A solid-phase sintering process for the low-cost fabrication of composite micro-channels was developed. Three kinds of composite micro-channels with metallic porous structures were designed. The sintering process was ...A solid-phase sintering process for the low-cost fabrication of composite micro-channels was developed. Three kinds of composite micro-channels with metallic porous structures were designed. The sintering process was studied and optimized to obtain porous-structured micro-channels with high porosity. The flow resistance and heat transfer performance in the composite micro-channels were investigated. The composite micro-channels show acceptable flow resistance, significant enhancement of heat transfer and dramatic improvement of flow boiling stability, which indicates a promising prospect for the application in forced convective heat transfer.展开更多
With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is pro...With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved.展开更多
With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard method...With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard methods based on the combination of the so-called“jet impingement”and“micro-channel”approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields.In this paper,a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model.Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design.The influence of different sets of structural parameters on the cooling performance is examined.It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement.展开更多
The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of t...The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.展开更多
A gravitational flat-plate heat pipe is designed and fabricated in this paper to serve as a heat spreader to diffuse the local heat source to the hot side of the thermoelectric power module.Based on this, an experimen...A gravitational flat-plate heat pipe is designed and fabricated in this paper to serve as a heat spreader to diffuse the local heat source to the hot side of the thermoelectric power module.Based on this, an experimental test for the thermoelectric power generation system is conducted to study the influences of the heat spreader on the temperature uniformity and power generation performance when exposing to a local heat source.In addition,the effects of the heating power, inclination angle, and local heat source size on the power generation performance of the thermoelectric power module using a flat-plate heat pipe as a heat spreader are examined and compared with that using a metal plate.The results indicate that the gravitational flat-plate heat pipe has considerable advantages over the metal plate in the temperature uniformity.The superiority of temperature uniformity in the improvement of power generation performance for the thermoelectric power system using a heat pipe is demonstrated.Particularly, the heat pipe shows good adaptability to placement mode and the local heat source size, which is beneficial to the application in the thermoelectric power generation.展开更多
Flat plate pulsating heat pipe is useful for hot spot heat spreader. Two kinds of flat plate spreader of pulsating heat pipe are designed, fabricated and experimented. For the embedded circular capillary type, the tra...Flat plate pulsating heat pipe is useful for hot spot heat spreader. Two kinds of flat plate spreader of pulsating heat pipe are designed, fabricated and experimented. For the embedded circular capillary type, the transferred heat flux could reach 32 W/cm2, the smallest thermal resistance for acetone, methanol and FC-72 were respectively 0.50, 0.57 and 0.40℃/W. While for the square capillary type, the transferred heat flux could reach 26 W/cm2, the equivalent thermal conductivity could reach 3211 W/（m. ℃）. There are ranges of optimal transferred power and filling ratio for different working liquid. If the transferred power is constant, changing the heating area and the place has little effects on the performance.展开更多
With the fast development of integrated circuit devices as well as batteries with high energy densities,the thermal management of electronic components is becoming increasingly crucial to maintaining their reliable op...With the fast development of integrated circuit devices as well as batteries with high energy densities,the thermal management of electronic components is becoming increasingly crucial to maintaining their reliable operations.Boron nitride nanosheets(BNNS),which have superhigh thermal conductivity along the in-plane direction while remaining electrically insulating,were widely regarded as an ideal filler for preparing high-performance polymer composites to address the‘‘thermal failure''issue.However,due to the instinctive rigidity of BNNS,the nanosheets are unable to form a tightly interfacial contact between the adjoining fillers,resulting in some micro-and nanovoids within the heat transfer pathways and severely limiting further thermal conductivity enhancement for BNNS-based composites.Herein,soft and deformable liquid metal(eutectic gallium-indium,EGaIn)nanoparticles were employed to fill the gaps between the adjacent BNNS with a rational design of mass ratios of BNNS and EGaIn,leading to a strongly synergistic effect with BNNS on thermal conductivity improvement.As a result,the composite film(BNNS:63 wt%and EGaIn:7 wt%)employing cellulose nanofibers(CNF:30 wt%)as the polymer matrix achieves superhigh thermal conductivity along the in-plane direction of up to(90.51±6.71)W·m^(-1)·K^(-1),showing the highest value among the BNNSbased composites with a bi-filler system as far as we know.Additionally,the film can work as a heat spreader for the heat dissipation of high-power light emitting diodes,outperforming tin foil in cooling efficiency.展开更多
基金Project(51146010)supported by the National Natural Science Foundation of ChinaProject(S2011040003189)supported by the Doctoral Research Fund of Guangdong Natural Science Foundation,ChinaProject supported by the Fundation of Key Laboratory of Surface Functional Structure Manufacturing of Guangdong Higher Education Institutes,South China University of Technology
文摘A solid-phase sintering process for the low-cost fabrication of composite micro-channels was developed. Three kinds of composite micro-channels with metallic porous structures were designed. The sintering process was studied and optimized to obtain porous-structured micro-channels with high porosity. The flow resistance and heat transfer performance in the composite micro-channels were investigated. The composite micro-channels show acceptable flow resistance, significant enhancement of heat transfer and dramatic improvement of flow boiling stability, which indicates a promising prospect for the application in forced convective heat transfer.
