit the sidewalls, which results in a notching phenomenon. Meanwhile, there are a higher high-energy peak and a lower low-energy peak in the IED with the increase in aspect ratio. 展开更多
关键词 ion behavior plasma sheath Monte-Carlo rf photoresist trench
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Acidic Polyester Imides as Thermally Stable Binder Polymers for Negative-Tone Black Photoresist 被引量:1
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作者 Genggongwo Shi Kyeongha Baek +1 位作者 Jun Bae Lee Soon Park 《Materials Sciences and Applications》 2020年第4期234-244,共11页
Polyimides are well-known for their high chemical inertness and thermal stability. However, it is usually challenging to synthesize UV-curable polyimides since the imidization reaction requires such harsh conditions t... Polyimides are well-known for their high chemical inertness and thermal stability. However, it is usually challenging to synthesize UV-curable polyimides since the imidization reaction requires such harsh conditions that acrylate type double bonds cannot withstand. In this work, synthetic methods are developed to obtain polyester-imide type binder polymers with high thermal stability, high compatibility with the other components of the black photoresist, and fine photolithographic patterning property for the negative-tone black photoresist. The syntheses of diimide-diacid or diimide-diol intermediates for the polyesterification with dianhydride gave polyester imides which meets this requirement. The photolithographic tests have shown that the patterning of the micron-sized PDL of the organic light emitting diode (OLED) panel could be obtained. This work will interest the researchers working on the design and optimization of thermally stable binder polymers. 展开更多
关键词 POLYESTER IMIDE One-Pot Solution Polymerization BLACK photoresist PHOTOLITHOGRAPHY
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Latest developments in EUV photoresist evaluation capability at Shanghai Synchrotron Radiation Facility 被引量:1
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作者 Zhen‑Jiang Li Cheng‑Hang Qi +8 位作者 Bei‑Ning Li Shu‑Min Yang Jun Zhao Zhi‑Di Lei Shi‑Jie Zhu Hao Shi Lu Wang Yan‑Qing Wu Ren‑Zhong Tai 《Nuclear Science and Techniques》 SCIE EI CAS CSCD 2023年第12期206-215,共10页
Evaluating the comprehensive characteristics of extreme ultraviolet(EUV)photoresists is crucial for their application in EUV lithography,a key process in modern technology.This paper highlights the capabilities of the... Evaluating the comprehensive characteristics of extreme ultraviolet(EUV)photoresists is crucial for their application in EUV lithography,a key process in modern technology.This paper highlights the capabilities of the Shanghai Synchrotron Radiation Facility(SSRF)08U1B beamline in advancing this field.Specifically,it demonstrates how this beamline can create fringe patterns with a 15-nm half-pitch on a resist using synchrotron-based EUV lithography.This achievement is vital for evaluating EUV photoresists at the advanced 5-nm node.We provide a detailed introduction to the methods and experimental setup used at the SSRF 08U1B beamline to assess an EUV photoresist.A significant part of this research involved the fabrication of high-resolution hydrogen silsesquioxane mask gratings.These gratings,with an aspect ratio of approximately 3,were created using electron beam lithography on an innovative mask framework.This framework was crucial in eliminating the impact of zeroth-order light on interference patterns.The proposed framework propose offers a new approach to mask fabrication,particularly beneficial for achromatic Talbot lithography and multicoherent-beam interference applications. 展开更多
