CUTTING REGULARITY AND DISCHARGE CHARACTERISTICS BY USING COMPOSITE COOLING LIQUID IN WIRE CUT ELECTRICAL DISCHARGE MACHINE WITH HIGH WIRE TRAVELING SPEED

The analysis of cutting regularity is provided through using and comparing two typical cooling liquids. It is proved that cutting regularity is greatly affected by cooling liquid＇s washing ability. Discharge characteristics and theoretic analysis between two electrodes are also discussed based on discharge waveform. By using composite cooling liquid which has strong washing ability, the efficiency in the first stable cutting phase has reached more than 200 mm^2/min, and the roughness of the surface has reached Ra〈0.8 μm after the fourth cutting with more than 50 mm^2/min average cutting efficiency. It is pointed out that cutting situation of the wire cut electrical discharge machine with high wire traveling speed （HSWEDM） is better than the wire cut electrical discharge machine with low wire traveling speed （LSWEDM） in the condition of improving the cooling liquid washing ability. The machining indices of HSWEDM will be increased remarkably by using the composite cooling liquid.

Capillary Property of Entangled Porous Metallic Wire materials and Its Application in Fluid Buffers:Theoretical Analysis and Experimental Study

Strong impact does serious harm to the military industries so it is necessary to choose reasonable cushioning material and design effective buffers to prevent the impact of equipment.Based on the capillary property entangled porous metallic wire materials(EPMWM),this paper designed a composite buffer which uses EPMWM and viscous fluid as cushioning materials under the low-speed impact of the recoil force device of weapon equipment(such as artillery,mortar,etc.).Combined with the capillary model,porosity,hydraulic diameter,maximum pore diameter and pore distribution were used to characterize the pore structure characteristics of EPMWM.The calculation model of the damping force of the composite buffer was established.The low-speed impact test of the composite buffer was conducted.The parameters of the buffer under low-speed impact were identified according to the model,and the nonlinear model of damping force was obtained.The test results show that the composite buffer with EPMWM and viscous fluid can absorb the impact energy from the recoil movement effectively,and provide a new method for the buffer design of weapon equipment(such as artillery,mortar,etc.).

Force Modeling for Ultrasonic-assisted Wire Saw Cutting SiC Monocryatal Wafers

The advantages, such as a small cutting force, narrow kerf and little material waste make wire saw cut- ting suitable for machining precious materials like SiC, Si monocrystal and a variety of gem. As regards wire saw cutting fo wafer, however, in traditional wire saw cutting process, the cutting efficiency is low, the wear of wire saw is badly, the surface roughness of wafer is poor etc, which have a seriously impact on the cutting process stability and the use of wafers. Ultrasonic-assisted machining method is very suitable for processing a variety of non-conduc- tive hard and brittle materials, glass, ceramics, quartz, silicon, precious stones and diamonds, etc. In this paper, the force model of ultrusonic-assisted wire saw cutting of SiC monocrystal wafer, based on the kinematic and experi- mental analysis were established. The single factor and orthogonal experimental scheme for different processing pa- rameters such as wire saw speed, part rotation speed of and part feed rate, were carried out in traditional wire saw and ultrasonic-assisted wire saw cutting process. The multiple linear regression method is used to establish the static model among the cutting force, processing parameters and ultrasonic vibration parameters, and the model signifi- cance is verified. The results show, as regards ultrasonic-assisted wire saw cutting of SiC monicrystal wafer, both the tangential and normal cutting forces can reduce about 24. 5%-36% and 36. 6%-40%.

Cutting Characteristics of CFRP Boards Using Electroplated Diamond Wire Tools

CFRP （carbon fiber reinforced plastic）, which is composed of carbon fibers in a resin matrix, is an extremely strong and light composite material that has found use in the aerospace and automotive industries. CFRP boards are very difficult to machine using common machining processes. Various machining artifacts, such as burrs and delamination, occur frequently when machining CFRP. Adequate techniques for machining CFRP have not yet been established. Recently, electroplated diamond wire machining technology has found use in cutting hard, brittle materials such as silicon and sapphire. In this study, we used an electroplated diamond wire saw to cut a CFRP workpiece. We quantified the cutting forces imposed on the workpiece and observed the surface state of the workpiece after cutting. We demonstrated that an electroplated diamond wire tool is suitable for the high-quality machining of CFRP boards.

