As an outstanding representative of layered materials,molybdenum disulfide(MoS_(2))has excellent physical properties,such as high carrier mobility,stability,and abundance on earth.Moreover,its reasonable band gap and ...As an outstanding representative of layered materials,molybdenum disulfide(MoS_(2))has excellent physical properties,such as high carrier mobility,stability,and abundance on earth.Moreover,its reasonable band gap and microelectronic compatible fabrication characteristics makes it the most promising candidate in future advanced integrated circuits such as logical electronics,flexible electronics,and focal-plane photodetector.However,to realize the all-aspects application of MoS_(2),the research on obtaining high-quality and large-area films need to be continuously explored to promote its industrialization.Although the MoS_(2)grain size has already improved from several micrometers to sub-millimeters,the high-quality growth of wafer-scale MoS_(2)is still of great challenge.Herein,this review mainly focuses on the evolution of MoS_(2)by including chemical vapor deposition,metal–organic chemical vapor deposition,physical vapor deposition,and thermal conversion technology methods.The state-of-the-art research on the growth and optimization mechanism,including nucleation,orientation,grain,and defect engineering,is systematically summarized.Then,this review summarizes the wafer-scale application of MoS_(2)in a transistor,inverter,electronics,and photodetectors.Finally,the current challenges and future perspectives are outlined for the wafer-scale growth and application of MoS_(2).展开更多
Due to the constraints imposed by physical effects and performance degra certain limitations in sustaining the advancement of Moore’s law.Two-dimensional(2D)materials have emerged as highly promising candidates for t...Due to the constraints imposed by physical effects and performance degra certain limitations in sustaining the advancement of Moore’s law.Two-dimensional(2D)materials have emerged as highly promising candidates for the post-Moore era,offering significant potential in domains such as integrated circuits and next-generation computing.Here,in this review,the progress of 2D semiconductors in process engineering and various electronic applications are summarized.A careful introduction of material synthesis,transistor engineering focused on device configuration,dielectric engineering,contact engineering,and material integration are given first.Then 2D transistors for certain electronic applications including digital and analog circuits,heterogeneous integration chips,and sensing circuits are discussed.Moreover,several promising applications(artificial intelligence chips and quantum chips)based on specific mechanism devices are introduced.Finally,the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed,and potential development pathways or roadmaps are further speculated and outlooked.展开更多
The SubBytes (S-box) transformation is the most crucial operation in the AES algorithm, significantly impacting the implementation performance of AES chips. To design a high-performance S-box, a segmented optimization...The SubBytes (S-box) transformation is the most crucial operation in the AES algorithm, significantly impacting the implementation performance of AES chips. To design a high-performance S-box, a segmented optimization implementation of the S-box is proposed based on the composite field inverse operation in this paper. This proposed S-box implementation is modeled using Verilog language and synthesized using Design Complier software under the premise of ensuring the correctness of the simulation result. The synthesis results show that, compared to several current S-box implementation schemes, the proposed implementation of the S-box significantly reduces the area overhead and critical path delay, then gets higher hardware efficiency. This provides strong support for realizing efficient and compact S-box ASIC designs.展开更多
Through-silicon-via (TSV) to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits (3D ICs). Based on the frequency dependent equivalent electrical ...Through-silicon-via (TSV) to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits (3D ICs). Based on the frequency dependent equivalent electrical parameters for the TSV channel, an analytical crosstalk noise model is established to capture the TSV induced crosstalk noise. The impact of various design parameters including insulation dielectric, via pitch, via height, silicon conductivity, and terminal impedance on the crosstalk noise is analyzed with the proposed model. Two approaches are proposed to alleviate the TSV noise, namely, driver sizing and via shielding, and the SPICE results show 241 rnV and 379 mV reductions in the peak noise voltage, respectively.展开更多