关键词 Extreme ultraviolet photoresist Interference lithography HIGH-RESOLUTION Electron beam lithography·Hydrogen silsesquioxane GRATING
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Recent Advances in Organic-inorganic Hybrid Photoresists 被引量:2
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作者 Zhihao Wang Xindi Yao +8 位作者 Huiwen An Yake Wang Jinping Chen Shuangqing Wang Xudong Guo Tianjun Yu Yi Zeng Guoqiang Yang Yi Li 《Journal of Microelectronic Manufacturing》 2021年第1期1-15,共15页
Photoresists are radiation-sensitive materials used for forming patterns to build up IC devices.To date,most photoresists have been based on organic polymers,which have been dominating the semiconductor industries ove... Photoresists are radiation-sensitive materials used for forming patterns to build up IC devices.To date,most photoresists have been based on organic polymers,which have been dominating the semiconductor industries over the past few decades.It is obvious that extreme ultraviolet(EUV)lithography has become the next-generation lithography technology.The development of comprehensive performance EUV resist is one of the most critical issues.However,organic polymeric photoresists are difficult to meet the harsh requirements of EUV lithography.Pure inorganic photoresists such as metal salts,hydrogen silsesquioxane(HSQ)are expected for EUV lithography due to their high resistance and high resolution.But the low sensitivity makes them not suitable for high volume manufacturing(HVM).Organic-inorganic hybrid photoresists,containing both organic and inorganic components,are regarded as one of the most promising EUV resists.They combine both merits of organic and inorganic materials and have significant advantages in machinability,etching resistance,EUV absorption,and chemical/thermal stability.Organic-inorganic hybrid photoresists are considered as ideal materials for realizing industrialgrade patterns below 10 nm.This review mainly focuses on the development of organic-inorganic hybrid photoresists over the past decade. 展开更多
关键词 Organic-inorganic hybrid photoresist EUV lithography NANOCLUSTER NANOPARTICLE organometallic complex
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COPOLYMERS OF CHLOROETHYL METHACRYLATE, GLYCIDYL METHACRYLATE, AND METHYL METHACRYLATE AS SYNCHROTRON RADIATION x-RAY PHOTORESISTS
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作者 方月娥 陈大鹏 +5 位作者 刘刚 王冰 史天义 胡一贯 田扬超 阚娅 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 1998年第4期304-309,共6页
