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Editorial: Special subject on the mechanical behavior of thermal protection materials and structures 被引量:2
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作者 Songhe Meng Huimin Xie 《Theoretical & Applied Mechanics Letters》 CAS 2014年第2期17-18,共2页
The thermal protection materials and structures are widely used in hypersonic vehicles for the purpose of thermal insulation, and their mechanical behavior is one of the key issues in design and manufacture of hyperso... The thermal protection materials and structures are widely used in hypersonic vehicles for the purpose of thermal insulation, and their mechanical behavior is one of the key issues in design and manufacture of hypersonic vehicles. It is our great pleasure to present the seven papers in this special subject of Theoretical & Applied Mechanics Letters (TAML) and introduce the recent progresses on the mechanical behavior of thermal protection materials and structures by the authors. 展开更多
关键词 SIC Special subject on the mechanical behavior of thermal protection materials and structures EDITORIAL
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Editorial: Special subject on the mechanical behavior of fire dynamics in high-rise buildings
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作者 Jinhua Sun Longhua Hu 《Theoretical & Applied Mechanics Letters》 CAS 2014年第3期61-62,共2页
With rapid economic and social development in China, high-rise buildings have continuously sprung up since 2006. However, several big fire accidents in high-rise buildings such as the Beijing Television Cultural Cente... With rapid economic and social development in China, high-rise buildings have continuously sprung up since 2006. However, several big fire accidents in high-rise buildings such as the Beijing Television Cultural Center fire in 2009 and the Shanghai Jing'an District fire in 2010 etc. have claimed people's lives and caused huge amounts of economic and property losses, 展开更多
关键词 HIGH EDITORIAL Special subject on the mechanical behavior of fire dynamics in high-rise buildings
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Recent Progress in Understanding the Mechanisms of Pain and Itch:the Second Special Issue 被引量:5
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作者 Ru-Rong Ji 《Neuroscience Bulletin》 SCIE CAS CSCD 2018年第1期1-3,共3页
In 2012, we published the first special issue on mechanisms of pain and itch in Neuroscience Bulletin, which covered the peripheral, central, and glial mechanisms of pain and itch [1-5]. In the last 5 years, the field... In 2012, we published the first special issue on mechanisms of pain and itch in Neuroscience Bulletin, which covered the peripheral, central, and glial mechanisms of pain and itch [1-5]. In the last 5 years, the field has seen tremendous progress in the molecular and functional characterization of primary sensory neurons [6, 7], neurocircuits of pain and itch [8-10], immune and glial modulation of pain and itch [11-15], molecular mechanisms of pain [16, 17], and identification of brain signatures of pain [18]. Thus, it is timely to highlight the recent progress in a second special issue. I invited the previous authors and new authors from China, the USA, and Japan, and they have contributed 20 mini-reviews and original articles to this special issue. 展开更多
关键词 In Recent Progress in Understanding the Mechanisms of Pain and Itch:the Second Special Issue
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