Metal-insulator-metal (MIM) capacitors with atomic-layer-deposited Al2O3 dielectric and reactively sputtered TaN electrodes in application to radio frequency integrated circuits have been characterized electrically....Metal-insulator-metal (MIM) capacitors with atomic-layer-deposited Al2O3 dielectric and reactively sputtered TaN electrodes in application to radio frequency integrated circuits have been characterized electrically. The capacitors exhibit a high density of about 6.05 fF/μm^2, a small leakage current of 4.8 × 10^-8 A/cm^2 at 3 V, a high breakdown electric field of 8.61 MV/cm as well as acceptable voltage coefficients of capacitance (VCCs) of 795 ppm/V2 and 268ppm/V at 1 MHz. The observed properties should be attributed to high-quality Al2O3 film and chemically stable TaN electrodes. Further, a logarithmically linear relationship between quadratic VCC and frequency is observed due to the change of relaxation time with carrier mobility in the dielectric. The conduction mechanism in the high field ranges is dominated by the Poole-Frenkel emission, and the leakage current in the low field ranges is likely to be associated with trap-assisted tunnelling. Meanwhile, the Al2O3 dielectric presents charge trapping under low voltage stresses, and defect generation under high voltage stresses, and it has a hard-breakdown performance.展开更多
The basic indexes of all-optical integrated photonic circuits include high-density integration,ultrafast response and ultralow energy consumption.Traditional methods mainly adopt conventional micro/nano-structures.The...The basic indexes of all-optical integrated photonic circuits include high-density integration,ultrafast response and ultralow energy consumption.Traditional methods mainly adopt conventional micro/nano-structures.The overall size of the circuit is large,usually reaches hundreds of microns.Besides,it is difficult to balance the ultrafast response and ultra-low energy consumption problem,and the crosstalk between two traditional devices is difficult to overcome.Here,we propose and experimentally demonstrate an approach based on inverse design method to realize a high-density,ultrafast and ultra-low energy consumption integrated photonic circuit with two all-optical switches controlling the input states of an all-optical XOR logic gate.The feature size of the whole circuit is only 2.5μm×7μm,and that of a single device is 2μm×2μm.The distance between two adjacent devices is as small as 1.5μm,within wavelength magnitude scale.Theoretical response time of the circuit is 150 fs,and the threshold energy is within 10 fJ/bit.We have also considered the crosstalk problem.The circuit also realizes a function of identifying two-digit logic signal results.Our work provides a new idea for the design of ultrafast,ultra-low energy consumption all-optical devices and the implementation of high-density photonic integrated circuits.展开更多
This paper explores and proposes a design solution of an integrated skip cycle mode (SCM) control circuit with a simple structure. The design is simulated and implemented with XD10H-1.0μm modular DIMOS 650 V proces...This paper explores and proposes a design solution of an integrated skip cycle mode (SCM) control circuit with a simple structure. The design is simulated and implemented with XD10H-1.0μm modular DIMOS 650 V process. In order to meet the requirement of a wide temperature range and high yields of products, the schematic extracted from the layout is simulated with five process corners at 27℃ and 90℃. Simulation results demonstrate that the proposed integrated circuit is immune to noise and achieves skipping cycle control when switching mode power supply (SMPS) works with low load or without load.展开更多
The through silicon via (TSV) technology has proven to be the critical enabler to realize a three-dimensional (3D) gigscale system with higher performance but shorter interconnect length. However, the received dig...The through silicon via (TSV) technology has proven to be the critical enabler to realize a three-dimensional (3D) gigscale system with higher performance but shorter interconnect length. However, the received digital signal after trans- mission through a TSV channel, composed of redistribution layers (RDLs), TSVs, and bumps, is degraded at a high data-rate due to the non-idealities of the channel. We propose the Chebyshev multisection transformers to reduce the signal reflec- tion of TSV channel when operating frequency goes up to 20 GHz, by which signal reflection coefficient ($11) and signal transmission coefficient ($21) are improved remarkably by 150% and 73.3%, respectively. Both the time delay and power dissipation are also reduced by 4% and 13.3%, respectively. The resistance-inductance-conductance-capacitance (RLGC) elements of the TSV channel are iterated from scattering (S)-parameters, and the proposed method of weakening the signal reflection is verified using high frequency simulator structure (HFSS) simulation software by Ansoft.展开更多
