As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated by a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is ...As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated by a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is used as the primary source for exciting fluorescent material such as cerium doped yttrium aluminum garnet with the formula Y3Al5O12∶Ce3+(in short: YAG∶Ce3+). The matching of the spectrum of the blue LED chips and the YAG∶Ce3+ yellow phosphor is studied to improve the conversion efficiency. The packaging methods and manufacturing processes for high-power single-chip-white-LEDs are introduced. The uniformity of the output white light is investigated. Based on the characteristics of the high-power white LEDs, some approaches and processes are suggested to improve the light uniformity when they are fabricated. The effectiveness of those approaches on the improvement of LEDs is discussed in detail and some interesting conclusions are also presented.展开更多
为最大可能提高大功率LED路灯发光板的电光转化率与散热效率,在不影响外量子效率前提下对LED芯片设计采用扩大LED芯片面积,以及电极优化技术增加LED芯片的出光量,使芯片表面热流均匀分布,芯片工作更稳定。分析了大功率白光LED的封装过...为最大可能提高大功率LED路灯发光板的电光转化率与散热效率,在不影响外量子效率前提下对LED芯片设计采用扩大LED芯片面积,以及电极优化技术增加LED芯片的出光量,使芯片表面热流均匀分布,芯片工作更稳定。分析了大功率白光LED的封装过程对提高芯片取光率、保障白光质量、器件散热技术的综合应用。综合上述技术及有限元分析软件对大功率LED器件封装的热阻分析结果,确定了COB(chip on board)LED芯片的阵列组装技术,为制造LED路灯发光板的最佳技术方案。LED芯片结温很容易控制在120℃以下,与外部散热技术兼容性好。通过光线最佳归一化数学模型计算了LED芯片阵列芯片间最佳距离。最后通过对各种白光LED驱动方案的比较,确定了白光LED最佳驱动方案为恒电流驱动脉宽调制(PWM)调节亮度。展开更多
基金"863"Project from Ministry of Science & Technology of China(2006AA03A116)
文摘As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated by a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is used as the primary source for exciting fluorescent material such as cerium doped yttrium aluminum garnet with the formula Y3Al5O12∶Ce3+(in short: YAG∶Ce3+). The matching of the spectrum of the blue LED chips and the YAG∶Ce3+ yellow phosphor is studied to improve the conversion efficiency. The packaging methods and manufacturing processes for high-power single-chip-white-LEDs are introduced. The uniformity of the output white light is investigated. Based on the characteristics of the high-power white LEDs, some approaches and processes are suggested to improve the light uniformity when they are fabricated. The effectiveness of those approaches on the improvement of LEDs is discussed in detail and some interesting conclusions are also presented.
文摘为最大可能提高大功率LED路灯发光板的电光转化率与散热效率,在不影响外量子效率前提下对LED芯片设计采用扩大LED芯片面积,以及电极优化技术增加LED芯片的出光量,使芯片表面热流均匀分布,芯片工作更稳定。分析了大功率白光LED的封装过程对提高芯片取光率、保障白光质量、器件散热技术的综合应用。综合上述技术及有限元分析软件对大功率LED器件封装的热阻分析结果,确定了COB(chip on board)LED芯片的阵列组装技术,为制造LED路灯发光板的最佳技术方案。LED芯片结温很容易控制在120℃以下,与外部散热技术兼容性好。通过光线最佳归一化数学模型计算了LED芯片阵列芯片间最佳距离。最后通过对各种白光LED驱动方案的比较,确定了白光LED最佳驱动方案为恒电流驱动脉宽调制(PWM)调节亮度。
