Polycrystalline Si(poly-Si)-based passivating contacts are promising candidates for high-efficiency crystalline Si solar cells.We show that nanosecond-scale pulsed laser melting(PLM)is an industrially viable technique...Polycrystalline Si(poly-Si)-based passivating contacts are promising candidates for high-efficiency crystalline Si solar cells.We show that nanosecond-scale pulsed laser melting(PLM)is an industrially viable technique to fabricate such contacts with precisely controlled dopant concentration profiles that exceed the solid solubility limit.We demonstrate that conventionally doped,hole-selective poly-Si/SiO_(x)contacts that provide poor surface passivation of c-Si can be replaced with Ga-or B-doped contacts based on non-equilibrium doping.We overcome the solid solubility limit for both dopants in poly-Si by rapid cooling and recrystallization over a timescale of∼25 ns.We show an active Ga dopant concentration of∼3×10^(20)cm^(−3)in poly-Si which is six times higher than its solubility limit in c-Si,and a B dopant concentration as high as∼10^(21) cm^(−3).We measure an implied open-circuit voltage of 735 mV for Ga-doped poly-Si/SiO_(x)contacts on Czochralski Si with a low contact resistivity of 35.5±2.4 mΩcm^(2).Scanning spreading resistance microscopy and Kelvin probe force microscopy show large diffusion and drift current in the p-n junction that contributes to the low contact resistivity.Our results suggest that PLM can be extended for hyperdoping of other semiconductors with low solubility atoms to enable high-efficiency devices.展开更多
We have developed an apparatus for producing high-density hydrogen plasma. The atomic hydrogen density was 3.0 × 1021 m?3 at a pressure of 30 Pa, a microwave power of 1000 W, and a hydrogen gas flow rate of 5 scc...We have developed an apparatus for producing high-density hydrogen plasma. The atomic hydrogen density was 3.0 × 1021 m?3 at a pressure of 30 Pa, a microwave power of 1000 W, and a hydrogen gas flow rate of 5 sccm. We confirmed that the temperatures of tungsten films increased to above 1000?C within 5 s when they were exposed to hydrogen plasma formed using the apparatus. We applied this phenomenon to the selective heat treatment of tungsten films deposited on amorphous silicon films on glass substrates and formed polycrystalline silicon films. To utilize this method, we can perform the crystalline process only on device regions. TFTs were fabricated on the polycrystalline silicon films and the electron mobilities of 60 cm2/Vs were obtained.展开更多
针对具有poly-Si1-x Ge x栅的应变Si Ge p型金属氧化物半导体场效应晶体管(PMOSFET),研究了其垂直电势与电场分布,建立了考虑栅耗尽的poly-Si1-x Ge x栅情况下该器件的等效栅氧化层厚度模型,并利用该模型分析了poly-Si1-x Ge x栅及应变S...针对具有poly-Si1-x Ge x栅的应变Si Ge p型金属氧化物半导体场效应晶体管(PMOSFET),研究了其垂直电势与电场分布,建立了考虑栅耗尽的poly-Si1-x Ge x栅情况下该器件的等效栅氧化层厚度模型,并利用该模型分析了poly-Si1-x Ge x栅及应变Si Ge层中Ge组分对等效氧化层厚度的影响.研究了应变Si Ge PMOSFET热载流子产生的机理及其对器件性能的影响,以及引起应变Si Ge PMOSFET阈值电压漂移的机理,并建立了该器件阈值电压漂移模型,揭示了器件阈值电压漂移随电应力施加时间、栅极电压、polySi1-x Ge x栅及应变Si Ge层中Ge组分的变化关系.并在此基础上进行了实验验证,在电应力施加10000 s时,阈值电压漂移0.032 V,与模拟结果基本一致,为应变Si Ge PMOSFET及相关电路的设计与制造提供了重要的理论与实践基础.展开更多
The negative gate bias stress(NBS)reliability of n-type polycrystalline silicon(poly-Si)thin-film transistors(TFTs)with a distinct defective grain boundary(GB)in the channel is investigated.Results show that conventio...The negative gate bias stress(NBS)reliability of n-type polycrystalline silicon(poly-Si)thin-film transistors(TFTs)with a distinct defective grain boundary(GB)in the channel is investigated.Results show that conventional NBS degradation with negative shift of the transfer curves is absent.The on-state current is decreased,but the subthreshold characteristics are not affected.The gate bias dependence of the drain leakage current at V_(ds)of 5.0 V is suppressed,whereas the drain leakage current at V_(ds)of 0.1 V exhibits obvious gate bias dependence.As confirmed via TCAD simulation,the corresponding mechanisms are proposed to be trap state generation in the GB region,positive-charge local formation in the gate oxide near the source and drain,and trap state introduction in the gate oxide.展开更多
Based on Al induced crystallization (AIC) method, influences of different material structures on formation and characteristics of ploy-silicon thin films were studied and optimized. Al-Si films on glass with different...Based on Al induced crystallization (AIC) method, influences of different material structures on formation and characteristics of ploy-silicon thin films were studied and optimized. Al-Si films on glass with different structures (Si/Al/Glass, Al/Si/Glass, Si/Al/…/Si/Al/Glass) were deposited on glass substrates by sputtering method. All samples were annealed for MIC with varied time processes under 500℃ N2 environment. X-ray diffraction test and scanning electron microscope were adopted to characterize crystallization performance and surface topography of AIC poly-silicon samples after removing resid- ual aluminum. The electrical properties were also characterized by Hall test method. Quick process and high performance of AIC ploy-silicon thin film can be both obtained by use of periodic structure samples.展开更多
基金the National Renewable Energy Laboratory,operated by Alliance for Sustainable Energy,LLC,for the U.S.Department of Energy(DOE)under Contract No.DE-AC36-08GO28308.