Dear Editor: There is accumulating evidence that human blood electronic circuit components and their application circuits become more and more important to cyborg implant/engineering, man-machine interface, hu- man ...Dear Editor: There is accumulating evidence that human blood electronic circuit components and their application circuits become more and more important to cyborg implant/engineering, man-machine interface, hu- man disease detection and healing, and artificial brain evolutionusl. Here, we report the first development of human plasma-based amplifier circuit in the dis- crete as well as integrated circuit (IC) configuration mode. Electrolytes in the human blood contain an enormous number of charge carriers such as positive and negative molecule/atom ions, which are electri- cally conducting media and therefore can be utilized for developing electronic circuit components and their application circuits. These electronic circuits obvi- ously have very high application impact potential towards bio-medical engineering and medical science and technology.展开更多
A 330-500 GHz zero-biased broadband monolithic integrated tripler is reported. The measured results show that the maximum efficiency and the maximum output power are 2% and 194μW at 348 GHz. The saturation characteri...A 330-500 GHz zero-biased broadband monolithic integrated tripler is reported. The measured results show that the maximum efficiency and the maximum output power are 2% and 194μW at 348 GHz. The saturation characteristic test shows that the output i dB compression point is about -8.5 dBm at 334 GHz and the maximum efficiency is obtained at the point, which is slightly below the 1 dB compression point. Compared with the conventional hybrid integrated circuit, a major advantage of the monolithic integrated circuit is the significant improvement of reliability and consistency. In this work, a terahertz monolithic frequency multiplier at this band is designed and fabricated.展开更多
An analytical model for current-voltage behavior of amorphous In-Ga-Zn-O thin-film transistors(a-IGZO TFTs)with dual-gate structures is developed.The unified expressions for synchronous and asynchronous operating mo...An analytical model for current-voltage behavior of amorphous In-Ga-Zn-O thin-film transistors(a-IGZO TFTs)with dual-gate structures is developed.The unified expressions for synchronous and asynchronous operating modes are derived on the basis of channel charges,which are controlled by gate voltage.It is proven that the threshold voltage of asynchronous dual-gate IGZO TFTs is adjusted in proportion to the ratio of top insulating capacitance to the bottom insulating capacitance(C_(TI)/C_(BI)).Incorporating the proposed model with Verilog-A,a touch-sensing circuit using dual-gate structure is investigated by SPICE simulations.Comparison shows that the touch sensitivity is increased by the dual-gate IGZO TFT structure.展开更多
A heavy-ion irradiation experiment is studied in digital storage cells with different design approaches in 130?nm CMOS bulk Si and silicon-on-insulator (SOI) technologies. The effectiveness of linear energy transf...A heavy-ion irradiation experiment is studied in digital storage cells with different design approaches in 130?nm CMOS bulk Si and silicon-on-insulator (SOI) technologies. The effectiveness of linear energy transfer (LET) with a tilted ion beam at the 130?nm technology node is obtained. Tests of tilted angles θ=0 ° , 30 ° and 60 ° with respect to the normal direction are performed under heavy-ion Kr with certain power whose LET is about 40?MeVcm 2 /mg at normal incidence. Error numbers in D flip-flop chains are used to determine their upset sensitivity at different incidence angles. It is indicated that the effective LETs for SOI and bulk Si are not exactly in inverse proportion to cosθ , furthermore the effective LET for SOI is more closely in inverse proportion to cosθ compared to bulk Si, which are also the well known behavior. It is interesting that, if we design the sample in the dual interlocked storage cell approach, the effective LET in bulk Si will look like inversely proportional to cosθ very well, which is also specifically explained.展开更多
