Lead-free Ce-doped perovskite scintillators with high figure of merit

Lead halide perovskite scintillators have recently received extensive research attention owing to their short fluorescence lifetimes,low detection limits,and ease of fabrication compared to traditional scintillators.The nontoxic cerium-doped lead-free perovskites with intrinsically efficient and short lifetime d–f transitions are a prospective replacement for the toxic Pb^(2+).Here,we demonstrated Ce-doped cesium lanthanide chloride perovskites (Cs_(3)LnCl_(6),Ln=Gd,Y,Lu) synthesized through a facile solution method for the first time.These perovskites exhibit blue-violet emission,which arises from Ce 5d→4f transitions.Among three types of Cs_(3)LnCl_(6) perovskites,Ce:Cs_(3)LuCl_(6) exhibited high photoluminescence quantum yield (PLQY) of 82%and a short excited-state lifetime of approximately 34 ns.When utilized as X-ray scintillators,Ce:Cs_(3)LuCl_(6) crystals display a high light yield of 8120 photons per MeV and a low detection limit of 36.8 n Gy air s^(-1).Importantly,the figure of merit (FoM),representing the ratio of light yield to decay time,reaches 239,which is the highest reported value for lead-free perovskite scintillators up to now.Additionally,the fabrication of perovskite/PMMA films was undertaken for practical demonstrations in X-ray imaging,resulting in the attainment of a resolution of up to 8.38 lp/mm.We anticipate that this work will inspire the utilization of Ce-doped Cs_(3)LnCl_(6) perovskites in ultrafast scintillation applications such as high-energy physics,nuclear reaction monitoring,and dynamic X-ray imaging.

Ligand modulation of active center to promote lead-free Cs_(2)AgInCl_(6)photocatalytic CO_(2)reduction

Metal halide perovskites(MHP)are potential candidates for the photocatalytic reduction of CO_(2)due to their long photogenerated carrier lifetime and charge diffusion length.However,the conventional long-chain ligand impedes the adsorption and activation of CO_(2)molecules in practical applications.Here,a ligand modulation technology is employed to enhance the photocatalytic CO_(2)reduction activity of lead-free Cs_(2)AgInCl_(6)microcrystals(MCs).The Cs_(2)AgInCl_(6)MCs passivated by Oleic acid(OLA)and Octanoic acid(OCA)are used for photocatalytic CO_(2)reduction.The results show that the surface defects and electronic properties of Cs_(2)AgInCl_(6)MCs can be adjusted through ligand modulation.Compared with the OLA-Cs_(2)AgInCl_(6),the OCA-Cs_(2)AgInCl_(6)catalyst demonstrated a significant improvement in the catalytic yield of CO and CH_(4).The CO and CH_(4)catalytic yields of OCA-Cs_(2)AgInCl_(6)reached 171.88 and34.15μmol g^(-1)h^(-1)which were 2.03 and 12.98 times higher than those of OLA-Cs_(2)AgInCl_(6),and the total electron consumption rate of OCA-Cs_(2)AgInCl_(6)was 615.2μmol g^(-1)h^(-1)which was 3.25 times higher than that of OLA-Cs_(2)AgInCl_(6).Furthermore,in situ diffuse reflectance infrared Fourier transform spectra revealed the enhancement of photocatalytic activity in Cs_(2)AgInCl_(6)MCs induced by ligand modulation.This study illustrates the potential of lead-free Cs_(2)AgInCl_(6)MCs for efficient photocatalytic CO_(2)reduction and provides a ligand modulation strategy for the active promotion of MHP photocatalysts.

Mechanical and Electrical Properties of Some Sn-Zn Based Lead-Free Quinary Alloys

Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to create the soldering alloys’ features. The eutectic Sn-9Zn alloy is among them. This paper investigated the mechanical and electrical properties of Sn-9Zn-x (Ag, Cu, Sb);{x = 0.2, 0.4, and 0.6} lead-free solder alloys. The mechanical properties such as elastic modulus, ultimate tensile strength (UTS), yield strength (YS), and ductility were examined at the strain rates in a range from 4.17 10−3 s−1 to 208.5 10−3 s−1 at room temperature. It is found that increasing the content of the alloying elements and strain rate increases the elastic modulus, ultimate tensile strength, and yield strength while the ductility decreases. The electrical conductivity of the alloys is found to be a little smaller than that of the Sn-9Zn eutectic alloy.