Challenges in Processing Diamond Wire Cut and Black Silicon Wafers in Large-Scale Manufacturing of High Efficiency Solar Cells

Texturing of diamond wire cut wafers using a standard wafer etch process chemistry has always been a challenge in solar cell manufacturing industry. This is due to the change in surface morphology of diamond wire cut wafers and the abundant presence of amorphous silicon content, which are introduced from wafer manufacturing industry during sawing of multi-crystalline wafers using ultra-thin diamond wires. The industry standard texturing process for multi-crystalline wafers cannot deliver a homogeneous etched silicon surface, thereby requiring an additive compound, which acts like a surfactant in the acidic etch bath to enhance the texturing quality on diamond wire cut wafers. Black silicon wafers on the other hand require completely a different process chemistry and are normally textured using a metal catalyst assisted etching technique or by plasma reactive ion etching technique. In this paper, various challenges associated with cell processing steps using diamond wire cut and black silicon wafers along with cell electrical results using each of these wafer types are discussed.

An Analysis of the Formation Mechanisms of Abrasive Particles and Their Effects on Cutting Efficiency

Magnetic induction-free abrasive wire sawing(MIFAWS)is a method that combines magnetic fields with traditional free abrasive wire sawing technologies.Magnetic abrasive particles(MAPs)are attracted on a magnetized wire,thus leading to an increase in their number into the cutting zone.The number of instantaneous-effective abrasive particles(IEAPs)adsorbed on the wire surface has a great influence on the cutting efficiency of the saw wire.In this study,a mathematic model of the movement of the MAP is presented,and the factors influencing the IEAPs number,including slurry-supply speed and slurry dynamic viscosity,are investigated both by means of simulation analysis and experiments.The results indicate that the number of IEAPs decreases with an increase in the slurry supply speed.The cutting efficiency increases gradually with the increase of slurry supply speed,but the growth rate of wire saw cutting efficiency slows down when the slurry supply speed exceeds a given threshold.The number of IEAPs adsorbed by saw wire increases with a decrease in the dynamic viscosity of the cutting fluid,while the cutting efficiency first increases and then decreases.The cutting efficiency attains its highest value when the dynamic viscosity of the cutting fluid is 0.0047 Pa⋅s.The experimental results agree with the simulation results,and provide some guidance for the practical application of the MIFAWS process.

DK7725E CNC Wire Cut EDM

The machine,a silver medal winnerfrom the state,is produced by theChangfeng Machinery General Factory.The products have been sold in the UK,Poland,Australia,Thailand,Singapore,

Surface Damage in Wire cut Silicon Wafers

The surface damage and the damage depth in wire-cut silicon wafers and inner-diameter (ID) cut silicon wafers were studied by means of thickness meter, scanning electron microscopy (SEM) and double crystal X-ray diffractometer. The results show that the surface of wire-cut silicon wafers is rougher than that of ID-cut silicon wafers and the surface damage in wire-cut silicon wafers is more serious than that in ID-cut silicon wafers, while the damage depth in wire-cut silicon wafers is smaller than that in ID-cut silicon wafers. The possible reasons for the generation of surface damage in wire-cut silicon wafers were also discussed.