Hybrid integration ofⅢ-Ⅴand ferroelectric materials is being broadly adopted to enhance functionalities in silicon photonic integrated circuits(PICs).Bonding and transfer printing have been the popular approaches fo...Hybrid integration ofⅢ-Ⅴand ferroelectric materials is being broadly adopted to enhance functionalities in silicon photonic integrated circuits(PICs).Bonding and transfer printing have been the popular approaches for integration of III–V gain media with silicon PICs.Similar approaches are also being considered for ferroelectrics to enable larger RF modulation bandwidths,higher linearity,lower optical loss integrated optical modulators on chip.In this paper,we review existing integration strategies ofⅢ-Ⅴmaterials and present a route towards hybrid integration of bothⅢ-Ⅴand ferroelectrics on the same chip.We show that adiabatic transformation of the optical mode between hybrid ferroelectric and silicon sections enables efficient transfer of optical modal energies for maximum overlap of the optical mode with the ferroelectric media,similar to approaches adopted to maximize optical overlap with the gain section,thereby reducing lasing thresholds for hybridⅢ-Ⅴintegration with silicon PICs.Preliminary designs are presented to enable a foundry compatible hybrid integration route of diverse functionalities on silicon PICs.展开更多
Device physics research for submicron and deep submicron space microelectronics devices and integrated circuits will be described in three topics.1.Thin film submicron and deep submicron SOS / CMOS devices and integra...Device physics research for submicron and deep submicron space microelectronics devices and integrated circuits will be described in three topics.1.Thin film submicron and deep submicron SOS / CMOS devices and integrated circuits.2.Deep submicron LDD CMOS devices and integrated circuits.3.C band and Ku band microwave GaAs MESFET and III-V compound hetrojunction HEM T and HBT devices and integrated circuits.展开更多
Programmable photonic waveguide meshes can be programmed into many different circuit topologies and thereby provide a variety of functions.Due to the complexity of the signal routing in a general mesh,a particular syn...Programmable photonic waveguide meshes can be programmed into many different circuit topologies and thereby provide a variety of functions.Due to the complexity of the signal routing in a general mesh,a particular synthesis algorithm often only accounts for a specific function with a specific cell configuration.In this paper,we try to synthesize the programmable waveguide mesh to support multiple configurations with a more general digital signal processing platform.To show the feasibility of this technique,photonic waveguide meshes in different configurations(square,triangular and hexagonal meshes)are designed to realize optical signal interleaving with arbitrary duty cycles.The digital signal processing(DSP)approach offers an effective pathway for the establishment of a general design platform for the software-defined programmable photonic integrated circuits.The use of well-developed DSP techniques and algorithms establishes a link between optical and electrical signals and makes it convenient to realize the computer-aided design of optics–electronics hybrid systems.展开更多
The design of a three-input logic circuit using carbon nanotube field effect transistors(CNTFETs)is presented.Ternary logic must be an exact replacement for dual logic since it performs straightforwardly in digital de...The design of a three-input logic circuit using carbon nanotube field effect transistors(CNTFETs)is presented.Ternary logic must be an exact replacement for dual logic since it performs straightforwardly in digital devices,which is why this design is so popular,and it also reduces chip area,both of which are examples of circuit overheads.The proposed module we have investigated is a triple-logic-based one,based on advanced technology CNTFETs and an emphasis on minimizing delay times at various values,as well as comparisons of the design working with various load capacitances.Comparing the proposed design with the existing design,the delay times was reduced from 66.32 to 16.41 ps,i.e.,a 75.26%reduction.However,the power dissipation was not optimized,and increased by 1.44%compared to the existing adder.The number of transistors was also reduced,and the product of power and delay(P∗D)achieved a value of 0.0498053 fJ.An improvement at 1 V was also achieved.A load capacitance(fF)was measured at different values,and the average delay measured for different values of capacitance had a maximum of 83.60 ps and a minimum of 22.54 ps,with a range of 61.06 ps.The power dissipations ranged from a minimum of 3.38μW to a maximum of 6.49μW.Based on these results,the use of this CNTFET half-adder design in multiple Boolean circuits will be a useful addition to circuit design.展开更多
An 'Integrated Device and Circuit simulator' for thin film (0.05-0.2μm) submicron (0.5μm) and deep submicron (0.15, 0.25,0.35μm) CMOS/ SOI integrated circuit has been developed. This simulator has been used...An 'Integrated Device and Circuit simulator' for thin film (0.05-0.2μm) submicron (0.5μm) and deep submicron (0.15, 0.25,0.35μm) CMOS/ SOI integrated circuit has been developed. This simulator has been used for design and fabrication and physical library development of thin film submicron and deep submicron CMOS/ SOI integrated circuit.展开更多
