A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

Multi-Objective Prediction and Optimization of Vehicle Acoustic Package Based on ResNet Neural Network

Vehicle interior noise has emerged as a crucial assessment criterion for automotive NVH(Noise,Vibration,and Harshness).When analyzing the NVH performance of the vehicle body,the traditional SEA(Statistical Energy Analysis)simulation technology is usually limited by the accuracy of the material parameters obtained during the acoustic package modeling and the limitations of the application conditions.In order to effectively solve these shortcomings,based on the analysis of the vehicle noise transmission path,a multi-level objective decomposition architecture of the interior noise at the driver’s right ear is established.Combined with the data-driven method,the ResNet neural network model is introduced.The stacked residual blocks avoid the problem of gradient dis-appearance caused by the increasing network level of the traditional CNN network,thus establishing a higher-precision prediction model.This method alleviates the inherent limitations of traditional SEA simulation design,and enhances the prediction performance of the ResNet model by dynamically adjusting the learning rate.Finally,the proposed method is applied to a specific vehicle model and verified.The results show that the proposed meth-od has significant advantages in prediction accuracy and robustness.

Bisphenol A (BPA) Contamination in Whole Milk Marketed in Different Packages

Bisphenol A (BPA), an important endocrine disruptor, is used in the manufacturing of various materials, including food packaging. Ingestion of contaminated foodstuffs is, in fact, the most relevant form of exposure to this substance. However, scarce data on the presence of this contaminant in milk, or whether different types of food packaging influence food contamination are available in Brazil. This study, therefore, aimed to evaluate the BPA contamination of whole milk (fluid and powder) samples packaged in different types of packaging (Tetra Pak?;PET: Poly (ethylene terephthalate;Metallic can (epoxy resin);Polyethylene (PE) and poly (vinylidene chloride) (PVDC);Laminated Film - Metallized Polyester-Polyethylene and glass) and marketed metropolitan region of Rio de Janeiro, Brazil. An analytical method for the BPA determination in milk was optimized for both fluid (pasteurized and ultra-high temperature) and powdered milk samples. A modified QuEChERS method was applied, and BPA determinations were conducted by ultra-performance liquid chromatography coupled with sequential mass spectrometry (HPLC-MS/MS). The validated method was then applied to 51 milk samples, where BPA was detected in five samples (9.8%) and quantified in two (3.8%).

Modified Atmospheric Packaging and Its Effect on Postharvest Cannabis Quality

Cannabis sativa L. is used as fiber, food, and medicine in several countries. Though it is illegal for recreational use in most of the world, there are some countries that have legalized production and sale. There is a lot of research on production of cannabis, but less so on storage technologies. Cannabis contains several high value compounds, such as cannabinoids and terpenoids, that are susceptible to degradation via light, temperature, and oxygen. Several studies have explored temperature and light, and industry has adjusted accordingly. However, less is known about oxygen-induced degradation. Biochemical studies have demonstrated oxidative degradation of high value compounds, and many producers use some form of modified atmospheric packaging (MAP) for storage. However, the efficacy of MAP is unclear. The objective of this paper is to review our current understanding of MAP in postharvest cannabis storage and identify avenues where additional research is needed.

Sustainable, thermoplastic and hydrophobic coating from natural cellulose and cinnamon to fabricate eco-friendly catering packaging

Non-degradable polymers cause serious environmental pollution problem,such as the widely-used while unrecyclable coatings which significantly affect the overall degradation performance of products.It is imperative and attractive to develop biodegradable functional coatings.Herein,we proposed a novel strategy to successfully prepare biodegradable,thermoplastic and hydrophobic coatings with high transparence and biosafety by weakening the interchain interactions between cellulose chain.The natural cellulose and cinnamic acid were as raw materials.Via reducing the degree of polymerization(DP)of cellulose and regulating the degree of substitution(DS)of cinnamate moiety,the obtained cellulose cinnamate(CC)exhibited not only the thermalflow behavior but also good biodegradability,which solves the conflict between the thermoplasticity and biodegradability in cellulose-based materials.The glass transition temperature(T_(g))and thermalflow temperature(T_(f))of the CC could be adjusted in a range of 150–200℃ and 180–210℃,respectively.The CC with DS<1.2 and DP≤100 degraded more than 60%after an enzyme treatment for 7 days,and degraded more than 80%after a composting treatment for 42 days.Furthermore,CC had no toxicity to human epidermal cells even at a high concentration(0.5 mg mL^(-1)).In addition,CC could be easily fabricated into multifunctional coating with high hydrophobicity,thermal adhesion and high transparence.Therefore,after combining with cellophane and paperboard,CC coating with low DP and DS could be used to prepare fully-biodegradable heat-sealing packaging,art paper,paper cups,paper straws and food packaging boxes.

