Partial electrical potential distribution around nanospheres in metallic nanostructured films

In light of the nanostructured surface model, where half-spherical nanoparticles grow out symmetrically from a plane metallic film, the mathematical model for the partial electrical potential around nanospheres is developed when a uniform external electric field is applied. On the basis of these models, the three-dimensional spatial distribution of the partial electrical potential is obtained and given in the form of a curved surface using a numerical computation method. Our results show that the electrical potential distribution around the nanospheres exhibits an obvious geometrical symmetry. These results could serve as a reference for investigating many abnormal phenomena such as abnormal infrared effects, which are found when CO molecules are adsorbed on the surface of nanostructured transition metals.

Internal stress analysis of electroplated films based on electron theory

Cu films on Fe, Ni and Ag substrates, Ni films on Fe and Ag substrates, Ag film on Cu substrate, Cr film on Fe substrate, Ag film on Ag substrate, Ni film on Ni substrate and Cu film on Cu substrate were deposited by electroplating. The average internal stress in all films, except Cr, was in-situ measured by the cantilever beam test. The interfacial stress is very large in the films with different materials with substrates and is zero in the films with the same material with substrates. The interfacial stress character obtained from the cantilever beam bending direction is consistent with that obtained from the modified Thomas–Fermi–Dirac electron theory.

AFM Study on Interface of HTHP As-grown Diamond Single Crystal and Metallic Film

The study for the interface of as-grown diamond and metallic film surrounding diamond is an attractive way for understanding diamond growth mechanism at high temperature and high pressure (HTHP), because it is that through the interface carbon atom groups from the molten film are transported to growing diamond surface. It is of great interest to perform atomic force microscopy (AFM) experiment; which provides a unique technique different from that of normal optical and electron microscopy studies, to observe the interface morphology. In the present paper, we report first that the morphologies obtained by AFM on the film are similar to those of corresponding diamond surface, and they are the remaining traces after the carbon groups moving from the film to growing diamond. The fine particles and a terrace structure with homogeneous average step height are respectively found on the diamond (100) and (111) surface. Diamond growth conditions show that its growth rates and the temperature gradients in the boundary layer of the molten film at HTHP result in the differences of surface morphologies on diamond planes, being rough on (100) plane and even on the (111) plane. The diamond growth on the (100) surface at HPHT could be considered as a process of unification of these diamond fine particles or of carbon atom groups recombination on the growing diamond crystal surface. Successive growth layer steps directly suggest the layer growth mechanism of the diamond (111) plane. The sources of the layer steps might be two-dimensional nuclei and dislocations.

Effect of fabrication parameters on the microstructure,in-plane anisotropy and magnetostriction of Fe-Ga thin films

The microstructure,in-plane anisotropy,and magnetic properties of Fe-Ga thin films were investigated by X-ray diffraction analysis,vibrating sample magnetometer,and capacitive cantilever method.The in-plane induced anisotropy is well formed by the applied magnetic field during sputtering,and the anisotropy field Hk decreases with the sputtering power increasing.The coercivity of Fe-Ga thin films decreases with increasing power when the sputtering power is less than 60 W and increases when the power is larger than 60 W.The magnetostriction of the thin films reaches 66 × 10-6 at the sputtering power of 60 W.Excellent Fe-Ga films,which exhibit good field sensitivity,low coercivity and high magnetostriction,have been fabricated at the power of 60 W,and they can be used as the materials of magnetostrictive transducers.

