基于磷脂双层的纳米粒子微传感分析系统

大气污染日益严重,悬浮纳米粒子和病毒颗粒通过肺泡进入体内,给人体带来未知的健康危害。本文通过将磷脂双层集成在场效应晶体管延长栅极表面体外模拟局部肺泡膜,设计并搭建了肺泡膜-纳米粒子相互作用实时监测系统。通过对粒子作用下源漏电流尖峰信号的检测与分析,该系统可以获取纳米粒子/病毒颗粒与肺泡膜相互作用行为的精确定量数据。测试结果表明,所提出微传感系统表面磷脂膜具有良好的完整性和生物活性,集成磷脂双层的延长栅极性能稳定、响应快、灵敏度高,可以准确、及时捕获带电离子跨膜转移信号,有望成为膜-粒相互作用行为有效的体外研究平台,推广用于广泛评估纳米粒子对人体健康的影响。

A combined virtual impactor and field-effect transistor microsystem for particulate matter separation and detection

Ambient suspended particulate matter(PM)(primarily with particle diameter 2.5m or less,i.e.,PM2.5)can adversely affect ecosystems and human health.Currently,optical particle sensors based on light scattering dominate the portable PM sensing market.However,the light scattering method has poor adaptability to different-sized PM and adverse environmental conditions.Here,we design and develop a portable PM sensing microsystem that consists of a micromachined virtual impactor(VI)for particle separation,a thermophoretic deposition chip for particle collection,and an extended-gate field-effect transistor(FET)for particle analysis.This system can realize on-site separation,collection,and analysis of aerosol particles without being influenced by environmental factors.In this study,the design of the VI is thoroughly analyzed by numerical simulation,and mixtures of different-sized silicon dioxide(SiO2)particles are used in an experimental verification of the performance of the VI and FET.Considering the low cost and compact design of the whole system,the proposed PM analysis microsystem has potential for PM detection under a wide range of conditions,such as heavily polluted industrial environments and for point-of-need outdoor and indoor air quality monitoring.

Emerging miniaturized energy storage devices for microsystem applications:from design to integration

The rapid progress of micro/nanoelectronic systems and miniaturized portable devices has tremendously increased the urgent demands for miniaturized and integrated power supplies.Miniaturized energy storage devices(MESDs),with their excellent properties and additional intelligent functions,are considered to be the preferable energy supplies for uninterrupted powering of microsystems.In this review,we aim to provide a comprehensive overview of the background,fundamentals,device configurations,manufacturing processes,and typical applications of MESDs,including their recent advances.Particular attention is paid to advanced device configurations,such as two-dimensional(2D)stacked,2D planar interdigital,2D arbitrary-shaped,three-dimensional planar,and wire-shaped structures,and their corresponding manufacturing strategies,such as printing,scribing,and masking techniques.Additionally,recent developments in MESDs,including microbatteries and microsupercapacitors,as well as microhybrid metal ion capacitors,are systematically summarized.A series of on-chip microsystems,created by integrating functional MESDs,are also highlighted.Finally,the remaining challenges and future research scope on MESDs are discussed.

Recent advances and key opportunities on in-plane micro-supercapacitors:From functional microdevices to smart integrated microsystems

The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalities(e.g.,high voltage,flexibility,stretchability,self-healing,electrochromism and photo/thermal response)to PMSCs is essential for building multifunctional PMSCs and their smart selfpowered integrated microsystems.In this review,we summarized the latest advances in PMSCs from various functional microdevices to their smart integrated microsystems.Primarily,the functionalities of PMSCs are characterized by three major factors to emphasize their electrochemical behavior and unique scope of application.These include but are not limited to high-voltage outputs(realized through asymmetric configuration,novel electrolyte and modular integration),mechanical resilience that includes various feats of flexibility or stretchability,and response to stimuli(self-healing,electrochromic,photo-responsive,or thermal-responsive properties).Furthermore,three representative integrated microsystems including energy harvester-PMSC,PMSC-energy consumption,and all-in-one selfpowered microsystems are elaborately overviewed to understand the emerging intelligent interaction models.Finally,the key perspectives,challenges and opportunities of PMSCs for powering smart microelectronics are proposed in brief.

