We have investigated the electron affinity of Si-doped AlN films(N_(Si)= 1.0 × 10^(18)–1.0 × 10_(19)cm^(-3)) with thicknesses of 50, 200, and 400 nm, synthesized by metalorganic chemical vapor deposition(MO...We have investigated the electron affinity of Si-doped AlN films(N_(Si)= 1.0 × 10^(18)–1.0 × 10_(19)cm^(-3)) with thicknesses of 50, 200, and 400 nm, synthesized by metalorganic chemical vapor deposition(MOCVD) under low pressure on the ntype(001)6H–SiC substrates. The positive and small electron affinity of AlN films was observed through the ultraviolet photoelectron spectroscopy(UPS) analysis, where an increase in electron affinity appears with the thickness of AlN films increasing, i.e., 0.36 eV for the 50-nm-thick one, 0.58 eV for the 200-nm-thick one, and 0.97 e V for the 400-nm-thick one.Accompanying the x-ray photoelectron spectroscopy(XPS) analysis on the surface contaminations, it suggests that the difference of electron affinity between our three samples may result from the discrepancy of surface impurity contaminations.展开更多
This paper reports that Al1 xInxN epilayers were grown on GaN template by metalorganic chemical vapor de-position with an In content of 7%-20%. X-ray diffraction results indicate that all these Al1 xInxN epilayers hav...This paper reports that Al1 xInxN epilayers were grown on GaN template by metalorganic chemical vapor de-position with an In content of 7%-20%. X-ray diffraction results indicate that all these Al1 xInxN epilayers have a relatively low density of threading dislocations. Rutherford backscattering/channeling measurements provide the exact compositional information and show that a gradual variation in composition of the Al1 xInxN epilayer happens along the growth direction. The experimental results of optical reflection clearly show the bandgap energies of Al1 xInxN epilayers. A bowing parameter of 6.5 eV is obtained from the compositional dependence of the energy gap. The cathodoluminescence peak energy of the Al1 xInxN epilayer is much lower than its bandgap, indicating a relatively large Stokes shift in the Al1 xInxN sample.展开更多
Low pressure metalorganic chemical vapour deposition(LP-MOCVD) growth and characteristics of InAsSb on(100) GaSb substrates are investigated.Mirror-like surfaces with a minimum lattice mismatch are obtained.The sample...Low pressure metalorganic chemical vapour deposition(LP-MOCVD) growth and characteristics of InAsSb on(100) GaSb substrates are investigated.Mirror-like surfaces with a minimum lattice mismatch are obtained.The samples are studied by photoluminescence spectra,and the output is 3.17 μm in wavelength.The surface of InAsSb epilayer shows that its morphological feature is dependent on buffer layer.With an InAs buffer layer used,the best surface is obtained.The InAsSb film shows to be of n-type conduction with an electron concentration of 8.52×1016 cm 3.展开更多
Thin films of copper titanium oxide were deposited by metal organic chemical vapour deposition technique from the synthesized single solid source precursor, copper titanium acetylacatonate Cu [Ti(C5H7O2)3] at the depo...Thin films of copper titanium oxide were deposited by metal organic chemical vapour deposition technique from the synthesized single solid source precursor, copper titanium acetylacatonate Cu [Ti(C5H7O2)3] at the deposition temperature of 420°C. The deposited films were characterized using Rutherford Backscattering Spectroscopy, Scanning Electron Microscopy with Energy Dispersive X-Ray facility attached to it, X-Ray Diffractometry, UV-Visible Spectrometry and van-der Pauw Conductivity measurement. Results show that the thickness of the prepared film is determined as 101.236 nm and the film is amorphous in structure, having average grain size of approximately 1 μm. The optical behaviour showed that the absorption edge of the film was at 918 nm near infrared with corresponding direct energy band gap of 1.35 eV. The electrical characterization of the film gave the values of resistivity, sheet resistance and conductivity of the film as 3.43 × 10-1 Ω-cm, 3.39 × 106 Ω/square and 2.91 (Ω-cm)-1 respectively.展开更多
This paper studied the low-resistance ohmic contacts on InAlN/GaN with metal–organic chemical vapor deposition(MOCVD)regrowth technique.The 150-nm regrown n-InGaN exhibits a low sheet resistance of 31Ω/□,resulting ...This paper studied the low-resistance ohmic contacts on InAlN/GaN with metal–organic chemical vapor deposition(MOCVD)regrowth technique.The 150-nm regrown n-InGaN exhibits a low sheet resistance of 31Ω/□,resulting in an extremely low contact resistance of 0.102Ω·mm between n^(+)-InGaN and InAlN/GaN channels.Mask-free regrowth process was also used to significantly improve the sheet resistance of InAlN/GaN with MOCVD regrown ohmic contacts.Then,the diffusion mechanism between n^(+)-InGaN and InAlN during regrowth process was investigated with electrical and structural characterizations,which could benefit the further process optimization.展开更多
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61574135,61574134,61474142,61474110,61377020,61376089,61223005,and 61321063)the One Hundred Person Project of the Chinese Academy of Sciencesthe Basic Research Project of Jiangsu Province,China(Grant No.BK20130362)
文摘We have investigated the electron affinity of Si-doped AlN films(N_(Si)= 1.0 × 10^(18)–1.0 × 10_(19)cm^(-3)) with thicknesses of 50, 200, and 400 nm, synthesized by metalorganic chemical vapor deposition(MOCVD) under low pressure on the ntype(001)6H–SiC substrates. The positive and small electron affinity of AlN films was observed through the ultraviolet photoelectron spectroscopy(UPS) analysis, where an increase in electron affinity appears with the thickness of AlN films increasing, i.e., 0.36 eV for the 50-nm-thick one, 0.58 eV for the 200-nm-thick one, and 0.97 e V for the 400-nm-thick one.Accompanying the x-ray photoelectron spectroscopy(XPS) analysis on the surface contaminations, it suggests that the difference of electron affinity between our three samples may result from the discrepancy of surface impurity contaminations.
