This paper discusses the evolution of telecommunication industrial value chain （TIVC）, analyzes the influence of technical innovation and customer demand on TIVC, and establishes the model. The appearance of the cir...This paper discusses the evolution of telecommunication industrial value chain （TIVC）, analyzes the influence of technical innovation and customer demand on TIVC, and establishes the model. The appearance of the circuit switching technology and packet switching technology together with the diversity of the demand of customers change the structure of TIVC, causing vibration in value creation and distribution systems. With changes of the TIVC, enterprises in the chain will accordingly alter their business models, products （services） and the internal organizational structures. All these changes will lead to the reconstruction and optimization of the TIVC, and consequently, promote the development of the telecommunication industry.展开更多
Using an analytical framework of the global production network （GPN）, the present paper examines the external environment and the internal dynamics of China＇s integrated circuit （IC） industry. We analyze the tran...Using an analytical framework of the global production network （GPN）, the present paper examines the external environment and the internal dynamics of China＇s integrated circuit （IC） industry. We analyze the transition of China＇s IC industry from a state-led integrated device manufacturers＇ model to deeper integration into the GPN. We also explore the technological sources, the upgrading dynamics as well as the positioning of different nodes of China＇s IC industry in the GPN. We conclude that the ＂East Asia model＇＂ of gradual industrial upgrading might not apply anymore in the new era of GPN. High-technology industries can now be upgraded based on a parallel evolution model. Policy implications for China＇s high-technology industrial upgrading strategies are drawn from our analysis.展开更多
文摘This paper discusses the evolution of telecommunication industrial value chain （TIVC）, analyzes the influence of technical innovation and customer demand on TIVC, and establishes the model. The appearance of the circuit switching technology and packet switching technology together with the diversity of the demand of customers change the structure of TIVC, causing vibration in value creation and distribution systems. With changes of the TIVC, enterprises in the chain will accordingly alter their business models, products （services） and the internal organizational structures. All these changes will lead to the reconstruction and optimization of the TIVC, and consequently, promote the development of the telecommunication industry.
基金funding from the Ministry of Science and Technology of China and National Social Science Foundation(No.07CZZ012)
文摘Using an analytical framework of the global production network （GPN）, the present paper examines the external environment and the internal dynamics of China＇s integrated circuit （IC） industry. We analyze the transition of China＇s IC industry from a state-led integrated device manufacturers＇ model to deeper integration into the GPN. We also explore the technological sources, the upgrading dynamics as well as the positioning of different nodes of China＇s IC industry in the GPN. We conclude that the ＂East Asia model＇＂ of gradual industrial upgrading might not apply anymore in the new era of GPN. High-technology industries can now be upgraded based on a parallel evolution model. Policy implications for China＇s high-technology industrial upgrading strategies are drawn from our analysis.