Preparation of lead-free free-cutting graphite brasses by graphitization of cementite

Graphite brasses were prepared by graphitizing annealing of cast brasses containing cementite particles,which were in-situ formed during the fasting process.The eutectic cast iron as carbon source was added into common brasses by casting.SEM and EDS were used to analyze the microstructure of graphite brasses,and the relationship between the microstructure and machinability was investigated.The results show that graphite particles are formed by the decomposition of cementite particles in cast brasses.The graphite particles are uniformly dispersed in the brass matrix with the average size of 5.0 μm and the volume fraction of ~1.1%.The machinability in the graphite brass is dramatically increased relative to the common brass,because of the lubricating properties of graphite particles and its role in chip breaking.The workpiece surface of the graphite brasses chips is smooth and burr-free,and the chips of graphite brasses are short（C-shape） and discontinuous,which is much better than that of the long spiral chips of common brasses.

基于Anand模型的BGA封装热冲击循环分析及焊点疲劳寿命预测

BGA封装在电子元器件中的互连、信息传输等方面起着重要作用,研究封装元件的可靠性以及内部焊点在高温、高湿、高压等极限条件下的稳定性显得尤为重要。基于Anand模型分析了封装元件在热冲击下的塑性变形和应力分布,同时对不同空间位置焊点的最大应力与主要失效位置进行了对比,并运用Darveaux模型计算出焊点最危险单元的裂纹萌生、裂纹扩展速率和疲劳寿命。结果表明,在热冲击极限载荷下,封装元件的温度呈现对称分布,表面温度与内部温度差较大,约为15℃;最大变形为0.038 mm,最大变形位置为外侧镀膜处;最大应力为222.18 MPa,内部其余部分的应力值为20 MPa左右。对于内部焊点,最大应力为19.02 MPa (250 s),应力最大位置在锡球下方边缘,预估其疲劳寿命为6.29天。

高密度BGA器件焊点脱焊分析及预防研究

针对航空电子产品印制板组件焊点脱焊问题,以高密度BGA器件为研究对象,分析了导致焊点脱焊的主要原因,在于产品结构设计和工艺设计不当导致的应变应力及产品服役过程中的机械振动、热循环应力,其次是焊接过程中的不良特性。本文针对性提出了相关预防措施,并指明了下一步技术研究的工作方向。

BGA土壤调理剂在砂质土壤辣椒种植应用研究

本实验应用BGA土壤调理剂对砂质土地的絮凝作用,作者选定宁夏银川月牙湖沙化地进行试验,种植辣椒测定其苗期成活率、植物生长量、产量及土壤理化性质。结果表明,BGA土壤调理剂能增强辣椒对盐、碱的抵抗能力,成活率达到96.16%,长势优于其他处理,达到提高产量和絮凝作用,提高了砂质土壤的保水、保肥性能,使土壤变得疏松多孔,有利于作物根系生长。In this experiment, BGA soil conditioner was used to flocculate sandy land. The author selected the desert land of Yueya Lake in Yinchuan, Ningxia, and measured the survival rate of seedlings, plant growth, yield and soil physicochemical properties. The results showed that BGA soil conditioner could enhance the resistance of pepper to salt and alkali, the survival rate was 96.16%, the growth rate was better than other treatments, the yield was increased, the flocculation was improved, the water and fertilizer retention performance of sandy soil was improved, the soil became loose and porous, and it was conducive to the growth of crop roots.

基于BGA认证的课程设计、实施与评价——以江西财经大学创业概论课程为例

通过国际认证来提升办学水平和国际化程度是中国众多高校商学院的重要选择。文章以江西财经大学创业概论课程为例,通过对标BGA认证的要求,找出课程存在的潜在差距,从课程计划、教学资源、教学内容、教学方法、教学实施、教学评价等多个方面进行相应的改进与提高。

热循环条件下BGA叠层焊点可靠性研究及参数优化

构建叠层焊点最优结构参数,提高BGA叠层焊点热循环条件下的可靠性具有重要的意义。建立有限元模型,分析叠层焊点在热循环条件下应力应变,运用田口正交法和曲面响应法,将焊点的高度、直径、间距、阵列作为实验设计的变量,关键焊点最大等效塑性应变作为优化目标。结果表明:焊点阵列对优化目标的影响权重最大,优化后的BGA叠层焊点结构参数如下,田口正交法:单层焊点高度为0.38 mm,焊点间距为0.55 mm,焊点直径为0.44 mm,焊点阵列为8×8;曲面响应法:单层焊点高度为0.387 mm,焊点间距为0.573 mm,焊点直径为0.446 mm,焊点阵列为8×8。对优化前后的寿命进行预测,优化后的叠层焊点寿命约是优化前的3.75倍。

Large Energy Capacitive High-Entropy Lead-Free Ferroelectrics

Advanced lead-free energy storage ceramics play an indispensable role in next-generation pulse power capacitors market.Here,an ultrahigh energy storage density of~13.8 J cm^(-3)and a large efficiency of~82.4%are achieved in high-entropy lead-free relaxor ferroelectrics by increasing configuration entropy,named high-entropy strategy,realizing nearly ten times growth of energy storage density compared with low-entropy material.Evolution of energy storage performance and domain structure with increasing configuration entropy is systematically revealed for the first time.The achievement of excellent energy storage properties should be attributed to the enhanced random field,decreased nanodomain size,strong multiple local distortions,and improved breakdown field.Furthermore,the excellent frequency and fatigue stability as well as charge/discharge properties with superior thermal stability are also realized.The significantly enhanced comprehensive energy storage performance by increasing configuration entropy demonstrates that high entropy is an effective but convenient strategy to design new high-performance dielectrics,promoting the development of advanced capacitors.

Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy

This article explores tile effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn- 9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-gZn solder alloy.

Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn,in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder.With the increases of output power of diode-laser,the shear force and the microstructures change obviously.The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method,so the shear force is also higher than that using IR reflow soldering method.When the output power value of diode-laser is about 41.0 W,the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

Ultrasensitive and stable X-ray detection using zero-dimensional lead-free perovskites

Sensitive and reliable X-ray detectors are essential for medical radiography,industrial inspection and security screening.Lowering the radiation dose allows reduced health risks and increased frequency and fidelity of diagnostic technologies for earlier detection of disease and its recurrence.Three-dimensional(3 D)organic-inorganic hybrid lead halide perovskites are promising for direct X-ray detection-they show improved sensitivity compared to conventional X-ray detectors.However,their high and unstable dark current,caused by ion migration and high dark carrier concentration in the 3 D hybrid perovskites,limits their performance and long-term operation stability.Here we report ultrasensitive,stable X-ray detectors made using zero-dimensional(0 D)methylammonium bismuth iodide perovskite(MA3Bi2I9)single crystals.The 0 D crystal structure leads to a high activation energy(Ea)for ion migration(0.46 e V)and is also accompanied by a low dark carrier concentration(~10^6 cm^-3).The X-ray detectors exhibit sensitivity of 10,620μC Gy-1 air cm-2,a limit of detection(Lo D)of 0.62 nG yairs-1,and stable operation even under high applied biases;no deterioration in detection performance was observed following sensing of an integrated X-ray irradiation dose of^23,800 m Gyair,equivalent to>200,000 times the dose required for a single commercial X-ray chest radiograph.Regulating the ion migration channels and decreasing the dark carrier concentration in perovskites provide routes for stable and ultrasensitive X-ray detectors.

Formation of Bulk Intermetallic Compound AgaSn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

Sn-Ag alloy system has been regarded as one of the most promising lead-free solder to substitute conventional Sn- Pb eutectic solder. But the formation of bulk Ag3Sn intermetallic compounds （IMCs） during reflow and post heat treatment significantly influences the performance of the solder joints. With an effort to clarify its microstructural evolution as a function of slow cooling rates, the fraction of bulk IMCs within the slowly solidified Sn-4.0 wt pct Ag solder was investigated by standard metallographic and compared with that detected by thermal analysis. It was found that the bulk IMCs fraction determined by thermal analysis corresponds quite well with the microstructure observation results. In accordance with the conventional solidification theory, the lower the applied cooling rate, the fewer the amount of bulk Ag3Sn IMCs formed in Sn-4.0 wt pct Ag alloy. In addition, Vickers hardness measurement results indicated that the relative coarse eutectic Ag3Sn IMCs distributing in the lamellar eutectic structure favored the improvement of the mechanical performance.

Effects of Ga,Al,Ag,and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solder

An orthogonal method was used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wetting balance method. The results show that the optimal loading of Ga, Al, Ag, and Ce was 0.2 wt.%, 0.002 wt.%, 0.25 wt.%, and 0.15 wt.%, respectively. Intermetallic compounds （IMCs） formed at the interface between Sn-9Zn-0.2Ga-0.002Al-0.25Ag- 0.15Ce solder and Cu substrate were investigated by scanning electron microscope （SEM） and energy dispersive spectroscopy （EDS） analysis. The SEM images illustrate that the IMCs can be divided into two portions from the substrate side to the solder side： a planar CusZns layer and an additional continuous scallop-like AgZn3 layer. The EDS analysis also shows that Ga segregates in the solder abutting upon the interface. X-ray photoelectron spectroscopy （XPS） and Auger electron spectroscopy （AES） of the surface components of Sn-9Zn-0.2Ga-0.002Al- 0.25Ag-0.15Ce solder indicate that Al aggregates at the surface in the form of Al203 protective fdm, which prevents the further oxidation of the solder surface. On the other hand, Ce aggregates at the subsurface, which may reduce the surface tension of the solder and improve the wettability in consequence.

Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6 Cu-0.05 Ni-Ge（SCNG） lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x（x=Ag, Bi, In, Sb） solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG-x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.

Research progress in lead-less or lead-free three-dimensional perovskite absorber materials for solar cells

The trend toward lead-free or lead-less perovskite solar cells(PSCs) has attracted increasing attention over the past few years because the toxicity of lead(Pb) is one of the substantial restrictions for large-scale applications. Researchers have investigated the viability of substituting Pb with other elements(group 14 elements, group 2 elements, transition-metal elements, and group 13 and 15 elements) in the three-dimensional(3 D) perovskites by theoretical calculations and experimental explorations. In this paper, recent research progress in Pb-less and Pb-free PSCs on the perovskite compositions, deposition methods, and device structures are summarized and the main problems that hinder the enhancement of device efficiency and stability are discussed in detail. To date, the fully Sn-based PSCs have shown a power conversion efficiency(PCE) of 8.12% and poor device stability. However, lead-less PSCs have shown higher PCE and a better stability. In addition, the introduction of double-perovskite materials also draws researchers' attention. We believe that the engineering of elemental composition, perovskite deposition methods, and interfacial modification are critical for the future development of Pb-less and Pb-free PSCs.

Manufacture and Cytotoxicity of a Lead-free Piezoelectric Ceramic as a Bone Substitute—Consolidation of Porous Lithium Sodium Potassium Niobate by Cold Isostatic Pressing

Aim The piezoelectric properties and cytotoxicity of a porous lead-free piezoelectric ceramic for use as a direct bone substitute were investigated. Methodology Cold isostatic pressing （CIP） was applied to fabricate porous lithium sodium potassium niobate （Li0.06Na0.5K0.44） NbO3 specimens using a pore-forming method. The morphologies of the CIP-processed specimens were characterized and compared to those of specimens made by from conventional pressing procedures. The effects of the ceramic on the attachment and proliferation of osteoblasts isolated from the cranium of 1-day-old Sprague- Dawley rats were examined by a scanning electron microscopy （SEM） and metbylthiazol tetrazolium （MTT） assay. Results The results showed that CIP enhanced piezoelectricity and biological performance of the niobate specimen, and also promoted an extracellular matrix-like topography of it. In vitro studies showed that the CIP-enhanced material had positive effects on the attachment and proliferation of osteoblasts. Conclusion Niobate ceramic generated by CIP shows a promise for being a piezoelectric composite bone substitute.

Influence of Cu content on microstructure,grain orientation and mechanical properties of Sn-xCu lead-free solders

The effect of Cu content on the microstructure,grain orientation and mechanical properties of Sn-xCu(x=0-4.0 wt.%)lead-free solder was studied.Results showed that added Cu induced the formation of intermetallic phases.Only theη-Cu;Sn;andε-Cu;Sn phases were present in theβ-Sn matrix.For all contents,the strongly preferred orientation of theβ-Sn phase was formed on the{001}plane.In Sn doped with 1.0 wt.%Cu,theη-Cu;Sn;phase exhibited the preferred orientation of{0001}plane,whereas doping with 3.0 or 4.0 wt.%Cu transformed the preferred orientation to the{010}plane.In addition,only the{0001}and{■}planes were present in theε-Cu;Sn phase.The high Cu contents contributed to an increased number of low-angle boundaries,high residual strain,tensile strength and microhardness.

Effect of Li content on the microstructure and properties of lead-free piezoelectric(K_(0.5)Na_(0.5))_(1-x)Li_xNbO_3 ceramics prepared by SPS

Lead-free piezoelectric （K0.5sNa0.5）1-xLixNbO3 （x = 0at%-20at%） ceramics were synthesized by spark plasma sintering （SPS） at low temperature and the effects of LiNbO3 addition on its crystal structure and properties were also studied. When the Li content was less than 6at%, a single proveskite phase with the similar structure of （K0.5Na0.5）NbO3 was formed; and a secondary phase with K3Li2Nb5O15 structure was observed in the 6at% 〈 x 〈 20at% compositional range. Furthermore, LiNbO3 existed as the third phase when the Li content was higher than 8at%. The grain sizes increased from 200-500 nm to 5-8 μm when the K3Li2Nb5O15 and LiNbO3 like phases were formed. With increasing Li content, the relative density of the ceramics first decreased from 97% to 93% and then kept constant. The piezoelectric coefficient d33, dielectric constant, and planner electromechanical coupling factor exhibited a decreasing tendency with increasing Li content because of the decrease in density and the formation of the secondary phase such as K3Li2Nb5O15 and LiNbO3. The formation of dense microstructure with a single phase is necessary in improving the properties of the （K0.5Na0.5）1-xLixNbO3 ceramics.