Study of the material removal mechanism of glass-ceramics based on consecutive incremental loading in ductile-regime grinding

Glass-ceramics have many excellent properties and are widely used in various fields. During the grinding process,the workpiece surface is typically subject to material removal by grit of incremental heights, which has rarely been the focus of research. As such, it is necessary to study the material removal mechanism of glass-ceramics under consecutive incremental loading, which more closely reflects the actual grinding process. In this paper,to analyze the plastic deformation and residual stress of lithium aluminosilicate(LAS) glass-ceramics, a finite element model is established based on the Drucker–Prager yield criterion for ductile regimes. A nano-scratch test was also conducted and the test results show that both the residual depth and residual stress increase with an increase in the number of increments, and that consecutive incremental loading promotes the plastic deformation of glass-ceramics and increases the residual stress of the material in the ductile-regime process. These findings provide guidance for achieving higher dimensional accuracy in the actual grinding of glass-ceramics parts.

Material Removal Behavior and Surface Integrity in Grinding of UltrafineGrained WC-Co Materials

Due to the excellent combination of wear resistance and fracture toughness,the ultrafine-grained WC-Co composites can significantly improve the durability and reliability of industrial tools.However,the grinding of ultrafine-grained WC-Co remains a challenge.In order to provide an experimental basis for improving grinding quality of ultrafine-grained WC-Co,a series of surface grinding experiments on ultrafine-grained WC-Co hardmetals were conducted by diamond wheel under various grinding conditions,and the material removal behavior and surface integrity in grinding of ultrafine-grained WC-Co materials were characterized by means of scanning electron microscopy(SEM),X-ray microstress analyzer and surface roughness analyzer in this paper.The results indicate that the material removal behavior in grinding of ultrafine-grained WC-Co materials is determined not only by the abrasive grain size on the wheel,but also by the depth of cut.The roughness values of ground surface increase with increasing grit size of diamond wheel,and increase initially,then decrease with increase in depth of cut.Grinding causes the residual compressive stress in the surface layer of ground cemented carbides under various grinding conditions;the magnitude of residual surface stress increases with increasing grit size of diamond wheel,and isn't changed obviously along with the change of depth of cut.

Field-assisted machining of difficult-to-machine materials

Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as aviation,semiconductor,biomedicine,and other key fields due to their excellent material properties.However,traditional machining technologies often struggle to achieve ultra-precision with DMMs resulting from poor surface quality and low processing efficiency.In recent years,field-assisted machining (FAM) technology has emerged as a new generation of machining technology based on innovative principles such as laser heating,tool vibration,magnetic magnetization,and plasma modification,providing a new solution for improving the machinability of DMMs.This technology not only addresses these limitations of traditional machining methods,but also has become a hot topic of research in the domain of ultra-precision machining of DMMs.Many new methods and principles have been introduced and investigated one after another,yet few studies have presented a comprehensive analysis and summarization.To fill this gap and understand the development trend of FAM,this study provides an important overview of FAM,covering different assisted machining methods,application effects,mechanism analysis,and equipment design.The current deficiencies and future challenges of FAM are summarized to lay the foundation for the further development of multi-field hybrid assisted and intelligent FAM technologies.

Molecular dynamics simulation of the material removal in the scratching of 4H-SiC and 6H-SiC substrates

Single crystal silicon carbide(SiC)is widely used for optoelectronics applications.Due to the anisotropic characteristics of single crystal materials,the C face and Si face of single crystal SiC have different physical properties,which may fit for particular application purposes.This paper presents an investigation of the material removal and associated subsurface defects in a set of scratching tests on the C face and Si face of 4H-SiC and 6H-SiC materials using molecular dynamics simulations.The investigation reveals that the sample material deformation consists of plastic,amorphous transformations and dislocation slips that may be prone to brittle split.The results showed that the material removal at the C face is more effective with less amorphous deformation than that at the Si face.Such a phenomenon in scratching relates to the dislocations on the basal plane(0001)of the SiC crystal.Subsurface defects were reduced by applying scratching cut depths equal to integer multiples of a half molecular lattice thickness,which formed a foundation for selecting machining control parameters for the best surface quality.

