Surface Metallization of Glass Fiber(GF)/Polyetheretherketone(PEEK) Composite with Cu Coatings Deposited by Magnetron Sputtering and Electroplating

Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), scanning electron microscopy(SEM), and electron backscatter diffraction(EBSD).The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998.The results show that the Cu coating with a thickness of 30 μm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress,bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.

Structural and magnetic properties of micropolycrystalline cobalt thin films fabricated by direct current magnetron sputtering

Pure cobalt(Co)thin films were fabricated by direct current magnetron sputtering,and the effects of sputtering power and pres-sure on the microstructure and electromagnetic properties of the films were investigated.As the sputtering power increases from 15 to 60 W,the Co thin films transition from an amorphous to a polycrystalline state,accompanied by an increase in the intercrystal pore width.Simultaneously,the resistivity decreases from 276 to 99μΩ·cm,coercivity increases from 162 to 293 Oe,and in-plane magnetic aniso-tropy disappears.As the sputtering pressure decreases from 1.6 to 0.2 Pa,grain size significantly increases,resistivity significantly de-creases,and the coercivity significantly increases(from 67 to 280 Oe),which can be attributed to the increase in defect width.Corres-pondingly,a quantitative model for the coercivity of Co thin films was formulated.The polycrystalline films sputtered under pressures of 0.2 and 0.4 Pa exhibit significant in-plane magnetic anisotropy,which is primarily attributable to increased microstress.

Preparation and Properties of Cu-Containing High-entropy Alloy Nitride Films by Magnetron Sputtering on Titanium Alloy

Magnetron sputtering deposition with regulated Cu target power was used for depositing Cu-containing high-entropy alloy nitride(Cu-(HEA)N)films on TC4 titanium alloy substrates.The microscopic morphologies,surface compositions,and thicknesses of the films were characterized using SEM+EDS;the anti-corrosion,wear resistance and antibacterial properties of the films in simulated seawater were investigated.The experimental results show that all four Cu-(HEA)N films are uniformly dense and contained nanoparticles.The film with Cu doping come into contact with oxygen in the air to form cuprous oxide.The corrosion resistance of the(HEA)N film without Cu doping on titanium alloy is better than the films with Cu doping.The Cu-(HEA)N film with Cu target power of 16 W shows the best wear resistance and antibacterial performance,which is attributed to the fact that Cu can reduce the coefficient of friction and exacerbate corrosion,and the formation of cuprous oxide has antibacterial properties.The findings of this study provide insights for engineering applications of TC4 in the marine field.

Effects of power on ion behaviors in radio-frequency magnetron sputtering of indium tin oxide(ITO)

This study delves into ion behavior at the substrate position within RF magnetron discharges utilizing an indium tin oxide(ITO)target.The positive ion energies exhibit an upward trajectory with increasing RF power,attributed to heightened plasma potential and initial emergent energy.Simultaneously,the positive ion flux escalates owing to amplified sputtering rates and electron density.Conversely,negative ions exhibit broad ion energy distribution functions(IEDFs)characterized by multiple peaks.These patterns are clarified by a combination of radiofrequency oscillation of cathode voltage and plasma potential,alongside ion transport time.This elucidation finds validation in a one-dimensional model encompassing the initial ion energy.At higher RF power,negative ions surpassing 100 e V escalate in both flux and energy,posing a potential risk of sputtering damages to ITO layers.

Study of bias voltage effect on the performance of ta-C coating prepared by high power impulse magnetron sputtering

The mechanical and frictional properties of ta-C coatings deposited on the substrate surface affect applications in the field of cutting tools and wear-resistant components.In this paper,the effect of bias parameters on the performance of ta-C coatings was investigated based on high power impulse magnetron sputtering(HiPIMS)technology.The results show that bias voltage has a significant effect on the deposition rate,structure,and wear resistance of the coating.In the range of bias voltage−50 V to−200 V,the ta-C coating performance was the best under bias voltage−150 V.The thickness reached 530.4 nm,the hardness value reached 35.996 GPa,and the bonding force in-creased to 14.2 N.The maximum sp3 bond content was 59.53% at this condition.