The copolymers of chloroethyl methacrylate (CMA), glycidyl methacrylate (GMA), and methyl methacrylate (MMA) were synthesized in benzene solution. Their breadths of the molecular weight distributions are 2.1 and 2.3,... The copolymers of chloroethyl methacrylate (CMA), glycidyl methacrylate (GMA), and methyl methacrylate (MMA) were synthesized in benzene solution. Their breadths of the molecular weight distributions are 2.1 and 2.3, respectively. The thermal stability of P(GMA-CMA) is superior to that of P(CMA-MMA). The resolutions of P(CMA-MMA) and P(GMA-CMA) photoresists were found to be 0.1-0.16 mu m and 0.17-0.2 mu m, respectively. (Author abstract) 9 Refs. 展开更多
关键词 copolymer X-ray photoresists SUBMICRON resolution
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Optimum design of photoresist thickness for 90-nm critical dimension based on ArF laser lithography
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作者 陈德良 曹益平 +2 位作者 黄振芬 卢熙 翟爱平 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第8期216-221,共6页
In this work, a 90-nm critical dimension (CD) technological process in an ArF laser lithography system is simulated, and the swing curves of the CD linewidth changing with photoresist thickness are obtained in the a... In this work, a 90-nm critical dimension (CD) technological process in an ArF laser lithography system is simulated, and the swing curves of the CD linewidth changing with photoresist thickness are obtained in the absence and presence of bottom antireflection coating (BARC). By analysing the simulation result, it can be found that in the absence of BARC the CD swing curve effect is much bigger than that in the presence of BARC. So, the BARC should be needed for the 90-nm CD manufacture. The optimum resist thickness for 90-nm CD in the presence of BARC is obtained, and the optimizing process in this work can be used for reference in practice. 展开更多
关键词 LITHOGRAPHY optimization photoresist thichness critical dimension swing curve
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Fabrication of Diffraction-limited Full Aperture Microlens Array by Melting Photoresist
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作者 高应俊 《High Technology Letters》 EI CAS 1997年第1期5-9,共5页
A further study on the fabrication of diffraction--limited full aperture microlens array by melting photoresist is described. The formation of aspherical surface is considered. The parameters for controlling the proce... A further study on the fabrication of diffraction--limited full aperture microlens array by melting photoresist is described. The formation of aspherical surface is considered. The parameters for controlling the process of lens production, the height of original photoresist cylinders and the angle of contact between the melted photoresist and the substrate, are discussed in detail. The diffraction limited full--aperture microlens arrays have been obtained,and some measurement results are shown in the paper. A method of controlling the formation of quality microlens array in real time is suggested. 展开更多
关键词 MICROLENS array MELTING photoresist Diffraction-limited
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Epoxy Methacrylate Resin as Binder Polymer for Black Negative-Tone Photoresists
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作者 Genggongwo Shi Kyeongha Baek +3 位作者 Seon Hong Ahn Jun Bae Jeseob Kim Lee Soon Park 《Materials Sciences and Applications》 2020年第5期285-295,共11页