Effect of tool geometry on ultraprecision machining of soft-brittle materials:a comprehensive review

Brittle materials are widely used for producing important components in the industry of optics,optoelectronics,and semiconductors.Ultraprecision machining of brittle materials with high surface quality and surface integrity helps improve the functional performance and lifespan of the components.According to their hardness,brittle materials can be roughly divided into hard-brittle and soft-brittle.Although there have been some literature reviews for ultraprecision machining of hard-brittle materials,up to date,very few review papers are available that focus on the processing of soft-brittle materials.Due to the‘soft’and‘brittle’properties,this group of materials has unique machining characteristics.This paper presents a comprehensive overview of recent advances in ultraprecision machining of soft-brittle materials.Critical aspects of machining mechanisms,such as chip formation,surface topography,and subsurface damage for different machining methods,including diamond turning,micro end milling,ultraprecision grinding,and micro/nano burnishing,are compared in terms of tool-workpiece interaction.The effects of tool geometries on the machining characteristics of soft-brittle materials are systematically analyzed,and dominating factors are sorted out.Problems and challenges in the engineering applications are identified,and solutions/guidelines for future R&D are provided.

Hierarchical microstructures with high spatial frequency laser induced periodic surface structures possessing different orientations created by femtosecond laser ablation of silicon in liquids

High spatial frequency laser induced periodic surface structures(HSFLs)on silicon substrates are often developed on flat surfaces at low fluences near ablation threshold of 0.1 J/cm2,seldom on microstructures or microgrooves at relatively higher fluences above 1 J/cm^2.This work aims to enrich the variety of HSFLs-containing hierarchical microstructures,by femtosecond laser(pulse duration:457 fs,wavelength:1045 nm,and repetition rate:100 kHz)in liquids(water and acetone)at laser fluence of 1.7 J/cm^2.The period of Si-HSFLs in the range of 110–200 nm is independent of the scanning speeds(0.1,0.5,1 and 2 mm/s),line intervals(5,15 and 20μm)of scanning lines and scanning directions(perpendicular or parallel to light polarization direction).It is interestingly found that besides normal HSFLs whose orientations are perpendicular to the direction of light polarization,both clockwise or anticlockwise randomly tilted HSFLs with a maximal deviation angle of 50°as compared to those of normal HSFLSs are found on the microstructures with height gradients.Raman spectra and SEM characterization jointly clarify that surface melting and nanocapillary waves play important roles in the formation of Si-HSFLs.The fact that no HSFLs are produced by laser ablation in air indicates that moderate melting facilitated with ultrafast liquid cooling is beneficial for the formation of HSFLs by LALs.On the basis of our findings and previous reports,a synergistic formation mechanism for HSFLs at high fluence was proposed and discussed,including thermal melting with the concomitance of ultrafast cooling in liquids,transformation of the molten layers into ripples and nanotips by surface plasmon polaritons(SPP)and second-harmonic generation(SHG),and modulation of Si-HSFLs direction by both nanocapillary waves and the localized electric field coming from the excited large Si particles.

Mechanical Behavior of Panels Reinforced with Orthogonal Plant Fabrics: Experimental and Numerical Assessment

The construction sector is one of the main sources of pollution,due to high energy consumption and the toxic substances generated during the processing and use of traditional materials.The production of cement,steel,and other conventional materials impacts both ecosystems and human health,increasing the demand for ecological and biodegradable alternatives.In this paper,we analyze the properties of panels made from a combination of plant fibers and castor oil resin,analyzing the viability of their use as construction material.For the research,orthogonal fabrics made with waste plant fibers supplied by a company that deals with the manufacture of furniture and craft products were used.These fabrics were made with strips of plant fibers of the Calamus rotang,Bambusa vulgaris,Heteropsis flexuosa,and Salix viminalis species.To improve their compatibility with the castor oil resin,a cold argon plasma treatment was applied.The effect of the treatment on the properties of the fibers and the panels was analyzed.The density,water absorption capacity,and swelling percentage were evaluated.Tensile,compression,static bending,and linear buckling tests were carried out.The study found that panels made with treated fiber fabrics exhibited a reduction of approximately 10%in absorption capacity and up to 35%in swelling percentage values.Panels made with Bambusa vulgaris fabrics exhibited the highest strength and stiffness values.Numerical models were constructed using commercial finite element software.When comparing the numerical results with the experimental ones,differences of less than 15%were seen,demonstrating that the models allow adequately predicting the analyzed properties.On comparing the values obtained with the characteristic values of oriented strand board,the results suggest that panels made with unconventional materials could replace commercial panels traditionally made with wood-based fibers and particles and other composite materials in several applications in the construction industry.

