Time-dependent effects in transient liquid phase bonding of 304L and Cp-Ti using an Ag-Cu interlayer

One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase(TLP)bonding of CoCuFeMnNi high entropy alloy(HEA)was studied.The TLP bonding was performed using AWS BNi-2 interlayer at 1050℃ with the TLP bonding time of 20,60,180 and 240 min.The effect of bonding time on the joint microstructure was characterized by SEM and EDS.Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time.For samples bonded at 20,60 and 180 min,athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn3Si intermetallic compound.For all samples,theγsolid solution was formed in the isothermal solidification zone of the bonding zone.To evaluate the effect of TLP bonding time on mechanical properties of joints,the shear strength and micro-hardness of joints were measured.The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints.The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min,respectively.

Transient liquid phase bonding of Al 2024 to Ti-6Al-4V alloy using Cu-Zn interlayer

Transient liquid phase bonding of two dissimilar alloys Al 2024 and Ti?6Al?4V using Cu?22%Zn interlayer was carried out at 510 °C under vacuum of 0.01 Pa for various bonding time. In order to characterize the microstructure evolution in the joint zone, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were applied. The results show that joint formation is attributed to the solid-state diffusion of Cu and Zn into Ti?6Al?4V and Al 2024 alloys followed by eutectic formation and isothermal solidification along the Cu?Zn/Al 2024 interface. The hardness of the joints at the interface increases with an increase in bonding time which can be attributed to formation of intermetallic compounds such as Al2Cu, TiCu3, Al4.2Cu3.2Zn0.7, Al0.71Zn0.29, Ti2Cu, TiAl3 and TiZn16 in the joint zone. Moreover, shear strength of the joint reaches the highest value of 37 MPa at bonding time of 60 min.

Transient liquid phase bonding of TiC particulate reinforced magnesium metal matrix composite (TiC_p/AZ91D)

Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times from 5 min to 50 min at bonding temperature of 510 ℃ , the average concentration of copper in the bonded zone decreased, the microstructure in the zone changed from Cu, α-Mg and CuMg2 to α-Mg, CuMg2 and TiC, and mechanical properties of the joint increased. The shear strength of the joint bonded at 510 ℃ for 50 min reached 64 MPa due to the metallurgical bonding of the joint and improving its homogeneity of composition and microstructure. It is favorable to increase the bonding time for improving mechanical properties of TLP bonded magnesium MMC joint.

Dynamic study in partial transient liquid phase bonding of Si_3N_4

Dynamics in partial transient liquid phase bonding (PTLP bonding) of Si_3N_4 ceramic with Ti/Cu/Ti multi-interlayer was systematically studied through micro-analysis of joint interfaces. The results show that growth of reaction layer and isothermal solidification procession do at the same time. Growth of reaction layer and moving of isothermal solidification interface obey the parabolic law governed by the diffusion of participating elements during the PTLP bonding. Coordination of the above two dynamics process is done through time and temperature. When reaction layer thickness is suitable and isothermal solidification process is finished, the high bonding strength at room temperature and high temperature are obtained.

Simultaneous intermetallics suppression and residual-stress relaxation of heat-resistant Nb-interlayer-inserted Ti-6Al-4V/Si_(3)N_(4)joints via one-step transient liquid phase bonding and brazing

This work has successfully proposed a solution to produce robust Nb-interlayer-inserted Ti-6Al-4V/Si_(3)N_(4)joints optimized for a maximum operating temperature of 873 K;transient liquid phase bonding(TLPB)of Ti-6Al-4V/Nb side was carried out with Cu and Ni fillers to suppress brittle intermetallic compounds(IMCs),whereas brazing of Nb/Si_(3)N_(4)side was performed using a highly ductile Ti-added Ag-rich filler for effective residual-stress relaxation.A sound yet simple one-step bonding process incorporating simul-taneous TLPB and brazing was achieved with a relatively short holding time of 10 min at 1213 K.TLPB of Ti-6Al-4V/Nb side with Cu and Ni foils of 2-μm-thick each as a laminated filler suppressed brittle Ti-based IMCs and developed a homogenized microstructure consisting mainly of(α+β)-Ti via isothermal solidification.Meanwhile,brazing of Nb/Si_(3)N_(4)side with 100-μm-thick SILVER-ABA filler(92.75Ag-5Cu-1Al-1.25Ti mass%)foil enhanced interfacial bonding with sufficient total Ti content and accommodated residual stress better than conventional eutectic Ag-Cu-based fillers,and it was verified by finite element analysis with consideration of materials’temperature-dependent elasto-plastic properties.All joints with a bonding area of 10 mm×10 mm were tested via symmetrical four-point bending from room temper-ature(RT)to 873 K fractured from Nb/Si_(3)N_(4)side.When re-heating the joints from RT to 673 K,frac-ture initiation gradually shifted from Si_(3)N_(4)towards interfacial-compounds/Si_(3)N_(4)interface and bending strengths maintained∼220 MPa as weakening of SILVER-ABA filler was compensated by residual-stress relaxation in Si_(3)N_(4).When tested at 873 K,joints fractured mainly across the Ag-rich solid solution in a ductile manner and bending strength degraded by∼20%to 171 MPa as weakening of SILVER-ABA filler dominated.