The electrostatic discharge(ESD)phenomenon is very common,in daily life,many places will appear ESD phenomenon.However,ESD is a potential hazard for integrated circuits.This paper analyzes the ESD protection design an...The electrostatic discharge(ESD)phenomenon is very common,in daily life,many places will appear ESD phenomenon.However,ESD is a potential hazard for integrated circuits.This paper analyzes the ESD protection design and characteristics of advanced process integrated circuits,and puts forward personal views combined with experience,hoping to bring help to the people who pay attention to the ESD protection of integrated circuits.展开更多
基金financially the National Natural Science Foundation of China(52002254,52272160)Sichuan Science and Technology Foundation(2020YJ0262,2021YFH0127,2022YFSY0045,2022YFH0083 and 23SYSX0060)+3 种基金the Chunhui plan of Ministry of Education,Fundamental Research Funds for the Central Universities,China(YJ201893)the Open-Foundation of Key Laboratory of Laser Device Technology,China North Industries Group Corporation Limited(Grant No.KLLDT202104)the foundation of the State Key Laboratory of Solidification Processing in NWPU(No.SKLSP202210)the 2035-Plan of Sichuan University。
文摘As an outstanding representative of layered materials,molybdenum disulfide(MoS_(2))has excellent physical properties,such as high carrier mobility,stability,and abundance on earth.Moreover,its reasonable band gap and microelectronic compatible fabrication characteristics makes it the most promising candidate in future advanced integrated circuits such as logical electronics,flexible electronics,and focal-plane photodetector.However,to realize the all-aspects application of MoS_(2),the research on obtaining high-quality and large-area films need to be continuously explored to promote its industrialization.Although the MoS_(2)grain size has already improved from several micrometers to sub-millimeters,the high-quality growth of wafer-scale MoS_(2)is still of great challenge.Herein,this review mainly focuses on the evolution of MoS_(2)by including chemical vapor deposition,metal–organic chemical vapor deposition,physical vapor deposition,and thermal conversion technology methods.The state-of-the-art research on the growth and optimization mechanism,including nucleation,orientation,grain,and defect engineering,is systematically summarized.Then,this review summarizes the wafer-scale application of MoS_(2)in a transistor,inverter,electronics,and photodetectors.Finally,the current challenges and future perspectives are outlined for the wafer-scale growth and application of MoS_(2).
基金supported in part by STI 2030-Major Projects under Grant 2022ZD0209200sponsored by Tsinghua-Toyota Joint Research Fund+12 种基金in part by National Natural Science Foundation of China under Grant 62374099, Grant 62022047, Grant U20A20168, Grant 51861145202, Grant 51821003, and Grant 62175219in part by the National Key R&D Program under Grant 2016YFA0200400in part by Beijing Natural Science-Xiaomi Innovation Joint Fund Grant L233009in part supported by Tsinghua University-Zhuhai Huafa Industrial Share Company Joint Institute for Architecture Optoelectronic Technologies (JIAOT KF202204)in part by the Daikin-Tsinghua Union Programin part sponsored by CIE-Tencent Robotics X Rhino-Bird Focused Research Programin part by the Guoqiang Institute, Tsinghua Universityin part by the Research Fund from Beijing Innovation Center for Future Chipin part by Shanxi “1331 Project” Key Subjects Constructionin part by the Youth Innovation Promotion Association of Chinese Academy of Sciences (2019120)the opening fund of Key Laboratory of Science and Technology on Silicon Devices, Chinese Academy of Sciencesin part by the project of MOE Innovation Platformin part by the State Key Laboratory of Integrated Chips and Systems
文摘Due to the constraints imposed by physical effects and performance degra certain limitations in sustaining the advancement of Moore’s law.Two-dimensional(2D)materials have emerged as highly promising candidates for the post-Moore era,offering significant potential in domains such as integrated circuits and next-generation computing.Here,in this review,the progress of 2D semiconductors in process engineering and various electronic applications are summarized.A careful introduction of material synthesis,transistor engineering focused on device configuration,dielectric engineering,contact engineering,and material integration are given first.Then 2D transistors for certain electronic applications including digital and analog circuits,heterogeneous integration chips,and sensing circuits are discussed.Moreover,several promising applications(artificial intelligence chips and quantum chips)based on specific mechanism devices are introduced.Finally,the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed,and potential development pathways or roadmaps are further speculated and outlooked.