Analysis of quality-related proteins in golden pompano(Trachinotus ovatus)fillets with modified atmosphere packaging under superchilling storage

Here,we aimed to study the changes in proteome of golden pompano fillets during post-mortem storage.Tandem mass tags(TMT)-labeled quantitative proteomic strategy was applied to investigate the relationships between protein changes and quality characteristics of modified atmosphere packaging(MAP)fillets during superchilling(-3°C)storage.Scanning electron microscopy was used to show that the muscle histology microstructure of fillets was damaged to varying degrees,and low-field nuclear magnetic resonance was used to find that the immobilized water and free water in the muscle of fillets changed significantly.Total sulfhydryl content,TCA-soluble peptides and Ca2+-ATPase activity also showed that the fillet protein had a deterioration by oxidation and denaturation.The Fresh(FS),MAP,and air packaging(AP)groups were set.Total of 150 proteins were identified as differential abundant proteins(DAPs)in MAP/FS,while 209 DAPs were in AP/FS group.The KEGG pathway analysis indicated that most DAPs were involved in binding proteins and protein turnover.Correlation analysis found that 52 DAPs were correlated with quality traits.Among them,8 highly correlated DAPs are expected to be used as potential quality markers for protein oxidation and water-holding capacity.These results provide a further understanding of the muscle deterioration mechanism of packaging golden pompano fillets during superchilling.

Study on the Influence of Food Packaging on the Psychology of Different Groups of Consumers

With the vigorous development of consumer culture in today’s society,various types of food packaging also appear in front of consumers in different forms.There are very big differences in food packaging in terms of shape,color,style and other aspects of information transmission,which have the most direct impact on the audience’s food consumption needs.Driven by the consumption-oriented society,food packaging has shown very obvious comprehensive characteristics,is significantly interdisciplinary,and has close connections with other disciplines.This article will analyze and sort out the impact of food packaging on consumer psychology from different perspectives.

Research on Silicon Carbide Dispersion-Reinforced Hypereutectic Aluminum-Silicon Electronic Packaging Materials

The objective of this study is to improve the mechanical properties and machining performance of high thermal conductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon electronic packaging materials to meet the needs of aviation,aerospace,and electronic packaging fields.We used the powder metallurgy method and high-temperature hot pressing technology to prepare SiC/Al-Si composite materials with different SiC contents(5vol%,10vol%,15vol%,and 20vol%).The results showed that as the SiC content increased,the tensile strength of the composite material first increased and then decreased.The tensile strength was the highest when the SiC content was 15%;the sintering temperature significantly affected the composite material’s structural density and mechanical properties.Findings indicated 700℃was the optimal sintering and the optimal SiC content of SiC/Al-Si composite materials was between 10%and 15%.Besides,the sintering temperature should be strictly controlled to improve the material’s structural density and mechanical properties.

利用Oracle PL/SQL Package实现Dispatcher设计模式

Dispatcher设计模式可以使用各种技术来实现。以社会保险业务处理为基础,有效地利用ORACLEPL/SQLPac-kage语言及支撑环境对面向对象技术的支持,通过定义消息ID、传递消息ID、撰写处理函数、连接消息ID和处理函数来实现Dispatcher设计模式,并且构造出能处理各项社会保险管理业务的Package组件。

利用ORACLE PL/SQL PACKAGE实现DISPATCHER设计模式

以ORACLEPACKAGE语言及支撑环境为基础,有效地利用其对面向对象技术的支持,实现DISPATCHER设计模式。

澳大利亚Training Package对机电一体化技术专业教学标准建设的启示

开发、制订专业教学标准是贯彻落实科学发展观,落实《教育规划纲要》要求,完善教育质量国家标准体系,推进现代职业教育体系建设的重要措施.从澳大利亚职业培训包的制度中吸取有益经验,立足于我国实际,分析了机电一体化技术专业的现状和改革中遇到的问题,结合教育部加强专业教学标准建设推进工作提出了机电一体化技术专业教学标准建设的相关建议.