An efficient method to engage oxide ceramics in low-temperature interfacial reactions: Microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint

Ductile transient liquid phase(TLP)bonding joints reinforced by multiple precipitates were produced using novel pre-sintered coatings and Au-Si fillers;therefore,the highest strength of NiTi/sapphire joints brazed at 460℃ for 30 min reached 72 MPa.The pre-sintering process improved the surface-active of sapphire by forming metastable Ti_(3)O and non-stoichiometric Al_(2)O_(3).The typical brazing seam consisted of O-rich compounds,TiSi_(2),and Ti-Ni-Si,wherein the O-rich phase featured different crystallinity depending on the oxygen content.The sapphire/seam interface was either a nanoscale diffusion region or a Si-rich amorphous layer.The breakdown of the Stokes-Einstein relation(SER)occurred,and the deviation from SER increased with a higher cooling rate.The influence of coating thickness was reflected in(i)the supercooling related to the viscosity and fractional exponent of liquids and(ii)the microstructural change of the joint related to the driving force for crystal growth.This work presented a new strategy for joining ceramics to metals at lower temperatures but using the joint at higher temperatures;furthermore,gave an insight into the microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint.

Transient Liquid Phase Bonding of IN738LC/MBF-15/IN738LC:Solidification Behavior and Mechanical Properties

Transient liquid phase（TLP） bonding of IN738 LC superalloy was carried out using a rapidly solidified MBF-15 Ni-based foil. The effects of bonding temperature（1130–1170 °C） and time（5–120 min） as well as foil thickness（35–140 μm） were studied on the microstructure of joint region and its mechanical properties. The solidification sequence in the joint region was found to be（i） formation of γ solid solution in the isothermally solidified zone, followed by（ii） ternary eutectic of γ ＋ Ni3 B ＋ Cr B, and finally（iii） binary eutectic of γ ＋ Ni3 Si in the athermally solidified zone. Fine Ni3 Si particles were also formed via a solid state transformation within the γ matrix in the vicinity of eutectic products. A deviation of isothermal solidification kinetics from the standard parabolic TLP model was observed by increasing the bonding temperature to 1170 °C, which resulted in the formation of eutectic constituents at the joint centerline.The analysis of mechanical and fractographic test results revealed that the samples with complete isothermal solidification exhibit the highest shear strength, whereas the hard eutectic constituents act as preferential failure sites and lead to a significant reduction in the joint shear strength in samples with incomplete isothermal solidification.

Fabrication of Open-cell Al Foam Core Sandwich by Vibration Aided Liquid Phase Bonding Method and Its Mechanical Properties

The open-cell Al foam core sandwiches（AFCSs） were successfully fabricated by using a specially designed Zn-Al-Cu based filler alloy via vibration aided liquid phase bonding method.The effects of the vibration on the bonding seam were investigated and the bonding strength between Al foam core and solid Al alloy face sheet was tested by shearing tests.The results show that vibration can significantly improve the quality of the bonding and the shearing strength of the bonding seam,which implies that this joining method has a good potential in practical applications.

Microstructure and mechanical properties of transient liquid phase bonding DD5 single-crystal superalloy to CrCoNi-based medium-entropy alloy

This study focuses on the transient liquid phase(TLP)bonding of DD5 single-crystal superalloy to Cr Co Nibased medium-entropy alloy(MEA)using a BNi-2 filler alloy.The microstructure and mechanical properties of the TLP-bonded DD5/MEA joint were evaluated,and the microstructural evolution mechanism was investigated.The formation of the isothermal solidification zone(ISZ)depended on the diffusion of the melting-point depressants(Si and B elements)from the liquid filler into the DD5 and MEA substrates,as well as the dissolution of the substrates.Boron diffused along theγchannel of DD5 and reacted to form M_(5)B_(3)boride,herein referred to as the diffusion-affected zone(DAZ I).Similarly,the Cr_(5)B_(3)boride precipitated in the Ni-rich MEA matrix adjacent to the MEA substrate(i.e.,DAZ II).Additionally,a coherent orientation of[0]_(BCY)//[011]_(FCC)and(002)_(BCY)//(200)_(FCC)was detected between M_(5)B_(3)boride with a body-centered tetragonal(BCT)structure and the face-centered cubic(FCC)matrix.The performance of the joint was dominated by the properties of the bonding seam.As the bonding time increased from 20to 80 min,the athermal solidification zone(including eutectic microstructure)was gradually replaced by the ISZ exhibiting excellent plastic deformation capability,and the shear strength of the joint was improved.The maximum shear strength(752 MPa)was achieved when the eutectic-free joint was bonded at 1050℃ for 80 min.The fracture morphology revealed a mixture mode,indicating the initiation of cracks in the DAZ II,mainly propagating in the ISZ,and passing through the DAZ I.