Fractal Characteristics and Microstructure Evolution of Magnetron Sputtering Cu Thin Films

How to describe surface morphology characteristic and microstructure evolution are the hottest researches of current thin film researches. But in traditional characterization of surface morphology, the roughness parameters are scale related. And the microstructure evolution of thin film during post-treatment is usually not considered in detail, To give a better understanding of the roughness of thin films topography, fractal method is carried out. In addition, microstrueture evolution of thin films is analyzed based on the crystallography and energy theory. Cu thin films are deposited on Si （100） substrates by magnetron sputtering, and then annealed at different temperatures. Surface topography is characterized by atomic force microscope （AFM）. Triangular prism surface area （TPSA） algorithm is used to calculate the fractal dimension of the AFM images. Apparent scale effect exists between the surface morphology roughness and film thickness. Relationship between the fractal dimension and roughness is analyzed by linear regression method and linear relationship exists between fractal dimension and surface roughness root mean square （RMS）. Fractal dimension can be characterized as a scale independence parameter to represent the complex degree and roughness level of surface. With the increase of annealing temperature, surface roughness and fractal dimension decrease. But when the annealing temperature exceeds the recrystallization temperature, due to the agglomeration and coalescence of Cu grain, surface roughness and fractal dimension increase. Scale effect and changing regularity of grain growth and shape evolution for different film thickness under different annealing temperatures are analyzed. Based on minimum total free energy, regularity of grain growth and changing is proposed. The proposed research has some theory significance and applicative value of Cu interconnect process and development of MEMS.

Experimental studies of extraordinary light transmission through periodic arrays of subwavelength square and rectangular holes in metal films

We fabricate a series of periodic arrays of subwavelength square and rectangular air holes on gold films, and measure the transmission spectra of these metallic nanostructures. By changing some geometrical and physical parameters, such as array period, air hole size and shape, and the incident light polarization, we verify that both global surface plasmon resonance and localized waveguide mode resonance are influential on enhancing the transmission of light through nanostructured metal films. These two resonances induce different behaviours of transmission peak shift. The transmission through the rectangular air-hole structures exhibits an obvious polarization effect dependent on the morphology. Numerical simulations are also made by a plane-wave transfer-matrix method and in good consistency with the experimental results.

Surface plasmon-polaritons on ultrathin metal films

We discuss the surface plasmon-polaritons used for ultrathin metal films with the aid of linear response theory and make comparisons with the known result given by Economou E N. In this paper we consider transverse electromagnetic fields and assume that the electromagnetic field in the linear response formula is the induced field due to the current of the electrons. It satisfies the Maxwell equation and thus we replace the current （charge） term in the Maxwell equation with the linear response expectation value. Finally, taking the external field to be zero, we obtain the dispersion relation of the surface plasmons from the eigenvalue equation. In addition, the charge-density and current-density in the z direction on the surface of ultrathin metal films are also calculated. The results may be helpful to the fundamental understanding of the complex phenomenon of surface plasmon-polaritons.

Formation and Characterization of Pd,Pt and Pd-Pt Alloy Films on Polyimide by Catalyst-Enhanced Chemical Vapor Deposition

Platinum, palladium and their alloy films on polyimide were formed by catalyst-enhanced chemical vapor deposition （CVD） in the carrier gas （N2, O2） at 220-300℃ under reduced pressure and normal pressure. The deposition of palladium complexes [ Pd（（η3-allyl）（hfac） and Pd（hfac）2 ] gives pure palladium film, while the deposition of platinum needs the enhancement of palladium complex by mixing precursor platinum complex Pt（COD）Me2 and palladium complex in the same chamber. The co-deposition of Pd and Pt metals was used for the deposition of alloy films. During the CVD of palladium-platinum alloy, the Pd/Pt atomic ratios vary under different co-deposition conditions. These metal films were characterized by XPS and SEM, and show a good adhesive property.

Competing failure mechanisms of thin metal films on polymer substrates under tension

The ductility of thin metal films on polymer substrates reported in recent experiments has a huge disparity,ranging from less than 1 % up to more than 50 %.To reveal the underpinning origins for such a large variation,this paper reports a systematic computational study of two competing failure mechanisms:metal film necking and grain boundary cracking.The quantitative results suggest that strong grain boundaries and metal/polymer interfacial adhesion are keys to achieve high ductility of polymer-supported metal films.

