Light field head-mounted display with correct focus cue using micro structure array

A new type of light fiehl display is proposed using a head-mounted display （HMD） and a micro structure array （MSA, lens array or pinhole array）. Each rendering point emits abundant rays from different directions into the viewer＇s pupil, and at one time the dense light field is generated inside the exit pupil of the HMD through the eyepiece. Therefore, the proposed method not only solves the problem of accommodation and convergence conflict in a traditional HMD, but also drastically reduces the huge data in real three-dimensional （3D） display. To demonstrate the proposed method, a prototype is developed, which is capable of giving the observer a real perception of depth.

Monochrome HUD’s Imaging Projector Based on Laser-DMD System

Design and tolerance of a new head up display’s projector system is reported. It is based on laser-micro display modules. We designed optical diffraction limited modules and some of our novelties were compactness, using common material and spherical lenses in optical design, easy and economical manufacturing process, uniform intensity and minimum aberrations of final image, economical and repairable designed system. Projector magnification is 10.0X and diagonal of image plane is 76.2 mm. ZEMAX software is employed for optical design and tolerance.

Laser projection proximity transfer for deterministic assembly of microchip arrays at scale

Deterministic assembly techniques that enable programmatic and massively parallel integration of chips are essential for the development of novel electronic systems such as micro LED displays.However,large-area integration of ultrathin micro-chips with high yield and transfer accuracy remains a great challenge due to the difficulties in selective transfer,adhesion switchability,and transfer deviation.Here,a“laser projection proximity transfer(Laser PPT)”technique is presented for the deterministic assembly of microchip arrays at scale.One of the remarkable features is that the transfer status between the chip and the receiver substrate evolves from the original non-contact mode to contact mode for high-precision transfer,which overcomes the strict requirements of the flatness of stamp and substrate in contact-style transfer,and flight deviation of microchip array in noncontact-style transfer.Another feature is the rapid modulation of interfacial adhesion for reliable transfer via the use of thermally expandable microspheres to form microstructures and combining with a laser-induced blister.The adhesion regulation range is over 20 times without any damage to chip arrays.The results show that the transfer accuracy has been improved substantially with a minimum relative error of~0.5%.Combined with a laser beam projection system,demonstrations of Laser PPT for selective assembly of fragile objects onto challenging non-adhesive/cured surfaces in batch illustrate its potential in the highprecision integration of microscale chips at scale.