MUTI-FUNCTIONAL PACKAGE多功能DESIGN包装设计的研究

随着经济的发展,商品的包装越来越受到大家的重视,包装产业亦是迅猛发展,且取得了瞩目的成就。但是随着包装材料使用量的逐渐增大,包装废弃物污染环境的问题也越来越严重。包装绿色设计已日益显现出对环保的积极作用,其作用可以总结为：有利于保护自然资源,以及在包装的整个设计、制造、使用和回收利用的过程中对生态环境损失最小。

Ultrasonic C-scan Detection for Stainless Steel Spot Welding Based on Wavelet Package Analysis

An ultrasonic test of spot welding for stainless steel is conducted. Based on wavelet packet decomposition, the ultrasonic echo signal has been analyzed deeply in time - frequency domain, which can easily distinguish the nugget from the corona bond. The 2D C-scan images produced by ultrasonic C scan which contribute to quantitatively calculate the nugget diameter for the computer are further analyzed. The spot welding nugget diameter can be automatically obtained by image enhancement, edge detection and equivalent diameter algorithm procedure. The ultrasonic detection values in this paper show good agreement with the metallographic measured values. The mean value of normal distribution curve is 0.006 67, and the standard deviation is 0.087 11. Ultrasonic C-scan test based on wavelet packet signal analysis is of high accuracy and stability.

Integrated physics package of a chip-scale atomic clock

The physics package of a chip-scale atomic clock （CSAC） has been successfully realized by integrating vertical cavity surface emitting laser （VCSEL）, neutral density （ND） filter, λ/4 wave plate, 87Rb vapor cell, photodiode （PD）, and magnetic coil into a cuboid metal package with a volume of about 2.8 cm3. In this physics package, the critical component, 87Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of 87Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7 × 10^-10τ-1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC.

Effects of gold plating on the resistance to high temperature discoloration of the cavity for ceramic packages

The effects of thickness and types of gold plating on the resistance to hightemperature discoloration of gold plating on cavity surface of ceramic package were investigated. Itwas found that the thicker gold plating, the less discoloration degree for ceramic packages.Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide goldplating. The relationship between the gold plating thickness and the amount of diffused Ni to thegold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃ for 15 minwas also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Coplating systems, respectively, no discoloration was observed on the gold plating surface of cavity,and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Coto the gold plating is 0.04%.

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase.

EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE(QFP)SOLDERED JOINTS

The finite element method（FEM） is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn＇t decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter： The lead width is 0.2 mm and lead pitch is 0.3 mm （the distance between two leads is 0.1 mm）, which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm （the distance between two leads is 0.1 mm）, the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

HOTCAP:a new software package for high-speed oscilloscopebased three-dimensional bunch charge and position measurement

A software package to be used in high-speed oscilloscope-basedthree-dimensionalbunch-by-bunch charge and position measurement is presented.The software package takes the pick-up electrode signal waveform recorded by the high-speed oscilloscope as input,and it calculates and outputs the bunch-by-bunch charge and position.In addition to enabling a three-dimensional observation of the motion of each passing bunch on all beam position monitor pick-up electrodes,it offers many additional features such as injection analysis,bunch response function reconstruction,and turn-by-turn beam analysis.The software package has an easy-to-understand graphical user interface and convenient interactive operation,which has been verified on the Windows 10 system.

Clinical Observation on 80 Cases of Anal Edema after Mixed Hemorrhoids Operation with Chinese Medicine Hot Election Package

The subjects of this study were 80 patients who underwent mixed hemorrhoids surgery in our hospital from January to October 2020 (mixed hemorrhoids external and internal ligation, internal hemorrhoids ligation or Xiaozhiling injection) and developed anal edge edema after surgery. According to the order of hospitalization, the patients were randomly divided into treatment group and control group, with 40 cases each. In the control group, blank hot pack was applied on the basis of anorectal No. 1 lotion for prevention and treatment of anal edge edema after operation;in the treatment group, hot pack of Traditional Chinese medicine was applied on the basis of anorectal No. 1 lotion for prevention and treatment of anal edge edema. The course of treatment was 7 days. The edema subsidence and postoperative pain scores were observed in both groups. Results: The scores of anal edema and pain in the treatment group were significantly lower than those in the control group (P < 0.05), and the significant efficiency and total effective rate in the treatment group were significantly better than those in the control group, with statistical difference (P < 0.05). Conclusion: Chinese medicine hot election package is effective in treating postoperative anal edema of mixed hemorrhoids, and the method is simple and suitable for clinical promotion.

Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages

A thermal fatigue lifetime prediction model of ceramic ball grid array(CBGA)packages is proposed based on the Darveaux model.A finite element model of the CBGA packages is established,and the Anand model is used to describe the viscoplasticity of the CBGA solder.The average viscoplastic strain energy density increment △Wave of the CBGA packages is obtained using a finite element simulation,and the influence of different structural parameters on theWave is analyzed.A simplified analytical model of the △Wave is established using the simulation data.The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test.The Darveaux lifetime predictionmodel ismodified based on the thermal fatigue lifetime obtained fromthe experiment and the corresponding △Wave.A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages.This proposed model can be used in engineering to evaluate the lifetime of CBGA packages.