Disbond detection with piezoelectric wafer active sensors in RC structures strengthened with FRP composite overlays

The capability of embedded piezoelectric wafer active sensors(PWAS)to perform in-situ nondestructive evaluation(NDE)for structural health monitoring(SHM)of reinforced concrete(RC)structures strengthened with fiber reinforced polymer(FRP)composite overlays is explored.First,the disbond detection method were developed on coupon specimens consisting of concrete blocks covered with an FRP composite layer.It was found that the presence of a disbond crack drastically changes the electromecfianical(E/M)impedance spectrum lneasurcd at the PWAS terlninals.The spectral changes depend on the distance between the PWAS and the crack tip.Second,large scale experiments were conducted on a RC beam strengthened with carbon fiber reinforced polymer(CFRP)composite overlay.The beam was subject to an accelerated fatigue load regime in a three-point bending configuration up to a total of 807,415 cycles.During these fatigue tests,the CFRP overlay experienced disbonding beginning at about 500,000 cycles.The PWAS were able to detect the disbonding before it could be reliably seen by visual inspection.Good correlation between the PWAS readings and the position and extent of disbond damage was observed.These preliminary results demonstrate the potential of PWAS technology for SHM of RC structures strengthened with FRP composite overlays.

Crack monitoring using multiple smart materials;fiber-optic sensors&piezo sensors

This article focuses on health monitoring of structures using multiple smart materials.In this research,two fiber-optic sensors,namely fiber Bragg grating(FBG)and fiber-optic polarimetric sensor(FOPS),are investigated for damage detection in the beam specimen.FBG is used for local strain measurement while FOPS is used for global strain measurement.Both FBG and FOPS show significant changes in the strain due to damages in the specimen.Also,at the center of the specimen,piezoelectric wafer active sensor(PWAS)is attached.The electromechanical admittance(EMA)signature of the specimen beam is recorded by PWAS.The changes in the amplitudes of the peaks obtained at various frequencies in this EMA signature are analyzed,and it is shown that the peak amplitudes respond differently to damages and to change in loading.Thus,multiple smart materials(FBG,FOPS,and PWAS)are used to get improved information on the health of the beam.