Facile integration of an Al-rich Al_(1-x)In_(x)N photodetector on free-standing GaN by radio-frequency magnetron sputtering

Al_(1-x)In_(x)N, a Ⅲ-nitride semiconductor material, is currently of great research interest due to its remarkable physical properties and chemical stability. When the Al and In compositions are tuned, its band-gap energy varies from 0.7 eV to 6.2 eV, which shows great potential for application in photodetectors. Here, we report the fabrication and performance evaluation of integrated Al_(1-x)In_(x)N on a free-standing GaN substrate through direct radio-frequency magnetron sputtering.The optical properties of Al_(1-x)In_(x)N will be enhanced by the polarization effect of a heterostructure composed of Al_(1-x)In_(x)N and other Ⅲ-nitride materials. An Al_(1-x)In_(x)N/Ga N visible-light photodetector was prepared by semiconductor fabrication technologies such as lithography and metal deposition. The highest photoresponsivity achieved was 1.52 A·W^(-1)under 365 nm wavelength illumination and the photodetector was determined to have the composition Al0.75In0.25N/GaN.A rise time of 0.55 s was observed after transient analysis of the device. The prepared Al_(1-x)In_(x)N visible-light photodetector had a low dark current, high photoresponsivity and fast response speed. By promoting a low-cost, simple fabrication method,this study expands the application of ternary alloy Al_(1-x)In_(x)N visible-light photodetectors in optical communication.

Effect of substrate temperature and oxygen plasma treatment on the properties of magnetron-sputtered CdS for solar cell applications

Cadmium sulfide(CdS)is an n-type semiconductor with excellent electrical conductivity that is widely used as an electron transport material(ETM)in solar cells.At present,numerous methods for preparing CdS thin films have emerged,among which magnetron sputtering(MS)is one of the most commonly used vacuum techniques.For this type of technique,the substrate temperature is one of the key deposition parameters that affects the interfacial properties between the target film and substrate,determining the specific growth habits of the films.Herein,the effect of substrate temperature on the microstructure and electrical properties of magnetron-sputtered CdS(MS-CdS)films was studied and applied for the first time in hydrothermally deposited antimony selenosulfide(Sb_(2)(S,Se)_(3))solar cells.Adjusting the substrate temperature not only results in the design of the flat and dense film with enhanced crystallinity but also leads to the formation of an energy level arrangement with a Sb_(2)(S,Se)_(3)layer that is more favorable for electron transfer.In addition,we developed an oxygen plasma treatment for CdS,reducing the parasitic absorption of the device and resulting in an increase in the short-circuit current density of the solar cell.This study demonstrates the feasibility of MS-CdS in the fabrication of hydrothermal Sb_(2)(S,Se)_(3)solar cells and provides interface optimization strategies to improve device performance.

Exploring negative ion behaviors and their influence on properties of DC magnetron sputtered ITO films under varied power and pressure conditions

We deposited indium-tin-oxide(ITO)films on silicon and quartz substrates by magnetron sputtering technology in pure argon.Using electrostatic quadrupole plasma diagnostic technology,we investigate the effects of discharge power and discharge pressure on the ion flux and energy distribution function of incidence on the substrate surface,with special attention to the production of high-energy negative oxygen ions,and elucidate the mechanism behind its production.At the same time,the structure and properties of ITO films are systematically characterized to understand the potential effects of high energy oxygen ions on the growth of ITO films.Combining with the kinetic property analysis of sputtering damage mechanism of transparent conductive oxide(TCO)thin films,this study provides valuable physical understanding of optimization of TCO thin film deposition process.

