This paper presents a timing-driven MultiChip Module (MCM) routing algorithm considering crosstalk, which maximizes routing density while minimizing vias and total wire length. The routing algorithm allows a more glob...This paper presents a timing-driven MultiChip Module (MCM) routing algorithm considering crosstalk, which maximizes routing density while minimizing vias and total wire length. The routing algorithm allows a more global solution as well as the incorporation of more accurate crosstalk modeling. In addition, various time domain characteristics of MCM are analyzed in this contribution. A deembedding technique for the S -parametercalculation is presented and functions for the time-domain signals are investigated in order to decrease the computation time. Routing results show that the proposed algorithm consistently produces the better results than other previously proposed routers while offering flexibility for future incorporation of noise and delay constraints.展开更多
As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. CVD diamond, because of its high thermal conductivity, low ...As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. CVD diamond, because of its high thermal conductivity, low dielectric loss and its great mechanical strength, is an excellent material for three dimensional （319） multichip modules （MCMs） in the next generation compact high speed computers and high power microwave components. In this paper, we have synthesized a large area freestanding diamond films and substrates, and polished diamond substrates, which make MCMs diamond film sink becomes a reality.展开更多
The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical ...The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.展开更多
基金Supported by National Defence Fund of China (No. 41323020204).
文摘This paper presents a timing-driven MultiChip Module (MCM) routing algorithm considering crosstalk, which maximizes routing density while minimizing vias and total wire length. The routing algorithm allows a more global solution as well as the incorporation of more accurate crosstalk modeling. In addition, various time domain characteristics of MCM are analyzed in this contribution. A deembedding technique for the S -parametercalculation is presented and functions for the time-domain signals are investigated in order to decrease the computation time. Routing results show that the proposed algorithm consistently produces the better results than other previously proposed routers while offering flexibility for future incorporation of noise and delay constraints.
基金Supported by National Natural Science Foundation of China (No.60371006)
文摘As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. CVD diamond, because of its high thermal conductivity, low dielectric loss and its great mechanical strength, is an excellent material for three dimensional （319） multichip modules （MCMs） in the next generation compact high speed computers and high power microwave components. In this paper, we have synthesized a large area freestanding diamond films and substrates, and polished diamond substrates, which make MCMs diamond film sink becomes a reality.
基金The work was partially funded by the Swedish Research Council,by the European 7^(th)Framework Programme under grant agreement FP7-NEMIAC(No.288670)by the European Research Council through the ERC Advanced Grant xMEMs(No.267528)and the ERC Starting Grant M&M’s(No.277879).
文摘The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.