Design of Secure Microsystems Using Current-to-Data Dependency Analysis

This paper presents a method for designing a class of countermeasures for DPA attacks based on attenuation of current variations. In this class of countermeasures, designers aim at decreasing the dynamic current variations to reduce the information that can be extracted from the current consumption of secure microsystems. The proposed method is based on a novel formula that calculates the number of current traces required for a successful DPA attack using the characteristics of the microsystem current signal and the external noise of the measurement setup. The different stages of the proposed method are illustrated through designing an example current flattening circuit. Meanwhile validity and applicability of the proposed formula is verified by comparing theoretical results with those obtained experimentally for the example circuit. The proposed formula not only estimates the required level of attenuation for a target level of robustness defined by design requirements, it also predicts the effectiveness of a countermeasure using simulation results therefore dramatically reducing the time to design of secure microsystems.

High-Performance and Flexible Co-Planar Integrated Microsystem of Carbon-Based All-Solid-State Micro-Supercapacitor and Real-Time Temperature Sensor

With the rapid development of flexible and portable microelectronics,the extreme demand for miniaturized,mechanically flexible,and integrated microsystems are strongly stimulated.Here,biomass-derived carbons(BDCs)are prepared by KOH activation using Qamgur precursor,exhibiting three-dimensional(3D)hierarchical porous structure.Benefiting from unobstructed 3D hierarchical porous structure,BDCs provide an excellent specific capacitance of 433 F g^(-1)and prominent cyclability without capacitance degradation after 50000 cycles at 50 A g^(-1).Furthermore,BDC-based planar micro-supercapacitors(MSCs)without metal collector,prepared by mask-assisted coating,exhibit outstanding areal-specific capacitance of 84 mF cm^(-2)and areal energy density of 10.6μWh cm^(-2),exceeding most of the previous carbon-based MSCs.Impressively,the MSCs disclose extraordinary flexibility with capacitance retention of almost 100%under extreme bending state.More importantly,a flexible planar integrated system composed of the MSC and temperature sensor is assembled to efficiently monitor the temperature variation,providing a feasible route for flexible MSC-based functional micro-devices.

Study on Wireless Power Transmission for Gastrointestinal Microsystems Based on Inductive Coupling

Wireless power transmission based on inductive coupling for remotely implanted micro devices has been considered in this paper. The receiving coil, integrated in microsystems and the external transmitting coil compose a loosely coupled transformer. The coupling coefficient was calculated and measured on spacing misalignments. The geometric size of transmitting coil was analyzed for the target of remotely delivering power. The received power was maximized by choosing appropriate value of frequency, tuning capacitance and the load resistance. A conventional full bridge rectifier circuit was employed to convert ac to dc voltage. The received dc power was up to 160 mW with a transmitting vohage of 5 Vrms when the receiving coil was placed at the center of the transmitting coil. This may meet the requirement of some microsystems for high power over a long time.

JK Microsystems嵌入式功率控制器

JK Microsystems公司推出一种嵌入式功率控制器，把调整，监视和开/关控制安装在比信用卡还要小的平台中。这种PowerNut电源管理板把输入功率控制在现有的器件上，从而简化了电源设计。该板给设计者提供一种包括电压调整，电源开／关时间表和电压监视的现成解决方案。从太阳能板或电池传来的电源电压能控制输出1A的电流。

Integrated 3D Fan-out Package of RF Microsystem and Antenna for 5G Communications

A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.

Allegro MicroSystems推出采用专利控制技术的最新LED驱动系列产品

新产品系列采用小型4x4封装,能够实现超大的真正PWM调光比运动控制和高能效系统电源和传感解决方案的全球领导厂商Allegro MicroSystems(以下简称Allegro)宣布推出最新一代先进LED背光驱动器A8060x系列,该系列器件采用了创新的专利技术Pre-Emptive Boost(PEB)控制,能够消除通常可听到的噪音。

Allegro MicroSystems推出最先进的变速箱速度传感器IC

2019年1月16日,Allegro MicroSystems宣布推出公司最先进的获ASIL B认证的变速箱速度传感器系列产品A19520、A19530和A19570,这些新磁传感器IC是Allegro近20年产业应用经验和技术进步的结晶,其中包括了先进的巨磁阻(GMR)和霍尔效应技术,使新产品成为满足当今变速箱应用苛刻要求的理想选择。

Natural MicroSystems

Natural MicroSystems公司是居领导地位的电信设备供应商，以发展优秀的电脑化电话应用平台或称开放式电讯解决方案着称。本公司具备登峰造极的技术，能帮助业务夥伴迅速开发具高增值的电脑化电话系统，回应市场需要，当中包括互联网(Internet)话音与传真系统、