Synthesis of One-Dimensional ZnO Na norods by Oxidating Zinc Films Deposited with Magnetron Sputtering

One-dimensional ZnO nanorods are synthesized by ox idating thin metal zinc films deposited on Si(111) substrates with radio frequen cy magnetron sputtering.The crystal structure,surface morphology,and optical pro perties of nanorods are investigated.X-ray diffraction(XRD) pattern,scanning el ectron microscopy(SEM),and transmission electron microscopy(TEM) analyses show t hat the synthesized single-crystal ZnO nanorods develop like hairpins along dif ferent radials,with a hexagonal wurtzite structure.The diameters of nanorods ran ge between 30 and 60nm and lengths up to micrometers.Photoluminescence(PL) analy sis shows that,under 280nm light excitation,a strong and sharp near band-edge U V light emission band at 372nm and a relatively weak green deep-level light emi ssion band at 516nm are observed from the ZnO nanorods,which indicates excellent crystallization and optical quality of the fabricated ZnO nanorods.

Structural and optoelectronic properties of AZO thin films prepared by RF magnetron sputtering at room temperature

Al-doped ZnO thin films were prepared on glass substrate using an ultra-high density target by RF magnetron sputtering at room temperature. The microstructure, surface morphology, optical and electrical properties of AZO thin films were investigated by X-ray diffractometer, scanning electron microscope, UV-visible spectrophotometer, four-point probe method, and Hall-effect measurement system. The results showed that all the films obtained were polycrystalline with a hexagonal structure and average optical transmittance of AZO thin films was over 85 % at different sputtering powers. The sputtering power had a great effect on optoelectronic properties of the AZO thin films, especially on the resistivity. The lowest resistivity of 4.5×10^-4 Ω·cm combined with the transmittance of 87.1% was obtained at sputtering power of 200 W. The optical band gap varied between 3.48 and 3.68 eV.

Properties of W/DLC/W-S-C composite films fabricated by magnetron sputtering

A kind of W/DLC/W-S-C composite film was fabricated by magnetron sputtering method.Effects of WSx content on the structure and the adhesion of the composite films were investigated.In addition,tribological behavior of the composite films was studied in the conditions of the ambient air and N2 gas atmosphere by ball-on-disk tester.The results indicate that the composite films show dense and amorphous microstructure.The WCx and WSx compounds are found in amorphous diamond like carbon matrix in the top layers of W-S-C.A proper WSx content is beneficial for improving the adhesion of the composite films.In air atmosphere,the composite films with high C content have better wear resistance and the friction coefficients range from 0.15 to 0.25.In N2 condition,high WSx content is benefit for the wear resistance and the friction coefficients of the composite films range from 0.03 to 0.1.

Effect of bias voltage on compositional, mechanical and corrosion property of ZrNbAlN multilayer films by unbalanced magnetron sputtering

Nano-scaled ZrNbAlN films with different negative bias voltages（Vb） were deposited on bronze substrate and Si（100） wafers by a reactive unbalanced magnetron sputtering technique. Composition and structure properties were characterized by X-ray photoelectron spectroscopy and X-ray diffraction. It is found that mole concentrations of Zr and Nb are affected by Vb, which leads to the increase of binding energy of N 1s and Al 2p and decrease of binding energy of Zr 3d5/2 and Nb 3d5/2. Surface morphologies evolution controlled by Vb could be observed. Furthermore, X-ray diffraction patterns reveal that these films show a（111） preferred orientation. Moreover, mechanical property and corrosion behavior of ZrNbAlN films were characterized by nanoindentation test and corrosion test, respectively. A maximum value of 21.85 GPa at-70 V occurs in the ZrNbAlN- bronze system, which outperforms uncoated bronze. Corrosion experiments in 0.5 mol/L NaCl and 0.5 mol/L HCl solution show that corrosion potential and corrosion current are dependent on Vb, and better anti-corrosion property could be obtained at-90 V.

Microstructures of TiN,TiAlN and TiAlVN coatings on AISI M2 steel deposited by magnetron reactive sputtering

In order to study the effect of the microstructure with Al and V added TiN coatings, TiN, TiAlN and TiAlVN coatings were deposited on AISI M2 high-speed steels by magnetron reactive sputtering. The microstructures of all the coatings were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The results indicate that the addition of Al into TiN coatings reduces their lattice constant, but a further addition of V into TiAlN coatings increases their lattice constant. Moreover, the growth morphologies for TiN, TiAlN, and TiAlVN indicate that adding Al and V has a tendency to improve the columnar structure. The (111) and (200) orientations of TiN, TiAlN, and TiAlVN are identified. Theε(Fe3N-Fe2N) phase occurs because a small amount of Fe is present in the coatings. The interlayers of TiAlN and TiAlVN have the preferred (01 1 0) orientation. The texture (columnar) structure of the (111) and (200) orientations is observed in the TiAlN and TiAlVN coatings. An orientation relationship of (01 1 0)α-Ti//(110)T.M occurs between the interlayer and tempered martensite (T.M) in TiAlVN.