文摘The SubBytes (S-box) transformation is the most crucial operation in the AES algorithm, significantly impacting the implementation performance of AES chips. To design a high-performance S-box, a segmented optimization implementation of the S-box is proposed based on the composite field inverse operation in this paper. This proposed S-box implementation is modeled using Verilog language and synthesized using Design Complier software under the premise of ensuring the correctness of the simulation result. The synthesis results show that, compared to several current S-box implementation schemes, the proposed implementation of the S-box significantly reduces the area overhead and critical path delay, then gets higher hardware efficiency. This provides strong support for realizing efficient and compact S-box ASIC designs.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61131001,61322405,61204044,61376039,and 61334003)
文摘Through-silicon-via (TSV) to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits (3D ICs). Based on the frequency dependent equivalent electrical parameters for the TSV channel, an analytical crosstalk noise model is established to capture the TSV induced crosstalk noise. The impact of various design parameters including insulation dielectric, via pitch, via height, silicon conductivity, and terminal impedance on the crosstalk noise is analyzed with the proposed model. Two approaches are proposed to alleviate the TSV noise, namely, driver sizing and via shielding, and the SPICE results show 241 rnV and 379 mV reductions in the peak noise voltage, respectively.
基金Project supported by the National Natural Science Foundation of China (Grant No 90607023), Shanghai Pujiang Program (Grant No 05PJ14017), SRF for R0CS, SEM, and the Micro/Nano-electronics Science and Technology Innovation Platform (985) and the Ministry of Education of China in the International Research Training Group "Materials and Concepts for Advanced Interconnects
文摘Metal-insulator-metal (MIM) capacitors with atomic-layer-deposited Al2O3 dielectric and reactively sputtered TaN electrodes in application to radio frequency integrated circuits have been characterized electrically. The capacitors exhibit a high density of about 6.05 fF/μm^2, a small leakage current of 4.8 × 10^-8 A/cm^2 at 3 V, a high breakdown electric field of 8.61 MV/cm as well as acceptable voltage coefficients of capacitance (VCCs) of 795 ppm/V2 and 268ppm/V at 1 MHz. The observed properties should be attributed to high-quality Al2O3 film and chemically stable TaN electrodes. Further, a logarithmically linear relationship between quadratic VCC and frequency is observed due to the change of relaxation time with carrier mobility in the dielectric. The conduction mechanism in the high field ranges is dominated by the Poole-Frenkel emission, and the leakage current in the low field ranges is likely to be associated with trap-assisted tunnelling. Meanwhile, the Al2O3 dielectric presents charge trapping under low voltage stresses, and defect generation under high voltage stresses, and it has a hard-breakdown performance.
基金the National Key Research and Development Program of China under Grant No.2018YFB2200403the National Natural Science Foundation of China under Grant Nos.11734001,91950204,92150302.
文摘The basic indexes of all-optical integrated photonic circuits include high-density integration,ultrafast response and ultralow energy consumption.Traditional methods mainly adopt conventional micro/nano-structures.The overall size of the circuit is large,usually reaches hundreds of microns.Besides,it is difficult to balance the ultrafast response and ultra-low energy consumption problem,and the crosstalk between two traditional devices is difficult to overcome.Here,we propose and experimentally demonstrate an approach based on inverse design method to realize a high-density,ultrafast and ultra-low energy consumption integrated photonic circuit with two all-optical switches controlling the input states of an all-optical XOR logic gate.The feature size of the whole circuit is only 2.5μm×7μm,and that of a single device is 2μm×2μm.The distance between two adjacent devices is as small as 1.5μm,within wavelength magnitude scale.Theoretical response time of the circuit is 150 fs,and the threshold energy is within 10 fJ/bit.We have also considered the crosstalk problem.The circuit also realizes a function of identifying two-digit logic signal results.Our work provides a new idea for the design of ultrafast,ultra-low energy consumption all-optical devices and the implementation of high-density photonic integrated circuits.
文摘This paper explores and proposes a design solution of an integrated skip cycle mode (SCM) control circuit with a simple structure. The design is simulated and implemented with XD10H-1.0μm modular DIMOS 650 V process. In order to meet the requirement of a wide temperature range and high yields of products, the schematic extracted from the layout is simulated with five process corners at 27℃ and 90℃. Simulation results demonstrate that the proposed integrated circuit is immune to noise and achieves skipping cycle control when switching mode power supply (SMPS) works with low load or without load.