Allegro MicroSystems,LLC发布两款高带宽电流传感器以补充现有的产品系列

Allegro MicroSystems,LLC宣布在现有的高带宽系列电流传感器基础上增加新一代产品ACS732和ACS733,新产品能够为测量DC/DC转换器和其他开关电源应用中的高频电流提供紧凑、快速和精确的解决方案,这些器件是Allegro首次提供的具有1MHz带宽和3600VRMS额定隔离度的产品。ACS732和ACS733为基于霍尔效应的电流传感器,集成有用户可配置的过流故障检测等功能。

1994成功一年,1995充满机会——访Sun Microsystems公司国际市场业务总监Darlene Yaplee

新年将近,记者采访了专程从美国赶来参加与太极计算机公司的合作项目签字仪式的Sun Microsystems公司国际市场业务总监Darlene Yaplee小姐,请她谈了谈公司1994年所取得的成就以及对1995年的有关工作站市场的展望.Darlene小姐介绍说,1994年对Sun来说是十分成功的一年,尤其是在工作站、服务器业务方面取得很大成绩.IDC统计表明,Sun在UNIX工作站和服务器方面排名第一,在数据库平台方面亦排在第一位,全球最大的数据库Oracle即运行于Sun的工作站上,总容量达360GB;在Internet服务器方面,86%是使用Sun的服务器,50%以上软件是在Sun的平台上开发出来的.过去的一年,Sun在自己所拥有的市场上与合作伙伴进一步加强了合作,与数据库。

一种基于硅基MEMS三维异构集成技术的T/R组件

基于硅基微电子机械系统(MEMS)三维异构集成工艺,设计并制作了用于相控阵天线系统的三维堆叠式Ku波段双通道T/R组件。该组件由两层硅基结构通过球栅阵列(BGA)植球堆叠而成,上下两层硅基封装均采用5层硅片通过硅通孔(TSV)、晶圆级键合工艺实现。组件集成了六位数控移相、六位数控衰减、串转并、电源调制、逻辑控制等功能,最终组件尺寸仅为15 mm×8 mm×3.8 mm。测试结果表明,在Ku波段内,该组件发射通道饱和输出功率大于24 dBm,单通道发射增益大于20 dB,接收通道增益大于20 dB,噪声系数小于3.0 dB。该组件性能好,质量轻,体积小,加工精确度高,组装效率高。

射频异构集成微系统多层级协同仿真建模与PDK技术综述

作为后摩尔技术的可选路径之一,基于异构集成工艺实现的集成微系统具有高集成度、低成本、高性能等优点,引起学术界和工业界的广泛关注。异构集成微系统设计是以系统为中心的多层级协同设计,对传统以晶体管为中心的设计方法和设计流程带来新的挑战,同时对设计环境的开发带来新的要求。本文对射频集成微系统设计中所需的基础器件/结构建模方法、多工艺混合工艺设计套件(Process Design Kit,PDK)技术、以及电路-模块-系统多层级协同仿真等技术最新进展进行综述。

超宽带硅基射频微系统设计

针对超宽带硅基射频模块的微系统化问题,采用硅基板作为转接板设计了一款具备收发功能的超宽带系统级封装(System in Package,SiP)射频微系统。各层硅基转接板之间的射频信号传输、控制和供电等均采用低损耗的硅通孔(Through Silicon Via,TSV)结构来实现。为了减小封装对射频性能的影响,整个超宽带射频微系统采用5层硅基封装结构,与传统二维封装结构相比,其体积减少95%以上。射频微系统封装完成后,对其电气性能指标进行了测试。在整个超宽带频带内,其接收噪声系数小于2.6 dB,增益大于35 dB,发射功率大于等于34 dBm,端口驻波小于2。该封装结构实现了硅基超宽带射频模块的微系统化,可广泛适用于各类超宽带射频系统。

高密度电容器件的制备及其可靠性

介绍了一种基于微机械加工技术(MicroElectronMechanical System,MEMS)的硅基高密度电容芯片的制备方法。该电容芯片采用了深孔刻蚀、介质淀积生长以及原位掺杂多晶硅等工艺技术,实现了高击穿电压(50V@1μA)、高电容密度(38.8~39.5nF/mm^(2))的电容芯片制备。

基于认知层次分类的卓越人才微系统建构

随着国家社会经济的发展变化,建筑行业整体出行下行趋势,建筑教育也必然转向“少而精”的卓越人才培养模式。研究以建筑学专业为例,对“卓越计划”与“专业评估”进行了比较,通过认知层次分类对卓越人才的概念进行了界定和解析。从系统论的角度出发,指出充分发挥“卓越计划”与“专业评估”的他组织系统积极性,促进学生自组织系统的形成,才能合理建构卓越人才培养的微系统。