Microstructure and Nonlinear Optical Properties of Very Small Size GaAs Nanogranulae Embedded in SiO_2 Matrix by Magnetron Co-Sputtering

Microstructure of GaAs/SiO 2 nanogranular thin films fabricated by radio frequency magnetron co sputtering technique and postannealing are investigated via atomic force microscope,X ray diffraction,and Rutherford backscattering spectroscopy.The results show that GaAs nanocrystals with average diameters from 1 5nm to 3 2nm (depending on the annealing temperature) are uniformly dispersed in the SiO 2 matrices.GaAs and SiO 2 are found in normal stoichiometry in the films.The nonlinear optical refraction and nonlinear optical absorption are studied by Z scan technique using a single Gaussian beam of pulse laser.The third order nonlinear optical refractive index and nonlinear absorption coefficient are enhanced due to the quantum confinement effects and estimated to be 4×10 -12 m 2/W and 2×10 -5 m/W respectively in nonresonant condition,while 2×10 -11 m 2/W and -1×10 -4 m/W respectively in quasi resonant condition.

Structure characteristic and its evolution of Cu-W films prepared by dual-target magnetron sputtering deposition

Immiscible Cu-W alloy thin films were prepared using dual-target magnetron sputtering deposition process. The structure evolution of Cu-W thin films during preparation was investigated by X-ray diffraction, transmission electron microscopy and high resolution transmission electron microscopy. In the initial stage of dual-target magnetron sputtering deposition process, an amorphous phase formed; then it crystallized and the analogy spinodal structure formed due to the bombardment of the sputtered particles during sputtering deposition process, the surface structure of the film without the bombardment of the sputtered particles was the amorphous one, the distribution of the crystalline and amorphous phase showed layer structure. The solid solubility with the analogy spinodal structure was calculated using the Vegard law. For Cu-13.7%W （mole fraction） film, its structure was composed of Cu-ll%W solution, Cu-37%W solution and pure Cu; for Cu 14.3%W film, it was composed of Cu-15%W solution, Cu-38%W solution, and pure Cu; for Cu-18.1%W film, it was composed of Cu-19%W solution, Cu-36% W solution and pure Cu.

Dielectric Properties of ZrTiO4 Thin Films Prepared by Reactive DC Magnetron Co-sputtering

ZrTiO4 is a small ceramic constituent material which has very good thermal and electrical properties. ZrTiO4 thin films were deposited by reactive dc magnetron co-sputtering method. The crystal structure, surface morphology, thickness and dielectric properties were characterized by XRD （X-ray diffraction）, AFM （atomic force microscopy）, FE-SEM （field emission scanning electron microscope）, and precision impedance analyzer respectively. These films were crystallization of the orthorhombic phase （111） of ZrTiOa. The microstructure of well-crystallized ZrTiO4 thin films had the surface morphology was smooth with 1.695 nmrms roughness. The high dielectric constant width decreases from 129.2 to 110.6 when sputtering current increases which are higher more than that had researched because of higher energy but impedance; ｜Z｜ increases from 1.97 to 2.47 kΩ. These results are consistent with the RMS roughness results, which are the RMS roughness decrease with increasing sputtering current.

Influences of working pressure on properties for TiO_2 films deposited by DC pulse magnetron sputtering

TiO2 films were deposited at room temperature by DC pulse magnetron sputtering system.The crystalline structures,morphological features and photocatalytic activity of TiO2 films were systematically investigated by X-ray diffraction（XRD）,atomic force microscopy（AFM） and ultraviolet spectrophotometer,respectively.The results indicated that working pressure was the key deposition parameter in？uencing the TiO2 film phase composition at room temperature,which directly affected its photocatalytic activity.With increasing working pressure,the target self-bias decreases monotonously.Therefore,low temperature TiO2 phase（anatase） could be deposited with high working pressure.The anatase TiO2 films deposited with 1.4 Pa working pressure displayed the highest photocatalytic activity by the decomposition of Methyl Orange solution,which the degradation rate reached the maximum（35%） after irradiation by ultraviolet light for 1 h.