A two-step transient liquid phase diffusion bonding process of T91 steels

In this study, a two-step heating process is introduced for transient liquid phase （ TLP） diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9／ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend＇s strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.

A study on the two-step transient liquid phase diffusion bonding of K640 superalloy

A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.

Features of microstructure and fracture in the transient liquid phase bonded aluminium-based metal matrix composite joints

Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstructure of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al 2Cu and MgAl 2O 4. It contains more and smaller alumina particulates compared with the base material region. The TLP bonded joints have the tensile strength of 150 MPa ～200 MPa and the shear strength of 70 MPa ～100 MPa . With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate interface and the particulate/matrix interface, and propagate along particulate/matrix interface, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate particulate bond and particulate matrix bond).

Effect of gap size on microstructure of transient liquid phase bonded IN-738LC superalloy

In order to investigate the microstructure evolution and gain complete isothermal solidification time, transient liquid phase （TLP） bonding of IN-738LC superalloy was carried out using powdered AMS 4777 as the filler metal. The influence of gap size and bonding time on the joints was investigated. For example, complete isothermal solidification time for 40μm gap size was obtained as 45 min. In the case of lack of completion of isothermal solidification step, the remained molten interlayer cooled in the bonding zone under non-equilibrium condition andγ–γ′ eutectic phase formed in that area. The relationship between gap size and holding time was not linear. With the increase in gap size, eutectic phase width became thicker. In the diffusion affected zone, a much larger amount of alloying elements were observed reaching a peak. These peaks might be due to the formation of boride or silicide intermetallic. With the increase in gap size, the time required for bonding will increase, so the alloying elements have more time for diffusion and distribution in farther areas. As a result, concentrations of alloying elements decreased slightly with the increase in the gap size. The present bi-phasic model did not properly predict the complete isothermal solidification time for IN-738LC-AMS 4777-IN-738LC TLP bonding system.

Microstructural evaluation of Hastelloy-X transient liquid phase bonded joints:Effects of filler metal thickness and holding time

Transient liquid phase(TLP)bonding was investigated in Hastelloy-X samples with different filler metal thicknesses(20,35,50,65,and 100μm)and holding time(5,20,80,320,and 640 min)to obtain optimum bonding parameters.Microstructural evaluations using electron probe microanalysis(EPMA)and electron backscattered diffraction(EBSD)show that the central eutectic phases present in the athermally solidified zone(ASZ)are Ni_(3)B,Ni_(2)Si,and CrB,and the precipitates formed in the diffusion-affected zone(DAZ)are MoB,CrB_(2),and Mo_(2)B_(5).According to the results,decreasing the filler thickness as well as increasing the holding time helps realize the completion of isothermal solidification and reduction in the density of precipitates in the DAZ,leading to a joint with more uniform properties.Diffusion of boron and silicon to longer distances with increasing holding time causes the removal of Cr-rich borides in the DAZ and the formation of Mo-rich silicide at the joint interface.Decrease in hardness of ASZ and DAZ due to the elimination of brittle phases in these zones during long holding time causes more uniform hardness distribution in the joint area.The best results are obtained for the sample joined with the 35μm-thick filler metal for 640 min holding time.

Effect of bonding parameters on microstructures and properties during TLP bonding of Ni-based super alloy

Ni-based alloy was transient liquid phase bonded using a BNi-2 interlayer. The effect of bonding parameters on the microstructures and mechanical properties of the joints was investigated. With the increase of bonding temperature or time, the number of Ni-rich and Cr-rich borides and the grain size of precipitation zone decrease. Higher bonding temperature or longer bonding time is beneficial to the diffusion of melting point depressant elements （B and Si） from the PZ to the base metal and atomic interdiffusion between the base metal and the joint. The chemical composition and microstructure of the joints bonded at 1170 ℃ for 24 h are comparable to the base metal. The shear test results show that both the room and elevated temperature shear-strengths of the joints increase with increasing bonding time. However, the effect of bonding time on elevated temperature tensile-shear strength is greater than on room temperature tensile-shear strength.