Plasma-enabled electrochemical jet micromachining of chemically inert and passivating material

Electrochemical jet machining(EJM)encounters significant challenges in the microstructuring of chemically inert and passivating materials because an oxide layer is easily formed on the material surface,preventing the progress of electrochemical dissolution.This research demonstrates for the first time a jet-electrolytic plasma micromachining(Jet-EPM)method to overcome this problem.Specifically,an electrolytic plasma is intentionally induced at the jet-material contact area by applying a potential high enough to surmount the surface boundary layer(such as a passive film or gas bubble)and enable material removal.Compared to traditional EJM,introducing plasma in the electrochemical jet system leads to considerable differences in machining performance due to the inclusion of plasma reactions.In this work,the implementation of Jet-EPM for fabricating microstructures in the semiconductor material 4H-SiC is demonstrated,and the machining principle and characteristics of Jet-EPM,including critical parameters and process windows,are comprehensively investigated.Theoretical modeling and experiments have elucidated the mechanisms of plasma ignition/evolution and the corresponding material removal,showing the strong potential of Jet-EPM for micromachining chemically resistant materials.The present study considerably augments the range of materials available for processing by the electrochemical jet technique.

Recent developments of the high strength and high ductility nanostructured materials

This talk will summarize the recent work related to a kind of new nanomaterials produced by the SMAT (surface mechanical attrition treatment).The concept of surface nanocrystallization of materials will be presented.In terms of the grain refinement mechanism induced by plastic deformation,a novel surface mechanical attrition(SMA) technique was developed for synthesizing a nanostructured surface layer on metallic materials in order to upgrade the overall properties and performance.The grain refinement mechanism of the surface layer during the SMA treatment will be analyzed in terms of the nanostructure observations in several typical materials.Very high yield stress(5 times of the base material) on the surface layer of the material obtained by the SMAT has been observed.The effect of surface nanostructures on the mechanical behavior and on the failure mechanism of metallic material shows the possibility to develop a new strength gradient composite using co-rolling and nitriding.The role of residual stress induced during the treatment will be investigated and discussed.The developed materials are also porosity free materials which can be used as reference material for the local mechanical behavior investigation technique such as the nanoindentation.A general concept for obtaining high strength and high ductility nanostructured materials will be presented.The exceptional high strength and high ductility steels have developed.The simulation of the mechanisms for improving ductility of high strength nanostructured materials will be presented.The potential applications for the land transportation vehicles(car,bus,train) and wind energy have been investigated.Some examples of concept design for the integration of the advanced nanostructured steels will be presented.

High Efficiency Axial Deep Creep-Feed Grinding Machining Technology of Engineering Ceramics Materials

Axial deep creep-feed grinding machining technology is a high efficiency process method of engineering ceramics materials, which is an original method to process the cylindrical ceramics materials or hole along its axis. The analysis of axial force and edge fracture proved the cutting thickness and feed rate could be more than 5-10 mm and 200 mm/min respectively in once process, and realized high efficiency, low-cost process of engineering ceramics materials. Compared with high speed-deep grinding machining, this method is also a high efficiency machining technology of engineering ceramics materials as well as with low cost. In addition, removal mechanism analyses showed that both median/radial cracks and lateral cracks appeared in the part to be removed, and the processed part is seldom destroyed, only by adjusting the axial force to control the length of transverse cracks.

Progress in material removal mechanisms of surface polishing with ultra precision

Chemical mechanical polishing (CMP) process is commonly regarded as the best method for achieving global planarization in the field of surface finishing with ultra-precision. The development of investigation on material removal mechanisms for different materials used in com-puter hard disk and ultra-large scale integration fabrication are reviewed here. The mechanisms underlying the interac-tion between the abrasive particles and polished surfaces during CMP are addressed, and some ways to investigate the polishing mechanisms are presented.

Modeling and analysis for material removal and surface roughness in fluid jet polishing of optical glass

luid jet polishing(FJP)is a non-contact polishing technology that can fabricate free-form optical surfaces with sub-micron-level form accuracy and nano-level surface roughness,especially for hard and brittle materials.The surface generation model of FJP can be used to guide the determination and optimization of process parameters and is of great significance for understanding the evolution mechanism of surface microtopography.However,predictive models for the microscopic topography of polished surfaces are still lacking.This study established a macroscopic surface profile model for predicting 3D material removal characteristics and surface texture by combining the 3D computer fluid dynamics(CFD)simulation model and single-particle erosion mechanism.A fractal theory-based erosion model has been built to calculate the material removal caused by the erosion of a single abrasive particle on the rough surface;thus,it predicts the micro-topography and surface roughness of the polished samples.A series of polishing experiments were conducted to analyze the feasibility and accuracy of the model quantitatively and study the influence mechanism of process parameters on the material removal characteristics and surface quality.Results indicated that the models could well predict material removal and surface roughness.The prediction accuracy of the surface roughness Ra and maximum removal depth is better than 91.6%and 90%,respectively.It is also found that the material removal rate of FJP could reach 0.517 mm3/min,and the surface roughness convergence rate could reach 62.9%.