基金Project supported by the National Natural Science Foundation of China(Grant No.61204044)
文摘The through silicon via (TSV) technology has proven to be the critical enabler to realize a three-dimensional (3D) gigscale system with higher performance but shorter interconnect length. However, the received digital signal after trans- mission through a TSV channel, composed of redistribution layers (RDLs), TSVs, and bumps, is degraded at a high data-rate due to the non-idealities of the channel. We propose the Chebyshev multisection transformers to reduce the signal reflec- tion of TSV channel when operating frequency goes up to 20 GHz, by which signal reflection coefficient ($11) and signal transmission coefficient ($21) are improved remarkably by 150% and 73.3%, respectively. Both the time delay and power dissipation are also reduced by 4% and 13.3%, respectively. The resistance-inductance-conductance-capacitance (RLGC) elements of the TSV channel are iterated from scattering (S)-parameters, and the proposed method of weakening the signal reflection is verified using high frequency simulator structure (HFSS) simulation software by Ansoft.
文摘Dear Editor: There is accumulating evidence that human blood electronic circuit components and their application circuits become more and more important to cyborg implant/engineering, man-machine interface, hu- man disease detection and healing, and artificial brain evolutionusl. Here, we report the first development of human plasma-based amplifier circuit in the dis- crete as well as integrated circuit (IC) configuration mode. Electrolytes in the human blood contain an enormous number of charge carriers such as positive and negative molecule/atom ions, which are electri- cally conducting media and therefore can be utilized for developing electronic circuit components and their application circuits. These electronic circuits obvi- ously have very high application impact potential towards bio-medical engineering and medical science and technology.
基金Supported by the National High-Technology Research and Development Program of China under Grant No 2011AA010203the National Basic Research Program of China under Grant Nos 2011CB201704 and 2010CB327502the National Natural Science Foundation of China under Grant Nos 61434006 and 61106074
文摘A 330-500 GHz zero-biased broadband monolithic integrated tripler is reported. The measured results show that the maximum efficiency and the maximum output power are 2% and 194μW at 348 GHz. The saturation characteristic test shows that the output i dB compression point is about -8.5 dBm at 334 GHz and the maximum efficiency is obtained at the point, which is slightly below the 1 dB compression point. Compared with the conventional hybrid integrated circuit, a major advantage of the monolithic integrated circuit is the significant improvement of reliability and consistency. In this work, a terahertz monolithic frequency multiplier at this band is designed and fabricated.
基金Supported by the National Key Research and Development Program of China under Grant No 2017YFA0204600the National Natural Science Foundation of China under Grant No 61404002the Science and Technology Project of Hunan Province under Grant No 2015JC3041
文摘An analytical model for current-voltage behavior of amorphous In-Ga-Zn-O thin-film transistors(a-IGZO TFTs)with dual-gate structures is developed.The unified expressions for synchronous and asynchronous operating modes are derived on the basis of channel charges,which are controlled by gate voltage.It is proven that the threshold voltage of asynchronous dual-gate IGZO TFTs is adjusted in proportion to the ratio of top insulating capacitance to the bottom insulating capacitance(C_(TI)/C_(BI)).Incorporating the proposed model with Verilog-A,a touch-sensing circuit using dual-gate structure is investigated by SPICE simulations.Comparison shows that the touch sensitivity is increased by the dual-gate IGZO TFT structure.
基金Supported by the Key Laboratory of Microsatellites,Chinese Academy of Sciences
文摘A heavy-ion irradiation experiment is studied in digital storage cells with different design approaches in 130?nm CMOS bulk Si and silicon-on-insulator (SOI) technologies. The effectiveness of linear energy transfer (LET) with a tilted ion beam at the 130?nm technology node is obtained. Tests of tilted angles θ=0 ° , 30 ° and 60 ° with respect to the normal direction are performed under heavy-ion Kr with certain power whose LET is about 40?MeVcm 2 /mg at normal incidence. Error numbers in D flip-flop chains are used to determine their upset sensitivity at different incidence angles. It is indicated that the effective LETs for SOI and bulk Si are not exactly in inverse proportion to cosθ , furthermore the effective LET for SOI is more closely in inverse proportion to cosθ compared to bulk Si, which are also the well known behavior. It is interesting that, if we design the sample in the dual interlocked storage cell approach, the effective LET in bulk Si will look like inversely proportional to cosθ very well, which is also specifically explained.