Epoxy acrylate (EA) resin, which originates from epoxides, has long been served as a photocurable coating and adhesive material owing to its double bonds. Specifically, alkaline-developable EA resins can be used as a ... Epoxy acrylate (EA) resin, which originates from epoxides, has long been served as a photocurable coating and adhesive material owing to its double bonds. Specifically, alkaline-developable EA resins can be used as a binder polymer in negative-tone photoresists. In this work, we synthesized a series of acidic polyester-type epoxy methacrylate resins, characterized the intermediates and products, and tested their performance as a binder polymer for the photolithographic micro-patterning of the pixel-defining layer on organic light-emitting diodes in comparison to a widely used commercial binder polymer. Copolymer-type binder polymer BP-2-2 was produced excellent patterning with no residue due to its high compatibility with the black mill base. 展开更多
关键词 EPOXY Methacrylate Resin Negative-Tone photoresist BINDER POLYMER
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基于论文和专利分析的光刻胶技术发展态势研究
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作者 芮雯奕 王薇薇 《化工新型材料》 CAS CSCD 北大核心 2024年第10期287-292,共6页
作为半导体芯片、显示屏等制造工艺中重要的上游必备材料,光刻胶技术发展至关重要。基于文献计量研究方法探究光刻胶技术的现状及趋势发现,2003—2012年为日本重点企业光刻胶技术相关专利的申请高峰期,2013年后开始放缓,2017年以后下降... 作为半导体芯片、显示屏等制造工艺中重要的上游必备材料,光刻胶技术发展至关重要。基于文献计量研究方法探究光刻胶技术的现状及趋势发现,2003—2012年为日本重点企业光刻胶技术相关专利的申请高峰期,2013年后开始放缓,2017年以后下降明显。从专利技术分析看,日本重点企业近10年在光敏树脂组成与光阻层、薄膜材料、可溶性树脂与含碱材料、正性光刻胶以及复合物等方面持续布局。近5年则在光刻胶图案、掩膜版、固体滤光片和剥离剂等方面加强了布局。从论文分析看,基础技术研究主要围绕光刻胶新型材料、性能提升、加工技术创新以及高精度制造等方面。 展开更多
关键词 光刻胶 文献计量 技术态势
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具有双重显影特性的多用途单分子树脂化学放大光刻胶
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作者 苑晓冬 陈金平 +2 位作者 于天君 曾毅 李嫕 《应用化学》 CAS CSCD 北大核心 2024年第7期1024-1034,共11页
化学放大光刻胶(CARs)由于其在分辨率和灵敏度方面的出色性能而广泛应用于光刻领域。本文报道了一种基于单分子树脂的多用途化学放大光刻胶SP8-PAG_(AN),可同时用于365 nm光刻和电子束光刻。该体系主要由螺二芴结构的单分子树脂主体材料... 化学放大光刻胶(CARs)由于其在分辨率和灵敏度方面的出色性能而广泛应用于光刻领域。本文报道了一种基于单分子树脂的多用途化学放大光刻胶SP8-PAG_(AN),可同时用于365 nm光刻和电子束光刻。该体系主要由螺二芴结构的单分子树脂主体材料(SP-8Boc)和N-(三氟甲基磺酸酯基)蒽-1,9-二羧酰亚胺非离子型光致产酸剂(PAGAn)组成。测试了产酸剂PAGAN在365 nm紫外光激发下的光致产酸效率ΦH+为23%。研究了SP8-PAG_(AN)光刻胶的365 nm光刻和电子束光刻性能。365 nm光刻中,分别利用四甲基氢氧化胺(TMAH,质量分数2.38%)水溶液和正己烷作为显影液,可实现1μm正性和负性光刻图案。电子束光刻中,可实现50 nm Line/Space(L/S)的正性密集线条图案(曝光剂量110μC/cm^(2)),32 nm L/S的负性密集线条图案(曝光剂量40μC/cm^(2))以及19 nm L/3S负性半密集线条图案(曝光剂量96μC/cm^(2))。本研究工作提供了一种具有双重显影特性的多用途单分子树脂化学放大光刻胶的新范例。 展开更多
关键词 化学放大光刻胶 双重显影 单分子树脂 365 nm光刻 电子束光刻
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新型锑氧簇光刻胶的性能与机理研究
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作者 司友明 郑凌峰 +2 位作者 陈鹏忠 樊江莉 彭孝军 《化工学报》 EI CSCD 北大核心 2024年第4期1705-1717,共13页
随着半导体行业集成度越来越高,对光刻材料提出了更高的要求。近年来,金属氧簇光刻胶由于尺寸小、结构设计灵活,得到了广泛的研究。目前锑基金属光刻胶仅局限于含锑配合物。开发出新型锑氧簇光刻胶,通过对比金属有机组装Sb_(4)O-1与自组... 随着半导体行业集成度越来越高,对光刻材料提出了更高的要求。近年来,金属氧簇光刻胶由于尺寸小、结构设计灵活,得到了广泛的研究。目前锑基金属光刻胶仅局限于含锑配合物。开发出新型锑氧簇光刻胶,通过对比金属有机组装Sb_(4)O-1与自组装Sb_(4)O-2的溶解度差异说明自组装策略优势。原子力显微镜证实Sb_(4)O-2光刻胶可形成光滑薄膜,并获得低粗糙度值(均方根粗糙度<0.3 nm)。电子束光刻(EBL)证明Sb_(4)O-2光刻胶优异的图案化能力(线宽<50 nm),理论计算支持X射线光电子能谱(XPS)分析的新型自组装Sb_(4)O-2“配体解离”机制。 展开更多
关键词 锑氧簇 自组装 光刻胶 理论计算 电子束光刻 成像 溶解性 纳米材料
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基于光刻胶修正技术的石英锥形侧壁刻蚀工艺研究
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作者 刘丹 乌李瑛 +4 位作者 沈贇靓 张文昊 刘民 权雪玲 程秀兰 《半导体光电》 CAS 北大核心 2024年第4期606-611,共6页