Over Voltage Fault due to Disconnection of Consumer’s Transformer Neutral Wire

Practically,the load currents in three phases are asymmetric in the power system.It means that the impedances are different in all three phases.If the consumer’s transformer neutral cut off and/or was disconnected from the neutral of power supply source,then there will be some trouble and failure occurred.The current in the neutral wire drops down to zero when the neutral wire is cut off and the phase currents of all three-phase equal to each other since there was no return wire.The currents are equal but the voltages at the phase consumers are different.Especially for residential single-phase consumers,the voltage at the consumers of the phase varies differently for three phase systems when the neutral wire was disconnected at consumer side and even the voltage at the consumers one or two of those three phases becomes over nominal voltage or reaches nearly line voltage.In this case,the electronic appliances in that phase will be fed by high voltage than the rated value and they can be broken down.In the power system of UB(Ulaanbaatar)city,there are some occasional such kind of failures every year.Obviously,many electronic appliances were broken down due to high voltage and the electricity utility companies respond for service charge of damaged parts.

T/CMTBA 1010—2021《数控往复走丝电火花线切割机床性能评价规范》团体标准解读

介绍了《数控往复走丝电火花线切割机床性能评价规范》团体标准的制定背景、目的和主要内容,并在检验项目、关键指标等方面与现行行业标准进行了比对,解读了该团体标准的先进性、科学性和实用性。

慢走丝线切割成本估算研究

慢走丝线切割中,零件表面质量要求越高,相应加工时间也就越长,加工时间的长短直接影响加工成本。通过引入粗糙度系数的概念,将加工总时间折算为与切割加工相关的时间,建立了慢走丝线切割成本估算模型,并采用切割实验验证了粗糙度对加工时间仅有较小的影响,合理降低了粗糙度系数取值。最后运用构建的成本模型计算某工件的加工成本,验证了该模型的合理性。

高速线切割机床上丝辅助装置设计

现有高速线切割机床的上丝装置在上丝过程中易发生断丝与张紧力不均衡现象,降低了机床切削稳定性和工件加工质量。通过分析现有装置的结构,提出增加推力球轴承,以防止锁紧螺母跟转而导致储丝盘卡顿引起断丝;根据丝线的拉力计算出弹簧压缩量及其他相关参数。经I-DEAS软件建模、装配、仿真表明,该装置可以满足生产要求。

基于响应面与狼群算法的电火花线切割加工性能与放电能耗建模及优化

结合电火花线切割加工绿色、精密、高效的发展趋势,提出面向加工性能与放电能耗的电火花线切割加工工艺建模与多目标优化方法。针对电火花线切割加工GH4169高温合金材料开展正交试验设计,以脉冲宽度、放电间隙、管数、加工限速为输入,以放电能耗EEV、表面粗糙度Ra和材料去除率MRR为输出,构建了电火花线切割加工性能与放电能耗多目标优化响应面模型,并采用改进的狼群算法对模型进行优化求解。优化结果与实验结果对比表明,Ra、EEV和MRR的平均误差均不高于10%,且随机优化实验结果优于75%以上的正交试验设计的实验结果,验证了优化模型及求解方法的有效性。

分层供液电火花线切割加工研究

分别采用常规供液和分层供液对缸筒类零件进行电火花线切割加工对比试验。结果表明,分层供液可在火花放电全过程实现电极丝顺向运丝加工,解决了常规供液方式下电极丝逆向运丝导致的缸筒类零件内部供液不足的问题;提高了极间工作液流速与流量,增强了排屑能力,扩大了放电间隙,改善了极间放电条件,从而提高了火花放电效率和稳定性,对工件切割速度的提高和表面加工质量的改善有重要意义。

基于故障树的单向走丝电火花线切割机床故障诊断

为提高单向走丝电火花线切割机床使用寿命和加工效率,减少并预防故障事件的发生,提高机床的工作效率。应用故障树分析软件建立故障树模型,并进行定性、定量和蒙特卡罗仿真分析,确定单向走丝电火花线切割机床故障模式。通过定性分析得到93个最小割集,定量分析得出100件底事件结构重要度优先顺序,蒙特卡罗仿真分析得到100件底事件模式重要度优先顺序。综合得出单向走丝电火花线切割机床发生故障时优先考虑的事件,进一步分析对机床工作影响最大的底事件类型并提出解决方案或预防措施,对其他系列机床乃至其故障研究都可提供参考。

