It was aim to investigate the interfacial microstructure and shear performance of Ti/Cu clad sheet produced by explosive welding and annealing. The experimental results demonstrate that the alternate distribution of i...It was aim to investigate the interfacial microstructure and shear performance of Ti/Cu clad sheet produced by explosive welding and annealing. The experimental results demonstrate that the alternate distribution of interfacial collision and vortex of flyer layer forms in the interface a few of solidification structure. TEM confirms that the interfacial interlayer contains obvious lattice distortion structure and intermetallic compounds. It interprets the explosive welding as the interfacial deformation and thermal diffusion process between dissimilar metals. The interfacial shear strength is very close to the Cu matrix strength, which is determined by the mixture of the mechanical bonding and metallurgical bonding. Several cracks exist on the shear fracture owing to the intermetallic compound in the interfacial solidifi cation structure and also the probable welding inclusion.展开更多
基金Funded by the National Natural Science Foundation of China(Nos.U1332110 and 50971038)the Project of"Liaoning Bai Qian Wan Talents Program"of China(No.2013921071)
文摘It was aim to investigate the interfacial microstructure and shear performance of Ti/Cu clad sheet produced by explosive welding and annealing. The experimental results demonstrate that the alternate distribution of interfacial collision and vortex of flyer layer forms in the interface a few of solidification structure. TEM confirms that the interfacial interlayer contains obvious lattice distortion structure and intermetallic compounds. It interprets the explosive welding as the interfacial deformation and thermal diffusion process between dissimilar metals. The interfacial shear strength is very close to the Cu matrix strength, which is determined by the mixture of the mechanical bonding and metallurgical bonding. Several cracks exist on the shear fracture owing to the intermetallic compound in the interfacial solidifi cation structure and also the probable welding inclusion.
