The oxidation induced stacking faults （OISFs） exposed on the surface of polished silicon substrate are harmful to the electrical performance and reliability of the device region located on the wafer surface. This wo...The oxidation induced stacking faults （OISFs） exposed on the surface of polished silicon substrate are harmful to the electrical performance and reliability of the device region located on the wafer surface. This work investigates the characteristics of the novel nano colloidal silica alkaline slurry, including polyamine and complex non-ions surface surfactant. The experimental results show that when the pH value is higher than 10.1, the removal rate can be higher than 750 nm/min and the surface roughness can be lower than 0.3 nm （10 × 10 μ2）. The surface OISFs existing on the wafer are efficiently controlled with the slurry, and the defect density on the polished wafer surface decreases greatly as well.展开更多
基金supported by the Major National Science and Technology Special Projects(No.2009ZX02308)the Tianjin Natural Science Foundation of China(No.10JCZDJC15500)+1 种基金the National Natural Science Foundation of China(No.10676008)the Fund Project of Hebei Provincial Department of Education(No.2011128)
文摘The oxidation induced stacking faults （OISFs） exposed on the surface of polished silicon substrate are harmful to the electrical performance and reliability of the device region located on the wafer surface. This work investigates the characteristics of the novel nano colloidal silica alkaline slurry, including polyamine and complex non-ions surface surfactant. The experimental results show that when the pH value is higher than 10.1, the removal rate can be higher than 750 nm/min and the surface roughness can be lower than 0.3 nm （10 × 10 μ2）. The surface OISFs existing on the wafer are efficiently controlled with the slurry, and the defect density on the polished wafer surface decreases greatly as well.