MOF材料在水环境污染物去除方面的应用现状及发展趋势(Ⅰ)

金属有机骨架(Metal-organic frameworks,MOFs)是一类有机-无机杂化材料,通常是指金属离子或金属簇与含氮、氧刚性有机配体通过自组装过程形成的功能性多孔材料.MOF材料具有丰富的可设计的结构类型、可调控的化学功能、低密度的骨架、超高的比表面积,以及可功能化的永久的孔空间,在气体存储与分离、催化、传感、药物运输与缓释等领域都有广泛的应用潜力.近年来,MOF及其复合材料已经被应用于多种污染物的去除.本文对近年来MOF材料去除水环境中重金属、有机物的相关研究进行了总结与评述.本篇是该主题的第一篇,主要针对MOF材料在水体重金属污染物去除方面的研究进行论述.通过对以往的研究分析可知,MOF材料对常见重金属Pb2+、Cu2+、Cd2+、Co2+、Ag+、Cs+、Sr2+、Hg(II)以及TcO4-、Se(VI)、As(III)、As(V)均具有高效吸附性能,甚至部分MOF材料的吸附性能远高于传统吸附材料.主要的吸附机理包括:静电引力、配位/螯合作用、离子交换作用、孔道吸附(物理吸附)等.最后,基于以往的研究成果对未来的研究趋势进行了展望.

Optimization of Polishing Parameters with Taguchi Method for LBO Crystal in CMP

Chemical mechanical polishing （CMP） was used to polish Lithium triborate （LiB3O5 or LBO） crystal. Taguchi method was applied for optimization of the polishing parameters. Material removal rate （MRR） and surface roughness are considered as criteria for the optimization. The polishing pressure, the abrasive concentration and the table velocity are important parameters which influence MRR and surface roughness in CMP of LBO crystal. Experiment results indicate that for MRR the polishing pressure is the most significant polishing parameter followed by table velocity; while for the surface roughness, the abrasive concentration is the most important one. For high MRR in CMP of LBO ctystal the optimal conditions are： pressure 620 g/cm^2, concentration 5.0 wt pct, and velocity 60 r/min, respectively. For the best surface roughness the optimal conditions are： pressure 416 g/cm^2, concentration 5.0 wt pct, and velocity 40 r/min, respectively. The contributions of individual parameters for MRR and surface roughness were obtained.

Analysis of Machinable Structures and Their Wettability of Rotary Ultrasonic Texturing Method

Tailored surface textures at the micro- or nanoscale dimensions are widely used to get required functional performances. Rotary ultrasonic texturing （RUT） technique has been proved to be capable of fabricating periodic micro- and nanostructures. In the present study, diamond tools with geometrically defined cutting edges were designed for fabricating different types of tailored surface textures using the RUT method. Surface generation mechanisms and machinable structures of the RUT process are analyzed and simulated with a 3D-CAD program. Textured surfaces generated by using a triangular pyramid cutting tip are constructed. Different textural patterns from several micrometers to several tens of micrometers with few burrs were successfully fabricated, which proved that tools with a proper two-rake-face design are capable of removing cutting chips efficiently along a sinusoidal cutting locus in the RUT process. Technical applications of the textured surfaces are also discussed. Wetting properties of textured aluminum surfaces were evaluated by combining the test of surface roughness features. The results show that the real surface area of the textured aluminum surfaces almost doubled by comparing with that of a flat surface, and anisotropic wetting properties were obtained due to the obvious directional textural features.

Precision Grinding of Reaction Bonded Silicon Carbide Using Coarse Grain Size Diamond Wheels

Reaction bonded SiC（RBSiC） is attractive for optical application because of its favorable properties and low fabrication cost. However, the difficultness and cost involved in RBSiC grinding limit its application. The investigation on high efficient and low-cost machining with good grinding quality is desired. Generally, high efficient machining for RBSiC is realized by using coarse grain size grinding wheels, but serious grinding damage is inevitable. In this paper, monolayer nickel electroplated coarse grain size diamond grinding wheels with grain sizes of 46 μm, 91 μm, and 151 μm were applied to the grinding of RBSiC. An electrolytic in-process dressing（ELID） assisted conditioning technique was first developed by using cup shape copper bonded conditioning wheels with grain sizes of 15 μm and 91 μm to generate the conditioned coarse grain size wheels with minimized wheel run-out error within 2 μm, constant wheel peripheral envelop as well as top-flattened diamond grains. Then, the grinding experiments on RBSiC were carried out to investigate the grinding performance and material removal mechanism. The experimental results indicate that the developed conditioning technique is applicable and feasible to condition the coarse grain size diamond wheels under optimal conditioning parameters, and the material removal mechanism involved in RBSiC grinding is the combination of brittle fracture and ductile deformation to generate smooth ground surface. This research is significant for the high efficient and low-cost precision grinding of RBSiC with good ground surface quality.

Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method

In this paper,the material removal mechanism of copper chemical mechanical polishing was studied by the quasicontinuum method that integrated molecular dynamics and the finite element method.By analyzing the abrasive process of different particle sizes on single crystal copper,we investigated the internal material deformation,the formation of chips,the stress distribution,and the change of cutting force.Results showed that shear band deformation was generated along the cutting direction at approximately 45° inside the workpiece material.The deformation was accompanied by dislocations and sliding phenomena in the shear band region.Smaller abrasive particle size led to poor quality of the workpiece,while a larger particle size led to better quality.However,larger particle size resulted in greater plastic deformation and deeper residual stress inside the workpiece.Size change of abrasive particles had little effect on the tangential cutting force.

Structural design and mechanical performance of composite vascular grafts

This study reviews the state of the art in structural design and the corresponding mechanical behaviours of composite vascular grafts. We critically analyse surface and matrix designs composed of layered, embedded, and hybrid structures along the radial and longitudinal directions;materials and manufacturing techniques, such as tissue engineering and the use of textiles or their combinations;and the corresponding mechanical behaviours of composite vascular grafts in terms of their physical–mechanical properties, especially their stress–strain relationships and elastic recovery. The role of computational studies is discussed with respect to optimizing the geometrics designs and the corresponding mechanical behaviours to satisfy specialized applications, such as those for the aorta and its subparts. Natural and synthetic endothelial materials yield improvements in the mechanical and biological compliance of composite graft surfaces with host arteries. Moreover,the diameter, wall thickness, stiffness, compliance, tensile strength, elasticity, and burst strength of the graft matrix are determined depending on the application and the patient. For composite vascular grafts, hybrid architectures are recommended featuring multiple layers, dimensions, and materials to achieve the desired optimal flexibility and function for complying with user-specific requirements. Rapidly emerging artificial intelligence and big data techniques for diagnostics and the threedimensional(3D) manufacturing of vascular grafts will likely yield highly compliant, subject-specific, long-lasting, and economical vascular grafts in the near-future.

Low-Temperature Nitriding by Means of SMAT

The microstructure in the surface layer of iron and steel samples can be refined at the nanometer scale by means of a surface mechanical attrition treatment (SMAT) that generates repetitive severe plastic deformation to the surface layer. The subsequent nitriding kinetics of the as-treated samples with the nanostructured surface layer is greatly enhanced so that the nitriding temperatures can be reduce to 300 - 400 °C regions. This enhanced processing method demonstrates both the technological significance of nanomaterials in advancing the traditional processing techniques, and provides a new approach for selective surface reactions in solids. This article reviews the present state of the art in this field. The microstructure and properties of SMAT samples nitrided will be summarized. Further considerations of the development and applications of this new technique will also be presented.

Electrochemical behavior and polishing properties of silicon wafer in alkaline slurry with abrasive CeO_2

The electrochemical behavior of silicon wafer in alkaline slurry with nano-sized CeO2 abrasive was investigated.The variations of corrosion potential(φcorr)and corrosion current density(Jcorr)of the P-type(100)silicon wafer with the slurry pH value and the concentration of abrasive CeO2 were studied by polarization curve technologies.The dependence of the polishing rate on the pH and the concentration of CeO2 in slurries during chemical mechanical polishing(CMP)were also studied.It is discovered that there is a large change of φcorr and Jcorr when slurry pH is altered and the Jcorr reaches the maximum(1.306 μA/cm2)at pH 10.5 when the material removal rate(MRR)comes to the fastest value.The Jcorr increases gradually from 0.994 μA/cm2 with 1% CeO2 to 1.304 μA/cm2 with 3% CeO2 and reaches a plateau with the further increase of CeO2 concentration.There is a considerable MRR in the slurry with 3% CeO2 at pH 10.5.The coherence between Jcorr and MRR elucidates that the research on the electrochemical behavior of silicon wafers in the alkaline slurry could offer theoretic guidance on silicon polishing rate and ensure to adjust optimal components of slurry.