基金supported by the National Natural Science Foundation of China (Grant Nos. 60776047, 60506001, 60476021, 60576003 and 60836003)
文摘This paper reports that Al1 xInxN epilayers were grown on GaN template by metalorganic chemical vapor de-position with an In content of 7%-20%. X-ray diffraction results indicate that all these Al1 xInxN epilayers have a relatively low density of threading dislocations. Rutherford backscattering/channeling measurements provide the exact compositional information and show that a gradual variation in composition of the Al1 xInxN epilayer happens along the growth direction. The experimental results of optical reflection clearly show the bandgap energies of Al1 xInxN epilayers. A bowing parameter of 6.5 eV is obtained from the compositional dependence of the energy gap. The cathodoluminescence peak energy of the Al1 xInxN epilayer is much lower than its bandgap, indicating a relatively large Stokes shift in the Al1 xInxN sample.
基金Project supported by the National High Technology Research and Development Program of China (Grant No 2005A000200)the West Light Plan of China (Grant No 2005ZD01)the Xi’an Applied Materials Innovation Fund of China (Grant No XA-AM-200613)
文摘Low pressure metalorganic chemical vapour deposition(LP-MOCVD) growth and characteristics of InAsSb on(100) GaSb substrates are investigated.Mirror-like surfaces with a minimum lattice mismatch are obtained.The samples are studied by photoluminescence spectra,and the output is 3.17 μm in wavelength.The surface of InAsSb epilayer shows that its morphological feature is dependent on buffer layer.With an InAs buffer layer used,the best surface is obtained.The InAsSb film shows to be of n-type conduction with an electron concentration of 8.52×1016 cm 3.
文摘Thin films of copper titanium oxide were deposited by metal organic chemical vapour deposition technique from the synthesized single solid source precursor, copper titanium acetylacatonate Cu [Ti(C5H7O2)3] at the deposition temperature of 420°C. The deposited films were characterized using Rutherford Backscattering Spectroscopy, Scanning Electron Microscopy with Energy Dispersive X-Ray facility attached to it, X-Ray Diffractometry, UV-Visible Spectrometry and van-der Pauw Conductivity measurement. Results show that the thickness of the prepared film is determined as 101.236 nm and the film is amorphous in structure, having average grain size of approximately 1 μm. The optical behaviour showed that the absorption edge of the film was at 918 nm near infrared with corresponding direct energy band gap of 1.35 eV. The electrical characterization of the film gave the values of resistivity, sheet resistance and conductivity of the film as 3.43 × 10-1 Ω-cm, 3.39 × 106 Ω/square and 2.91 (Ω-cm)-1 respectively.
基金the Fundamental Research Funds for the National Key Research and Development Project of China(Grant No.2020YFB1807403)the National Natural Science Foundation of China(Grant Nos.62174125 and 62131014)+1 种基金the Fundamental Research Funds for the Central Universities(Grant Nos.QTZX22022 and YJS2213)the Innovation Fund of Xidian University.
文摘This paper studied the low-resistance ohmic contacts on InAlN/GaN with metal–organic chemical vapor deposition(MOCVD)regrowth technique.The 150-nm regrown n-InGaN exhibits a low sheet resistance of 31Ω/□,resulting in an extremely low contact resistance of 0.102Ω·mm between n^(+)-InGaN and InAlN/GaN channels.Mask-free regrowth process was also used to significantly improve the sheet resistance of InAlN/GaN with MOCVD regrown ohmic contacts.Then,the diffusion mechanism between n^(+)-InGaN and InAlN during regrowth process was investigated with electrical and structural characterizations,which could benefit the further process optimization.
