Eco-friendly gas insulating medium for next-generation SF_(6)-free equipment

Gas-insulated equipment(GIE)that utilizes the most potent greenhouse gas sulfur hexafluoride(SF_(6))as insulation and arc-quenching medium has been widely used in the power industry.Seeking eco-friendly insulating gas with advanced performance for next-generation SF_(6)-free GIE is significant for the“net-zero”goal and sustainable development.In this paper,the utilization,emission,and reduction policies of SF_(6)around the world were summarized first.Then,we systematically reviewed the latest progress in comprehensive performance evaluation of eco-friendly insulating gas in terms of molecular design,dielectric insulation,arc-quenching,stability and decomposition,materials compatibility,biosafety,etc.Further,the representative applications of eco-friendly insulating gas in medium-voltage,high-voltage GIE as well as relevant maintenance-related technologies were highlighted.Accordingly,the existing challenges and future perspectives were proposed,presenting a roadmap to hopefully steer the development of eco-friendly insulating gas and GIE.

Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits

In this paper,ground-signal-ground type through-silicon vias（TSVs） exploiting air gaps as insulation layers are designed,analyzed and simulated for applications in millimeter wave.The compact wideband equivalent-circuit model and passive elements（RLGC） parameters based on the physical parameters are presented with the frequency up to 100 GHz.The parasitic capacitance of TSVs can be approximated as the dielectric capacitance of air gaps when the thickness of air gaps is greater than 0.75 μm.Therefore,the applied voltage of TSVs only needs to achieve the flatband voltage,and there is no need to indicate the threshold voltage.This is due to the small permittivity of air gaps.The proposed model shows good agreement with the simulation results of ADS and Ansoft＇s HFSS over a wide frequency range.