Quantum Transport and Surface Scattering in Magnetic Metallic Film

Taking into account the quantum size effect and the spin dependence of the electronic band structure,and including the spin dependence of the scattering from bulk impurities and two different sets of surface roughness,wepresent a theory on the electronic transport in magnetic film,in which the average autocorrelation function (ACF) forsurface roughness is described by a Gaussion model.Our result shows that the conductivity is a sensitive function ofsurface roughness and exchange energy.It is also found that in the thin film limit and in the lower-order approximationof the surface scattering,the total conductivity is given by a sum of conductivities of all the subbands and the two spinchannels,for each subband and each spin channel the scattering rates due to the impurities and two surfaces are additive.

THE MECHANISM OF SURFACE METALLIZATION OF POLYVINYL ALCOHOL COMPLEX METAL CHELATE FILMS

A novel method for preparing metalllzed film has been studied.The reduction process and properties of the poly(vinyl alcohol)(PVA)were probed by several analytic means.According to the etudies,a mechanism for the polymer surface reduction metallization was proposed and proved.

Growth of a-Plane GaN Films on r-Plane Sapphire by Combining Metal Organic Vapor Phase Epitaxy with the Hydride Vapor Phase Epitaxy

Hydride vapor phase epitaxy （HVPE） is utilized to grow nonpolar a-plane GaN layers on r-plane sapphire templates prepared by metal organic vapor phase epitaxy （MOVPE）. The surface morphology and microstructures of the samples are characterized by atomic force microscopy. The full width at half maximum （FWHM） of the HVPE sample shows a W-shape and that of the MOVPE sample shows an M-shape plane with the degree of 0 in the high-resolution x-ray diffraction （HRXRD） results. The surface morphology attributes to this significant anisotropic. HRXRD reveals that there is a significant reduction in the FWHM, both on-axis and off-axis for HVPE GaN are compared with the MOVPE template. The decrease of the FWHM of E2 （high） Raman scat tering spectra further indicates the improvement of crystal quality after HVPE. By comparing the results of secondary- ion-mass spectroscope and photoluminescence spectrum of the samples grown by HVPE and MOVPE, we propose that C-involved defects are originally responsible for the yellow luminescence.

Hybrid and Reflective Insulation Assemblies for Buildings

Materials with a low thermal emittance surface have been used for many years to create reflective insulations that reduce the rate of heat flow across building envelopes. Reflective insulation technology is now being combined with other energy conserving technologies to optimize overall thermal performance. The basis for the performance of reflective insulations and radiant barriers will be discussed along with the combination of these materials with cellular plastic or mineral fiber insulations to form hybrid insulation assemblies. Calculations of thermal resistance for enclosed reflective air spaces and current field data from Southeast Asia will be presented. These data show that reductions in heat transfer across the building enclosure can be effectively reduced by the use of enclosed reflective air spaces and attic radiant barriers. Reflective technology increases the overall thermal resistance of the building enclosure when used to insulate poured concrete structures.

Surface Plasmon Assisted Directional Rayleigh Scattering

The origin of the Rayleigh scattering ring effect has been experimentally examined on a quantum dot/metal film system, in which CdTe quantum dots embedded in PVP are spincoated on a thin Au film. On the basis of the angle-dependent, optical measurements under different excitation schemes （i.e., wavelength and polarization）, we demonstrate that surface plasmon assisted directional radiation is responsible for such an effect. Moreover, an interesting phase-shift behavior is addressed.

Plasma-enhanced atomic layer deposition of Co using Co(MeCp)_2 precursor

Cobalt （Co） thermal or plasma enhanced atomic layer deposition （PE-ALD） was investigated using a novel metal organic precursor, Co（MeCp）2, and NH3 or H2 or their plasma as a reactant. The growth characteristics, electrical and microstructural properties were investigated. Especially, PE-ALD produced Co thin films at low growth temperature down to 100℃. Interestingly, the low temperature growth of Co films showed the formation of columnar structure at substrate temperature below 300℃. The growth characteristics and films properties of PE-ALD Co using bis（η-methylcyclopentadienyl） Co（II） （Co（MeCp）2） was compared with those of PE-ALD Co using other Cp based metal organic precursors, bis-cyclopentadienyl cobalt （II） （CoCp2） and cyclopentadienyl isopropyl acetamidinato-cobalt （Co（CpAMD））.