文摘Polycrystalline Si(poly-Si)-based passivating contacts are promising candidates for high-efficiency crystalline Si solar cells.We show that nanosecond-scale pulsed laser melting(PLM)is an industrially viable technique to fabricate such contacts with precisely controlled dopant concentration profiles that exceed the solid solubility limit.We demonstrate that conventionally doped,hole-selective poly-Si/SiO_(x)contacts that provide poor surface passivation of c-Si can be replaced with Ga-or B-doped contacts based on non-equilibrium doping.We overcome the solid solubility limit for both dopants in poly-Si by rapid cooling and recrystallization over a timescale of∼25 ns.We show an active Ga dopant concentration of∼3×10^(20)cm^(−3)in poly-Si which is six times higher than its solubility limit in c-Si,and a B dopant concentration as high as∼10^(21) cm^(−3).We measure an implied open-circuit voltage of 735 mV for Ga-doped poly-Si/SiO_(x)contacts on Czochralski Si with a low contact resistivity of 35.5±2.4 mΩcm^(2).Scanning spreading resistance microscopy and Kelvin probe force microscopy show large diffusion and drift current in the p-n junction that contributes to the low contact resistivity.Our results suggest that PLM can be extended for hyperdoping of other semiconductors with low solubility atoms to enable high-efficiency devices.
基金Project supported by the National Key Research and Development Program of China(Grant Nos.2016YFA0302300 and 2016YFA0200404)the National Natural Science Foundation of China(Grant No.61306105)+2 种基金the National Science and Technology Major Project of China(Grant No.2011ZX02708-002)the Tsinghua University Initiative Scientific Research Program,Chinathe Tsinghua National Laboratory for Information Science and Technology(TNList)Cross-discipline Foundation,China
文摘We have developed an apparatus for producing high-density hydrogen plasma. The atomic hydrogen density was 3.0 × 1021 m?3 at a pressure of 30 Pa, a microwave power of 1000 W, and a hydrogen gas flow rate of 5 sccm. We confirmed that the temperatures of tungsten films increased to above 1000?C within 5 s when they were exposed to hydrogen plasma formed using the apparatus. We applied this phenomenon to the selective heat treatment of tungsten films deposited on amorphous silicon films on glass substrates and formed polycrystalline silicon films. To utilize this method, we can perform the crystalline process only on device regions. TFTs were fabricated on the polycrystalline silicon films and the electron mobilities of 60 cm2/Vs were obtained.
文摘针对具有poly-Si1-x Ge x栅的应变Si Ge p型金属氧化物半导体场效应晶体管(PMOSFET),研究了其垂直电势与电场分布,建立了考虑栅耗尽的poly-Si1-x Ge x栅情况下该器件的等效栅氧化层厚度模型,并利用该模型分析了poly-Si1-x Ge x栅及应变Si Ge层中Ge组分对等效氧化层厚度的影响.研究了应变Si Ge PMOSFET热载流子产生的机理及其对器件性能的影响,以及引起应变Si Ge PMOSFET阈值电压漂移的机理,并建立了该器件阈值电压漂移模型,揭示了器件阈值电压漂移随电应力施加时间、栅极电压、polySi1-x Ge x栅及应变Si Ge层中Ge组分的变化关系.并在此基础上进行了实验验证,在电应力施加10000 s时,阈值电压漂移0.032 V,与模拟结果基本一致,为应变Si Ge PMOSFET及相关电路的设计与制造提供了重要的理论与实践基础.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61971299 and 61974101)the Natural Science Foundation of Jiangsu Province of China(Grant No.BK20201201)+1 种基金the Fund from Suzhou Science and Technology Bureau(Grant No.SYG201933)the Fund from the State Key Laboratory of ASIC and System,Fudan University(Grant No.2021KF005)
文摘The negative gate bias stress(NBS)reliability of n-type polycrystalline silicon(poly-Si)thin-film transistors(TFTs)with a distinct defective grain boundary(GB)in the channel is investigated.Results show that conventional NBS degradation with negative shift of the transfer curves is absent.The on-state current is decreased,but the subthreshold characteristics are not affected.The gate bias dependence of the drain leakage current at V_(ds)of 5.0 V is suppressed,whereas the drain leakage current at V_(ds)of 0.1 V exhibits obvious gate bias dependence.As confirmed via TCAD simulation,the corresponding mechanisms are proposed to be trap state generation in the GB region,positive-charge local formation in the gate oxide near the source and drain,and trap state introduction in the gate oxide.
文摘Based on Al induced crystallization (AIC) method, influences of different material structures on formation and characteristics of ploy-silicon thin films were studied and optimized. Al-Si films on glass with different structures (Si/Al/Glass, Al/Si/Glass, Si/Al/…/Si/Al/Glass) were deposited on glass substrates by sputtering method. All samples were annealed for MIC with varied time processes under 500℃ N2 environment. X-ray diffraction test and scanning electron microscope were adopted to characterize crystallization performance and surface topography of AIC poly-silicon samples after removing resid- ual aluminum. The electrical properties were also characterized by Hall test method. Quick process and high performance of AIC ploy-silicon thin film can be both obtained by use of periodic structure samples.
