A time domain electric al field integral equation (TDEFIE) is formulated for the problem of a thin wire antenna in the presence of conductor bodies, and this equation is solved by the me...A time domain electric al field integral equation (TDEFIE) is formulated for the problem of a thin wire antenna in the presence of conductor bodies, and this equation is solved by the method of time marching algorithm. The analysis is valid for any arbitrarily shaped, oriented and positioned wire antennas relative to arbitrarily shaped conductor bodies. Current at the excited point, input admittance and radiation pattern are given and agree with the results computed by the method in frequency domain.展开更多
The transient response of a system of independent electrodes buried in a semi-infinite conducting medium is studied. Using a simple and versatile numerical scheme written by the authors and based on the Electric Field...The transient response of a system of independent electrodes buried in a semi-infinite conducting medium is studied. Using a simple and versatile numerical scheme written by the authors and based on the Electric Field Integral Equation (EFIE), the effect caused by harmonic signals ranging on frequency from Hz to hundred of MHz, and also by lightning type driving signal striking at a remote point far from the conductors, is extensively studied. The value of the scalar potential appearing on the electrodes as a function of the frequency of the applied signal is one of the variables investigated. Other features such as the input impedance at the injection point of the signal and the Ground Potential Rise (GPR) over the electrode system are also discussed.展开更多
Manual process of creating bonding diagram is known to be time consuming and error prone. In comparison, offline programming (OLP) provides a much more viable option to reduce the wire bonding creation time and error....Manual process of creating bonding diagram is known to be time consuming and error prone. In comparison, offline programming (OLP) provides a much more viable option to reduce the wire bonding creation time and error. OLP is available in two versions, i.e., vendor specific OLP and direct integration offline pro- gramming (Di-OLP). Both versions utilize the bonding diagram and computer aided design data to speed up bonding program creation. However, the newly proposed Di-OLP is more flexible as it can be used to create bonding program for multiple machine platforms in microelectronics industry. Some special features of Di-OLP method are presented. The application of generic OLP however, is applicable to machines that recognize ASCII text file. The user needs to know the data format accepted by machine and convert the data accordingly to suit its application for different machine platforms. Di-OLP is also a practical method to replace the time consuming manual method in production line.展开更多
文摘A time domain electric al field integral equation (TDEFIE) is formulated for the problem of a thin wire antenna in the presence of conductor bodies, and this equation is solved by the method of time marching algorithm. The analysis is valid for any arbitrarily shaped, oriented and positioned wire antennas relative to arbitrarily shaped conductor bodies. Current at the excited point, input admittance and radiation pattern are given and agree with the results computed by the method in frequency domain.
文摘The transient response of a system of independent electrodes buried in a semi-infinite conducting medium is studied. Using a simple and versatile numerical scheme written by the authors and based on the Electric Field Integral Equation (EFIE), the effect caused by harmonic signals ranging on frequency from Hz to hundred of MHz, and also by lightning type driving signal striking at a remote point far from the conductors, is extensively studied. The value of the scalar potential appearing on the electrodes as a function of the frequency of the applied signal is one of the variables investigated. Other features such as the input impedance at the injection point of the signal and the Ground Potential Rise (GPR) over the electrode system are also discussed.
文摘Manual process of creating bonding diagram is known to be time consuming and error prone. In comparison, offline programming (OLP) provides a much more viable option to reduce the wire bonding creation time and error. OLP is available in two versions, i.e., vendor specific OLP and direct integration offline pro- gramming (Di-OLP). Both versions utilize the bonding diagram and computer aided design data to speed up bonding program creation. However, the newly proposed Di-OLP is more flexible as it can be used to create bonding program for multiple machine platforms in microelectronics industry. Some special features of Di-OLP method are presented. The application of generic OLP however, is applicable to machines that recognize ASCII text file. The user needs to know the data format accepted by machine and convert the data accordingly to suit its application for different machine platforms. Di-OLP is also a practical method to replace the time consuming manual method in production line.