Role of interlayer composition in microstructure and mechanical properties during TLP bonding of GTD-111/IN-718 superalloys

An investigation was carried out to assess the applicability of transient liquid phase bonding of two dissimilar super-alloys with different interlayers. The effect of using three types of interlayer such as BNi-2, BNi-3, and BNi-9 on microstructure and mechanical properties was studied in the GTD-111/IN-718 system at 1100 ℃ for different bonding time. To determine the compositional changes and microstructure in the joint region, field emission scanning electron microscopy equipped with energy dispersive spectroscopy was utilized. The formation of Ni_(3)B in the athermally solidified zone(ASZ) is controlled by the B content and, accordingly, the morphology of Ni_(3)Si is governed by the Si content. The Cr content might impede the relocation of B from the interlayer into the base metal and the formation of CrB inside the ASZ is dominated by the Cr content. The high micro-hardness of the eutectic compounds is originated from the formation of boride matrixes such as Ni or Cr boride. The shear strength of the joint using BNi-9 after the completion of isothermal solidification is lower compared that that using BNi-3 and BNi-2, which could be related to the absence of Si in the filler metals constituent and the significant presence of Cr in BNi-9.

TLP bonding of alumina ceramic and 5A05 aluminum alloy using Ag-Cu-Ti interlayer

In order to join alumina ceramic to 5A05 aluminum alloy and obtain the excellent airtightness of joints whose maximum service temperature is 623 K, transient liquid phase （TLP） bonding technique was ,investigated using Ag-Cu-Ti alloy as interlayer. The wetting experimental results confirm that Ti can react with alumina ceramic at 833 K by adding 2 wt.% Ti in Sn. But during bonding alumina ceramic and 5A05 aluminum alloy with Ag-Cu-Ti interlayer at 833 K, Ti preferentially reacts with Al and there is no reaction layer on alumina ceramic/Ag-Cu-Ti interface, which finally results in a poorly airtight joint.

Development of Al-12Si-xTi system active ternary filler metals for Al metal matrix composites

To improve the wettability of Al metal matrix composites（Al-MMCs） by common filler metals,Al-12Si-xTi（x=0.1,0.5,1,3.0;mass fraction,%） system active ternary filler metals were prepared.It was demonstrated that although the added Ti existed within Ti（Al1-xSix）3（0≤x≤0.15） phase,the shear strength and shear fracture surface of the developed Al-12Si-xTi brazes were quite similar to those of traditional Al-12Si braze due to the presence of similar microstructure of Al-Si eutectic microstructure with large volume fraction.So,small Ti addition（～1%） did not make the active brazes brittle and hard compared with the conventional Al-12Si braze.The measured melting range of each Al-12Si-xTi foil was very similar,i.e.,580-590 ℃,because the composition was close to that of eutectic.For wettability improvement,with increasing Ti content,the interfacial gap between the Al2O3 reinforcement and filler metal（R/M） could be eliminated,and the amount of the remainder of the active fillers on the composite substrate decreased after sessile drop test at 610 ℃ for 30 min.So,the wettability improvement became easy to observe repeatedly with increasing Ti content.Additionally,the amount and size of Ti（AlSi）3 phase were sensitive to the Ti content（before brazing） and Si content（after brazing）.

Development of three kinds of active ternary filler metals of AI-Si-Ti, Zn-AI-Ti and Cu-AI-Ti systems for AI metal matrix composites

To improve the wettability of common fiUer metals on Al metal matrix composites （ AI-MMCs ） , three kinds of active ternary filler metals, Al-Si-Ti, Zn-Al-Ti and Cu-Al-Ti systems, were prepared by the addition of Ti. Excessive melting temperature made the gravity segregation of Ti remarkable in ingot. The effect of Ti content on the melting point for AI-Si-Ti ternary system was not as sensitive as that for Al-Ti binary system. The Al-12Si-1Ti filler metal showed good ability to form brazing foil during rapid cooling, ductile fracture surface and similar shear strength to conventional Al-12Si filler metal. Moreover, the Al2 03 reinforcements on initial surface could be covered by the Al-12Si-1Ti filler metal without interfacial gaps after sessile drop test. For Zn-9.5Al-0. 5 Ti braze alloy, severe vaporization of Zn and severe segregation of Ti Occurred. During wettability test for traditional Al-12Si and Zn-9.5Al-0. 5Ti, although some Si or Zn could penetrate into the composite, interfacial gap still remained. The prepared Cu-19Al-1 Ti interlayer consisted of primary phase of Al4Cu9 and network Cu-Al-Ti ternary intermetaUic compound, showing poor ability to form foil and very brittle nature. These results demonstrated that Al-Si-Ti system should be promising for Al-MMCs.