Based on surface mount products virtual assembly technology,the solder joint reliability of plastic ball grid array (PBGA) was studied. Four process parameters,including the upper pad diameter,the stencil thickness,th...Based on surface mount products virtual assembly technology,the solder joint reliability of plastic ball grid array (PBGA) was studied. Four process parameters,including the upper pad diameter,the stencil thickness,the chip weight on a single solder joint and the lower pad diameter were chose as four control factors. By using an L25(56) orthogonal array the PBGA solder joints which have 25 different process parameters’ levels combinations were designed. The numerical models of all the 25 PBGA solder joints were developed and the finite element analysis models were setup. The stress and strain distribution within the PBGA solder joints under thermal cycles were studied by finite element analysis,and the thermal fatigue life of PBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results,the range analysis was performed. The results of study show that that the impact sequence of the four factors from high to low on the fatigue life of PBGA solder joints are the stencil thickness,the upper pad diameter,the lower pad diameter and the chip weight on a single solder joint; the best level combination ofprocess parameters that results in the longest fatigue life is the lower pad diameter of 0.6 mm,the stencil thickness of 0.175 mm,the chip weight on asingle solder joint of 28×10 -5 N and the upper pad diameter of 0.5 mm.展开更多
An equivalent continuum method only considering the stretching deformation of struts was used to study the in-plane stiffness and strength of planar lattice grid com- posite materials. The initial yield equations of l...An equivalent continuum method only considering the stretching deformation of struts was used to study the in-plane stiffness and strength of planar lattice grid com- posite materials. The initial yield equations of lattices were deduced. Initial yield surfaces were depicted separately in different 3D and 2D stress spaces. The failure envelope is a polyhedron in 3D spaces and a polygon in 2D spaces. Each plane or line of the failure envelope is corresponding to the yield or buckling of a typical bar row. For lattices with more than three bar rows, subsequent yield of the other bar row after initial yield made the lattice achieve greater limit strength. The importance of the buckling strength of the grids was strengthened while the grids were relative sparse. The integration model of the method was used to study the nonlinear mechanical properties of strain hardening grids. It was shown that the integration equation could accurately model the complete stress-strain curves of the grids within small deformations.展开更多
Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu （SAC） lead-free ball grid array （ BGA ） solder joints. The dynamic hardness of two kinds of solder joints decreases with ...Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu （SAC） lead-free ball grid array （ BGA ） solder joints. The dynamic hardness of two kinds of solder joints decreases with indentation depth increase. SACO705 BiNi/ Cu exhibits a higher ultimate dynamic hardness and a smaller indentation depth than SAC305/ Cu. Then the strain hardening phenomenon of SAC305/ Cu is more obvious compared to that of SACO705 BiNi/ Cu. The indentation creep of SACO705BiNi/ Cu solder joint is lower than that of SAC305/ Cu solder joint before and after thermal shock. The creep rate sensitive index of SACBiNi/Cu solder joint is lower than that of solder joint. SACO705BiNi/Cu solder joint is superior to SAC305/Cu solder joint in the anti-creep property. The plasticity of SACOTOSBiNi/Cu and SAC305/Cu solder joints are similar. Compared with SAC305 solder, the SACO705 BiNi solder pe^forms higher hardness and solder creep resistance and still maintains a good plasticity.展开更多
This paper aims at revealing various micro- deformation characteristics, such as crystalline slip and grain boundary slide, which are recorded under scanning electronic microscope for high-purity aluminum tensile spec...This paper aims at revealing various micro- deformation characteristics, such as crystalline slip and grain boundary slide, which are recorded under scanning electronic microscope for high-purity aluminum tensile specimen at room temperature. These experimental data provide us direct evidence for shear localization near the grain boundary network via multi- directional grain boundary slide. The nonuniform deformation induced in the grain interiors would have decisive effect on the plastic flow and failure of polycrystalline materials.展开更多
基金Funded by Science Foundation of Guangxi Zhuang Autonomous Region (No.02336060) .
文摘Based on surface mount products virtual assembly technology,the solder joint reliability of plastic ball grid array (PBGA) was studied. Four process parameters,including the upper pad diameter,the stencil thickness,the chip weight on a single solder joint and the lower pad diameter were chose as four control factors. By using an L25(56) orthogonal array the PBGA solder joints which have 25 different process parameters’ levels combinations were designed. The numerical models of all the 25 PBGA solder joints were developed and the finite element analysis models were setup. The stress and strain distribution within the PBGA solder joints under thermal cycles were studied by finite element analysis,and the thermal fatigue life of PBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results,the range analysis was performed. The results of study show that that the impact sequence of the four factors from high to low on the fatigue life of PBGA solder joints are the stencil thickness,the upper pad diameter,the lower pad diameter and the chip weight on a single solder joint; the best level combination ofprocess parameters that results in the longest fatigue life is the lower pad diameter of 0.6 mm,the stencil thickness of 0.175 mm,the chip weight on asingle solder joint of 28×10 -5 N and the upper pad diameter of 0.5 mm.
基金the China Postdoctoral Science Foundation (20060400465)the National Natural Science Foundation of China (10702033)
文摘An equivalent continuum method only considering the stretching deformation of struts was used to study the in-plane stiffness and strength of planar lattice grid com- posite materials. The initial yield equations of lattices were deduced. Initial yield surfaces were depicted separately in different 3D and 2D stress spaces. The failure envelope is a polyhedron in 3D spaces and a polygon in 2D spaces. Each plane or line of the failure envelope is corresponding to the yield or buckling of a typical bar row. For lattices with more than three bar rows, subsequent yield of the other bar row after initial yield made the lattice achieve greater limit strength. The importance of the buckling strength of the grids was strengthened while the grids were relative sparse. The integration model of the method was used to study the nonlinear mechanical properties of strain hardening grids. It was shown that the integration equation could accurately model the complete stress-strain curves of the grids within small deformations.
基金This work was supported by National Natural Science Foundation of China （ Grant No. 51174069 and 51075107） and Research Special Funds for Technology Creative Talents of Harbin （Grant No. 2013RFQXJ166）.
文摘Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu （SAC） lead-free ball grid array （ BGA ） solder joints. The dynamic hardness of two kinds of solder joints decreases with indentation depth increase. SACO705 BiNi/ Cu exhibits a higher ultimate dynamic hardness and a smaller indentation depth than SAC305/ Cu. Then the strain hardening phenomenon of SAC305/ Cu is more obvious compared to that of SACO705 BiNi/ Cu. The indentation creep of SACO705BiNi/ Cu solder joint is lower than that of SAC305/ Cu solder joint before and after thermal shock. The creep rate sensitive index of SACBiNi/Cu solder joint is lower than that of solder joint. SACO705BiNi/Cu solder joint is superior to SAC305/Cu solder joint in the anti-creep property. The plasticity of SACOTOSBiNi/Cu and SAC305/Cu solder joints are similar. Compared with SAC305 solder, the SACO705 BiNi solder pe^forms higher hardness and solder creep resistance and still maintains a good plasticity.
基金Sponsored by the National Natural Science Foundation of China and the Fok Ying-Tung Education Foundation.
文摘This paper aims at revealing various micro- deformation characteristics, such as crystalline slip and grain boundary slide, which are recorded under scanning electronic microscope for high-purity aluminum tensile specimen at room temperature. These experimental data provide us direct evidence for shear localization near the grain boundary network via multi- directional grain boundary slide. The nonuniform deformation induced in the grain interiors would have decisive effect on the plastic flow and failure of polycrystalline materials.