Corrosion and wear resistance of AZ31 Mg alloy treated by duplex process of magnetron sputtering and plasma electrolytic oxidation

In order to improve the wear and corrosion resistance of AZ31 magnesium alloy,a magnetron-sputtered Al layer with a thickness of 11μm was firstly applied on the alloy,and then treated by plasma electrolytic oxidation(PEO)in an aluminate and silicate electrolytes,respectively.The performance of PEO coatings was investigated by dry sliding wear and electrochemical corrosion tests.The aluminate coating exhibits excellent wear resistance under both 10 and 20 N loads.The silicate coating only shows low wear rate under 10 N,but it was destroyed under 20 N.Corrosion tests show that the Al layer after magnetron sputtering treatment alone cannot afford good protection to the Mg substrate.However,the duplex layer of PEO/Al can significantly improve the corrosion resistance of AZ31 alloy.Electrochemical tests show that the aluminate and silicate coatings have corrosion current densities of-1.6×10^(-6) and-1.1×10^(-6) A/cm^(2),respectively,which are two orders lower than that of the un-coated AZ31 alloy.However,immersion tests and electrochemical impedance spectroscopy(EIS)show that the aluminate coating exhibits better long-term corrosion protection than silicate coating.

Effects of substrate temperature and deposition time on the morphology and corrosion resistance of FeCoCrNiMo0.3 high-entropy alloy coating fabricated by magnetron sputtering

The effects of substrate temperature and deposition time on the morphology and corrosion resistance of FeCoCrNiMo0.3 coating fabricated by magnetron sputtering were investigated by scanning electron microscopy and electrochemical tests.The FeCoCrNiMo0.3 coating was mainly composed of the face-centered cubic phase.High substrate temperature promoted the densification of the coating,and the pitting resistance and protective ability of the coating in 3.5wt%NaCl solution was thus improved.When the deposition time was prolonged at 500℃,the thickness of the coating remarkably increased.Meanwhile,the pitting resistance improved as the deposition time increased from 1 to 3 h;however,further improvement could not be obtained for the coating sputtered for 5 h.Overall,the pitting resistance of the FeCoCrNiMo0.3 coating sputtered at 500℃for 3 h exceeds those of most of the reported high-entropy alloy coatings.

Lithium intercalation/de-intercalation behavior of a composite Sn/C thin film fabricated by magnetron sputtering

A tin film of 320 nm in thickness on Cu foil and its composite film with graphite of-50 nm in thickness on it were fabricated by magnetron sputtering. The surface morphology, composition, surface distributions of alloy elements, and lithium intercalation/de-intercalation behaviors of the fabricated films were characterized by X-ray diffraction （XRD）, scanning electron microscopy （SEM）, electron probe microanalyzer （EPMA）, X-ray photoelectron spectroscopy （XPS）, inductively coupled plasma atomic emission spectrometry （ICP）, cyclic voltammetry （CV）, and galvanostatic charge/discharge （GC） measurements. It is found that the lithium intercalation/de-intercalation behavior of the Sn film can be significantly improved by its composite with graphite. With cycling, the discharge capacity of the Sn film without composite changes from 570 mAh/g of the 2nd cycle to 270 mAh/g of the 20th cycle, and its efficiency for the discharge and charge is between 90% and 95%. Nevertheless, the discharge capacity of the composite Sn/C film changes from 575 mAh/g of the 2nd cycle to 515 mAh/g of the 20th cycle, and its efficiency for the discharge and charge is between 95% and 100%. The performance improvement of tin by its composite with graphite is ascribed to the retardation of the bulk tin cracking from volume change during lithium intercalation and de-intercalation, which leads to the pulverization of tin.