文摘Hybrid integration ofⅢ-Ⅴand ferroelectric materials is being broadly adopted to enhance functionalities in silicon photonic integrated circuits(PICs).Bonding and transfer printing have been the popular approaches for integration of III–V gain media with silicon PICs.Similar approaches are also being considered for ferroelectrics to enable larger RF modulation bandwidths,higher linearity,lower optical loss integrated optical modulators on chip.In this paper,we review existing integration strategies ofⅢ-Ⅴmaterials and present a route towards hybrid integration of bothⅢ-Ⅴand ferroelectrics on the same chip.We show that adiabatic transformation of the optical mode between hybrid ferroelectric and silicon sections enables efficient transfer of optical modal energies for maximum overlap of the optical mode with the ferroelectric media,similar to approaches adopted to maximize optical overlap with the gain section,thereby reducing lasing thresholds for hybridⅢ-Ⅴintegration with silicon PICs.Preliminary designs are presented to enable a foundry compatible hybrid integration route of diverse functionalities on silicon PICs.
文摘Device physics research for submicron and deep submicron space microelectronics devices and integrated circuits will be described in three topics.1.Thin film submicron and deep submicron SOS / CMOS devices and integrated circuits.2.Deep submicron LDD CMOS devices and integrated circuits.3.C band and Ku band microwave GaAs MESFET and III-V compound hetrojunction HEM T and HBT devices and integrated circuits.
文摘Programmable photonic waveguide meshes can be programmed into many different circuit topologies and thereby provide a variety of functions.Due to the complexity of the signal routing in a general mesh,a particular synthesis algorithm often only accounts for a specific function with a specific cell configuration.In this paper,we try to synthesize the programmable waveguide mesh to support multiple configurations with a more general digital signal processing platform.To show the feasibility of this technique,photonic waveguide meshes in different configurations(square,triangular and hexagonal meshes)are designed to realize optical signal interleaving with arbitrary duty cycles.The digital signal processing(DSP)approach offers an effective pathway for the establishment of a general design platform for the software-defined programmable photonic integrated circuits.The use of well-developed DSP techniques and algorithms establishes a link between optical and electrical signals and makes it convenient to realize the computer-aided design of optics–electronics hybrid systems.
文摘Submicron CMOS IC technology, including triple layer resist lithography technology, RIE, LDD, Titanium Salicide, shallow junction, thin gate oxide, no bird's beak isolation and channel's multiple implantation doping technology have been developed. 0.50μm. CMOS integrated circuits have been fabricated using this submicron CMOS process.
文摘The design of a three-input logic circuit using carbon nanotube field effect transistors(CNTFETs)is presented.Ternary logic must be an exact replacement for dual logic since it performs straightforwardly in digital devices,which is why this design is so popular,and it also reduces chip area,both of which are examples of circuit overheads.The proposed module we have investigated is a triple-logic-based one,based on advanced technology CNTFETs and an emphasis on minimizing delay times at various values,as well as comparisons of the design working with various load capacitances.Comparing the proposed design with the existing design,the delay times was reduced from 66.32 to 16.41 ps,i.e.,a 75.26%reduction.However,the power dissipation was not optimized,and increased by 1.44%compared to the existing adder.The number of transistors was also reduced,and the product of power and delay(P∗D)achieved a value of 0.0498053 fJ.An improvement at 1 V was also achieved.A load capacitance(fF)was measured at different values,and the average delay measured for different values of capacitance had a maximum of 83.60 ps and a minimum of 22.54 ps,with a range of 61.06 ps.The power dissipations ranged from a minimum of 3.38μW to a maximum of 6.49μW.Based on these results,the use of this CNTFET half-adder design in multiple Boolean circuits will be a useful addition to circuit design.
文摘An 'Integrated Device and Circuit simulator' for thin film (0.05-0.2μm) submicron (0.5μm) and deep submicron (0.15, 0.25,0.35μm) CMOS/ SOI integrated circuit has been developed. This simulator has been used for design and fabrication and physical library development of thin film submicron and deep submicron CMOS/ SOI integrated circuit.
文摘The electrostatic discharge(ESD)phenomenon is very common,in daily life,many places will appear ESD phenomenon.However,ESD is a potential hazard for integrated circuits.This paper analyzes the ESD protection design and characteristics of advanced process integrated circuits,and puts forward personal views combined with experience,hoping to bring help to the people who pay attention to the ESD protection of integrated circuits.