Dispersion compensation for an ultrathin metal film using LCD-CCD system

A dispersion compensation method is introduced to correct the distorted image passing through an ultrathin metal film.An LCD-CCD system is modeled by the back propagation network and used to evaluate the transmittance of the ultrathin metal film.Training samples for the network come from 729 images captured by shooting test patches,in which the RGB values are uniformity distributed between 0 and 255.The RGB value of the original image that will be distorted by the dispersion is first transformed by mapping from the LCD to the CCD,multiplied by the inverse matrix of the transmittance matrix,and finally transformed by mapping from the CCD to the LCD,then the corrected image is obtained.In order to verify the effectiveness of the proposed method,ultrathin aluminum films with different thicknesses are evaporated on glass substrates and laid between the CCD and LCD.Experimental results show that the proposed method compensates for the dispersion successfully.

PF/EP/Nano-SiO_2 Composite Paint for Resistor

Phenolic resin(PF) and nano-SiO2 were used to improve the curing property and high humidity resistance of epoxy resin (EP) and methyl nadic anhydride (MNA) resistor paint, respectively. Hydrogen bonds, formed between phenolic resin and nano-SiO2 in alcohol, made nano-SiO2 disperse easily in EP/MNA paint through phenolic resin without being treated by supersonic vibration. When the mass ratio of PF to EP in paint is 3:7, the formed composite paint film can be cured in 2 min at 170 ℃ . When the mass ratio of nano-SiO2 to PF in paint is 3:100, the property of high humidity resistance of the composite paint is the best, meeting the requirement of varying ratio of resistance less than 0.1% after experiment on high humidity resistance. SEM analysis shows the surface of the composite paint film is smooth, glassy, tight and homogeneous, without acicular air holes.

STATIONARY DYNAMIC CHARACTERISTICS ANALYSIS OF NEW SQUEEZED FILM DAMPER

Recur to multi-hole and better elastic characteristics of metal rubber （MR）, a new squeezed film damper with MR （SFD/MR） throttle ring installed on the end of MR and MR damping ring installed on the radial direction of MR is implemented. Based on the D＇alembert principle, a locomotion equation and the mathematical model of stationary response of SFD/MR system is put forward. It proves that the SFD/MR has better ability to resist unbalance loads than the traditional SFD after the stationary dynamic characteristics of the traditional SFD and the new SFD/MR are researched.

Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing

Microbridge testing was used to measure the Young＇s modulus and residual stress of metallic films. Samples of freestanding NiFe film microbridge were fabricated by microelectromechanical systems. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curve of NiFe film microbridge by the Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of load-deflection curves of the microbridges was proposed to evaluate the Young＇s modulus and residual stress of the films simultaneously. The calculated results based on experimental measurements show that the average Young＇s modulus and residual stress for the electroplated NiFe films are 203.2 GPa and 333.0 MPa, respectively, while the Young＇s modulus measured by the Nano-hardness method is 209.6：1：11.8 GPa for the thick NiFe film with silicon substrate.

Surface Plasmon Interference Lithography Assisted by a Fabry-Perot Cavity Composed of Subwavelength Metal Grating and Thin Metal Film

A surface plasmon interference lithography assisted by a Fabry-Perot （F-P） cavity composed of subwavelength metal gratings and a thin metal fihn is proposed to fabricate high-quality nanopatterns. The calculated results indicate that uniform straight interference fringes with high contrast and high electric-field intensity are formed in the resist under the F-P cavity. The analyses of spatial frequency spectra illuminate the physical mechanism of the formation for the interference fringes. The influence of the F-P cavity spacing is discussed in detail. Moreover, the error analyses reveal that all parameters except the metal grating period in this scheme can bear large tolerances for the device fabrication.