3D‑Printed Carbon‑Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics

Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electronics,posing a major obstacle to the integra-tion of electronics.The innovation of integrating 3D-printed conformal shielding(c-SE)modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE func-tion without occupying additional space.Herein,the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity.Accordingly,the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing.In particular,the SE performance of 3D-printed frame is up to 61.4 dB,simultaneously accompanied with an ultralight architecture of 0.076 g cm^(-3) and a superhigh specific shielding of 802.4 dB cm3 g^(-1).Moreover,as a proof-of-concept,the 3D-printed c-SE module is in situ integrated into core electronics,successfully replacing the traditional metal-based module to afford multiple functions for electromagnetic compatibility and thermal dissipa-tion.Thus,this scientific innovation completely makes up the blank for assembling carbon-based c-SE modules and sheds a brilliant light on developing the next generation of high-performance shielding materials with arbitrarily-customized structure for integrated electronics.

Integrated power electronics module based on chip scale packaged power devices

High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.

Fabrication of polyetheretherketone(PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method

Additive manufacturing(AM)is a free-form technology that shows great potential in the integrated creation of three-dimensional(3D)electronics.However,the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature,high conductivity and high resolution remains a challenge.In this paper,a hybrid AM method combining the fused deposition modeling(FDM)and hydrophobic treatment assisted laser activation metallization(LAM)was proposed for manufacturing the polyetheretherketone(PEEK)-based 3D electronics,by which the conformal copper patterns were deposited on the 3D-printed PEEK parts,and the adhesion between them reached the 5B high level.Moreover,the 3D components could support the thermal cycling test from-55℃ to 125℃ for more than 100 cycles.Particularly,the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface,not affected by the inevitable printing borders and pores in the FDM-printed parts,then making the resolution of the electroless plated copper lines improved significantly.In consequence,Cu lines with width and spacing of only60μm and 100μm were obtained on both as-printed and after-polished PEEK substrates.Finally,the potential of this technique to fabricate 3D conformal electronics was demonstrated.

Human blood plasma-based electronic integrated circuit amplifier configuration

Dear Editor： There is accumulating evidence that human blood electronic circuit components and their application circuits become more and more important to cyborg implant/engineering, man-machine interface, hu- man disease detection and healing, and artificial brain evolutionusl. Here, we report the first development of human plasma-based amplifier circuit in the dis- crete as well as integrated circuit （IC） configuration mode. Electrolytes in the human blood contain an enormous number of charge carriers such as positive and negative molecule/atom ions, which are electri- cally conducting media and therefore can be utilized for developing electronic circuit components and their application circuits. These electronic circuits obvi- ously have very high application impact potential towards bio-medical engineering and medical science and technology.

THROTTLE CONTROL STRATEGIES IN THE PROCESS OF INTEGRATED POWERTRAIN CONTROL

Combining with the development of automated manual transmission （AMT）, the various throttle control demands are analyzed under different working conditions of AMT such as tracking acceleration pedal, start, shift and so on. Based on simulation, the responding throttle control strategies are proposed, and a simple but effective throttle control method is presented. The testing results have proved that the strategies are effective for improving the pedal tracking precision and the qualities of start and shift.

Silicon photonics for telecom and data‐com applications

In recent decades,silicon photonics has attracted much attention in telecom and data-com areas.Constituted of high refractive-index contrast waveguides on silicon-on-insulator(SOI),a variety of integrated photonic passive and active devices have been implemented supported by excellent optical properties of silicon in the mid-infrared spectrum.The main advantage of the silicon photonics is the ability to use complementary metal oxide semiconductor(CMOS)process-compatible fabrication technologies,resulting in high-volume production at low cost.On the other hand,explosively growing traffic in the telecom,data center and high-performance computer demands the data flow to have high speed,wide bandwidth,low cost,and high energy-efficiency,as well as the photonics and electronics to be integrated for ultra-fast data transfer in networks.In practical applications,silicon photonics started with optical interconnect transceivers in the data-com first,and has been now extended to innovative applications such as multi-port optical switches in the telecom network node and integrated optical phased arrays(OPAs)in light detection and ranging(LiDAR).This paper overviews the progresses of silicon photonics from four points reflecting the recent advances mentioned above.CMOS-based silicon photonic platform technologies,applications to optical transceiver in the data-com network,applications to multi-port optical switches in the telecom network and applications to OPA in LiDAR system.

Recent progress of unconventional and multifunctional integrated supercapacitors

Integration can diversify the function of a device with the same volume, therefore it facilitates the development of portable, wearable and flexible electronics. In this review, we described several kinds of novel and unconventional multifunctional integrated supercapacitors which can not only be used to storage energy but also be applied to other fields such as photodetecting, electrochromics, monitoring physiological/mechanical activities, gas sensor, and so on. First, a brief introduction of the significance and advantages of multifunctional integrated supercapacitors was presented. Then we outlined the enormous progress which has been made in the area of multifunctional integrated supercapacitors. In the end, the prospects and further developments in this exciting field were also suggested.

Fiber-shaped Supercapacitors:Advanced Strategies toward High-performances and Multi-functions

Fiber-shaped supercapacitors(FSSCs)show great potential in portable and wearable electronics due to their unique advantages of high safety,environmental friendliness,high performances,outstanding flexibility and integrability.They can directly act as the power sources or be easily integrated with other flexible devices to constitute self-powered and sustainable energy suppliers,providing excellent adaptability to irregular surfaces.This review mainly summarizes the recently reported works of FSSCs including preparation methods of various fiber electrodes,construction strategies of FSSCs and multi-functional device integrations,exploration of reaction mechanisms and strategies to improve the electrochemical performance and provision of suggestions on further designing and optimization of FSSCs.Meanwhile,it shares our perspectives on challenges and opportunities in this field,shedding light on the development of high-performance fiber-shaped supercapacitors with multifunctions.

Online Mind-Map as Interface of Electronic Resource Integration and Sharing

The paper aims to research on online mind map as interface of learning resource integration and sharing.We developed a web application that provides a interface to allow users to create a knowledge mind map.With the online mind mapping tool,the electronic learning resource will be discovered and shared in the form of subject-oriented package,it is more flexibly than the other E-Learning systems,and the interaction and cooperation of the users are strengthened to some extent.