基金Supported by the National Natural Science Foundation of China(Grant Nos.51975135 and 52005422)Guangzhou Science and Technology Project(Grant No.201707010429)Special Innovation Projects of Universities in Guangdong Province(Grant No.2018GKTSCX085).
文摘With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved.
基金National Natural Science Foundation of China(No.51676030,Zhou,X.M.,http://www.nsfc.gov.cn/)Sichuan Science and Technology Program(No.2019JDRC0026,Zhou,X.M.,http://scst.tccxfw.com/)。
文摘With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard methods based on the combination of the so-called“jet impingement”and“micro-channel”approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields.In this paper,a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model.Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design.The influence of different sets of structural parameters on the cooling performance is examined.It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement.
文摘The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.
基金Supported by the National Natural Science Foundation of China(U1737104)the Natural Science Foundation of Jiangsu Province(BK20170082)+1 种基金the Special Program for Applied Research on Super Computation of the NSFC-Guangdong Joint Fund(the second phase)(U1501501)the Postgraduate Research&Practice Innovation Program of Jiangsu Province
文摘A gravitational flat-plate heat pipe is designed and fabricated in this paper to serve as a heat spreader to diffuse the local heat source to the hot side of the thermoelectric power module.Based on this, an experimental test for the thermoelectric power generation system is conducted to study the influences of the heat spreader on the temperature uniformity and power generation performance when exposing to a local heat source.In addition,the effects of the heating power, inclination angle, and local heat source size on the power generation performance of the thermoelectric power module using a flat-plate heat pipe as a heat spreader are examined and compared with that using a metal plate.The results indicate that the gravitational flat-plate heat pipe has considerable advantages over the metal plate in the temperature uniformity.The superiority of temperature uniformity in the improvement of power generation performance for the thermoelectric power system using a heat pipe is demonstrated.Particularly, the heat pipe shows good adaptability to placement mode and the local heat source size, which is beneficial to the application in the thermoelectric power generation.
文摘Flat plate pulsating heat pipe is useful for hot spot heat spreader. Two kinds of flat plate spreader of pulsating heat pipe are designed, fabricated and experimented. For the embedded circular capillary type, the transferred heat flux could reach 32 W/cm2, the smallest thermal resistance for acetone, methanol and FC-72 were respectively 0.50, 0.57 and 0.40℃/W. While for the square capillary type, the transferred heat flux could reach 26 W/cm2, the equivalent thermal conductivity could reach 3211 W/（m. ℃）. There are ranges of optimal transferred power and filling ratio for different working liquid. If the transferred power is constant, changing the heating area and the place has little effects on the performance.
基金financially supported by the National Natural Science Foundation of China (Nos.52075527,5227020331 and 52102055)the National Key R&D Program of China (Nos.2017YFB0406000 and 2017YFE0128600)+12 种基金the Project of the Chinese Academy of Sciences (Nos.XDC07030100,XDA22020602,ZDKYYQ20200001 and ZDRW-CN-2019-3)CAS Youth Innovation Promotion Association (No.2020301)the Science and Technology Major Project of Ningbo (Nos.2021Z115,2021Z120,2018B10046 and 2016S1002)the Key Research and Development Program of Ningbo City (No.2022Z084)the Natural Science Foundation of Ningbo (No.2017A610010)the Foundation of State Key Laboratory of Solid lubrication (No.LSL-1912)China Postdoctoral Science Foundation (Nos.2020M681965 and2022M713243)the National Key Laboratory of Science and Technology on Advanced Composites in Special Environments (No.6142905192806)K.C.Wong Education Foundation (No.GJTD-2019-13)the Youth Fund of Chinese Academy of Sciences (No.JCPYJJ-22030)the Science and Technology Project of Zhejiang Province (No.2022C01182)Zhejiang Provincial Natural Science Foundation of China (No.LY19B010003)the 3315 Program of Ningbo。
文摘With the fast development of integrated circuit devices as well as batteries with high energy densities,the thermal management of electronic components is becoming increasingly crucial to maintaining their reliable operations.Boron nitride nanosheets(BNNS),which have superhigh thermal conductivity along the in-plane direction while remaining electrically insulating,were widely regarded as an ideal filler for preparing high-performance polymer composites to address the‘‘thermal failure''issue.However,due to the instinctive rigidity of BNNS,the nanosheets are unable to form a tightly interfacial contact between the adjoining fillers,resulting in some micro-and nanovoids within the heat transfer pathways and severely limiting further thermal conductivity enhancement for BNNS-based composites.Herein,soft and deformable liquid metal(eutectic gallium-indium,EGaIn)nanoparticles were employed to fill the gaps between the adjacent BNNS with a rational design of mass ratios of BNNS and EGaIn,leading to a strongly synergistic effect with BNNS on thermal conductivity improvement.As a result,the composite film(BNNS:63 wt%and EGaIn:7 wt%)employing cellulose nanofibers(CNF:30 wt%)as the polymer matrix achieves superhigh thermal conductivity along the in-plane direction of up to(90.51±6.71)W·m^(-1)·K^(-1),showing the highest value among the BNNSbased composites with a bi-filler system as far as we know.Additionally,the film can work as a heat spreader for the heat dissipation of high-power light emitting diodes,outperforming tin foil in cooling efficiency.