基于光刻胶修正技术,采用两步刻蚀法对石英锥形侧壁的刻蚀工艺进行了研究。首先利用Ar,O_(2),CF_(4)气体对光刻胶刻蚀,将光刻胶的垂直侧壁修改为锥形侧壁。然后以此为掩膜实现光刻胶倾斜侧壁向石英材料的转移。两步刻蚀在同一个刻蚀腔... 基于光刻胶修正技术,采用两步刻蚀法对石英锥形侧壁的刻蚀工艺进行了研究。首先利用Ar,O_(2),CF_(4)气体对光刻胶刻蚀,将光刻胶的垂直侧壁修改为锥形侧壁。然后以此为掩膜实现光刻胶倾斜侧壁向石英材料的转移。两步刻蚀在同一个刻蚀腔室内完成。详细研究了光刻胶修正工艺中刻蚀气体流量、刻蚀功率、温度以及刻蚀时间等工艺参数对刻蚀速率、选择比以及刻蚀形貌的影响。通过综合优化工艺制备出刻蚀面光滑、倾斜角度为60°的石英刻蚀形貌。该工作为氧化硅以及其他材料的倾斜侧壁刻蚀工作提供了有力的参考。 展开更多
关键词 石英 光刻胶修正 反应离子刻蚀 倾斜侧壁
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光刻胶废剥离液中分离回收水和有机溶剂研究进展
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作者 于成钢 李罡峰 +5 位作者 傅瑞德 郭依亮 吴晗松 从海峰 李鑫钢 渠娅娟 《化学工业与工程》 CAS CSCD 北大核心 2024年第2期141-147,共7页
光刻胶废剥离液中含有大量的水和有机溶剂,其中包含大量有回收价值的成分。从光刻胶废剥离液中回收水和有机溶剂可以减少对自然界的污染,实现资源化利用。综述了国内外几种从光刻胶废剥离液中回收水和有机溶剂常见分离方法及分离装置,... 光刻胶废剥离液中含有大量的水和有机溶剂,其中包含大量有回收价值的成分。从光刻胶废剥离液中回收水和有机溶剂可以减少对自然界的污染,实现资源化利用。综述了国内外几种从光刻胶废剥离液中回收水和有机溶剂常见分离方法及分离装置,并对不同情况下所产生效果进行分析比较。希望能为我国电子行业中光刻胶废剥离液的资源化处理提供借鉴。 展开更多
关键词 光刻胶废剥离液 有机溶剂 分离回收
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基于SF_(6)/Ar的电感耦合等离子体干法刻蚀β-Ga_(2)O_(3)薄膜
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作者 曾祥余 马奎 杨发顺 《半导体技术》 CAS 北大核心 2024年第7期624-628,共5页
使用SF_(6)/Ar混合气体作为刻蚀气体,采用电感耦合等离子体(ICP)刻蚀方法,研究了不同激励功率和偏置功率对Ga_(2)O_(3)薄膜刻蚀速率的影响以及不同刻蚀时间对表面粗糙度的影响,并观察了光刻胶的损伤情况以调整刻蚀工艺参数。实验结果表... 使用SF_(6)/Ar混合气体作为刻蚀气体,采用电感耦合等离子体(ICP)刻蚀方法,研究了不同激励功率和偏置功率对Ga_(2)O_(3)薄膜刻蚀速率的影响以及不同刻蚀时间对表面粗糙度的影响,并观察了光刻胶的损伤情况以调整刻蚀工艺参数。实验结果表明,适度地增大激励功率和偏置功率可以提高刻蚀速率;合适的刻蚀时间可以在得到低粗糙度表面的同时不会过度损伤光刻胶掩膜。通过优化工艺参数,在激励功率为600 W、偏置功率为150 W、刻蚀时间为17 min下,可得到30 nm/min的Ga_(2)O_(3)薄膜刻蚀速率,刻蚀表面的垂直度高、粗糙度低,同时光刻胶掩膜形貌完好。 展开更多
关键词 电感耦合等离子体(ICP)刻蚀 Ga_(2)O_(3)薄膜 刻蚀速率 光刻胶掩膜 低粗糙度表面
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Novel One-component Positive-tone Chemically Amplified I-Line Molecular Glass Photoresist Based on Tannic Acid 被引量:3
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作者 WEI Qi WANG Liyuan 《Chemical Research in Chinese Universities》 SCIE CAS CSCD 2015年第4期585-589,共5页
Molecular glass resist has been considered as one of the best choices for a new generation of lithography. In this work, a new type of photoaetive compound was obtained by the esterification of tannic acid with 2-diaz... Molecular glass resist has been considered as one of the best choices for a new generation of lithography. In this work, a new type of photoaetive compound was obtained by the esterification of tannic acid with 2-diazo-1- naphthoquinone-4-sulfonyl chloride(2,1,4-DNQ-Cl) and ditertbutyl dicarbonate. The new obtained compound pos- sessed both a photosensitive group of diazonaphthoquinone sulfonate(2,1,4-DNQ) and a group of acidolytic protection. Upon the irradiation of the compound under 365 nm light, the former group was photolyzed and converted into indene carboxylic acid along with a small amount of sulfonic acid, which could lead to the deprotection of the latter group. As a result, a novel i-line molecular glass photoresist was formed with the chemical modification of tannic acid. The expe- rimental results show that the modificated compound had a fair solubility in many organic solvents. The lithographic performance of the resist was evaluated on an i-line exposure system with high photosensitivity and resolution as well. 展开更多
关键词 Tannic acid 2 1 4-Diazonaphthoquinone(DNQ) sulfonate i-line resist Chemically amplified
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