基坑盖板下逆作车站地下连续墙托换破除技术

附属结构与地铁车站连通常需要对地下连续墙进行破除,当地下连续墙上设有临时承重盖板时破除的施工难度更大,风险更高。以某地铁盖挖逆作车站的地下连续墙破除施工为依托,提出了利用局部破除体作为临时竖向支撑进行托换破除的施工方法。首先,采用数值计算分析了不同托换间距对盖板结构体系的受力影响,综合施工进度和作业空间考虑,确定预留1m宽的临时托换柱和不大于12m的破除间距为控制指标,能够满足各受力结构体系在临时托换施工下的承载性能要求;其次,对盖板下地下连续墙破除及切割块转运施工进行了详细分析,给出了分块尺寸、切割块吊装、预留柱节点等关键施工环节的控制指标与做法。实施结果表明:利用既有地下连续墙作为临时托换结构进行破除地下连续墙的施工方法,安全可靠,施工速度快,成本经济。

高速铁路隧道轨道板上拱切割落道施工技术

某隧道仰拱在地质构造应力及承压富水环境的综合作用下,CRTSⅠ型双块式无砟轨道道床板出现上拱变形和平面移位,最大上拱变形值达47.1 mm,最大横向移位达10 mm,超出常规扣件可精调的范围。本文提出了一种利用绳锯切割仰拱填充(即找平层),以实现道床板与下部隧道结构分离落道的施工方法,利用千斤顶、水平顶推装置、气垫等方式进行道床板平面位置或高程姿态调整。结果表明:该技术避免了因道床板及仰拱填充层大拆大换造成的行车中断,降低了拆除和重建成本,保证了无砟轨道结构整体性受力,经济、社会效益显著。研究成果可为类似道床板线性大尺度偏位处理提供借鉴。

基于Towedm数控线切割编程系统的上下异形零件加工

分析了上下异形零件的线切割加工原理,基于Towedm数控线切割编程系统介绍上下异形零件的编程与加工的方法.基于DK7720电火花数控线切割机床的Towedm数控线切割编程系统,以上表面为圆和下表面为正六边形复合的典型上下异形零件加工任务为例,对其进行绘图编程、生成加工轨迹和3B格式的数控程序以及进行线切割加工和分析.

防切割服的研究现状及展望

随着社会的进步,人们越来越重视安全防护,对具有防切割性能的安全防护用纺织品的需求量不断攀升。因此,研发和应用这类产品显得尤为迫切。日常生活中,服装会被锋利的刀刃割损,传统的棉、毛面料不具备防切割功能,与刀刃接触时不仅会割断纤维造成材料浪费,还无法有效的保护皮肤。为了更好地开发防切割服装,综述了防切割服的研究现状。从纤维角度介绍了多种防割性能优越的纤维,如UHMWPE纤维、不锈钢金属丝、芳纶等;从纱线结构角度,介绍了混纺纱、包芯纱和包覆纱的性能;从织物角度介绍了针织、机织和复合织物的性能特点。最后指出了防割服的发展现状与不足之处,以及对未来发展的期望。

基于超声毛细效应的电镀金刚石线切割工作液供给基础研究

薄片化、细线化是太阳能硅片切割的重要发展趋势,有利于光伏行业降本增效、降低发电的度电成本。细线化切割导致硅片间距小于100μm,薄片化则降低硅片抗弯能力,因此硅片间极易发生硅片吸附贴合现象,从而增加了硅片破裂风险。为此,提出将超声波毛细效应用于电镀金刚石线硅片切割,以减少和抑制晶圆吸附。为探究平板间超声波毛细作用规律进而指导工业应用,分别研究了平行板间距、平板与超声水槽底面间距、平板间不平行、表面活性剂、工作液温度和超声作用时间对超声波毛细现象的影响规律。研究结论为工业应用提供了指导,有助于抑制晶圆吸附,减小晶圆弯曲度,降低细线切割硅片的表面裂纹损伤,提高其断裂强度。