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Detection Algorithm of Surface Defect Word on Printed Circuit Board
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作者 Min Zhang Haixu Xi 《Computer Systems Science & Engineering》 SCIE EI 2023年第9期3911-3923,共13页
For Printed Circuit Board(PCB)surface defect detection,traditional detection methods mostly focus on template matching-based reference method and manual detections,which have the disadvantages of low defect detection ... For Printed Circuit Board(PCB)surface defect detection,traditional detection methods mostly focus on template matching-based reference method and manual detections,which have the disadvantages of low defect detection efficiency,large errors in defect identification and localization,and low versatility of detectionmethods.In order to furthermeet the requirements of high detection accuracy,real-time and interactivity required by the PCB industry in actual production life.In the current work,we improve the Youonly-look-once(YOLOv4)defect detection method to train and detect six types of PCB small target defects.Firstly,the original Cross Stage Partial Darknet53(CSPDarknet53)backbone network is preserved for PCB defect feature information extraction,and secondly,the original multi-layer cascade fusion method is changed to a single-layer feature layer structure to greatly avoid the problem of uneven distribution of priori anchor boxes size in PCB defect detection process.Then,the K-means++clustering method is used to accurately cluster the anchor boxes to obtain the required size requirements for the defect detection,which further improves the recognition and localization of small PCB defects.Finally,the improved YOLOv4 defect detection model is compared and analyzed on PCB dataset with multi-class algorithms.The experimental results show that the average detection accuracy value of the improved defect detection model reaches 99.34%,which has better detection capability,lower leakage rate and false detection rate for PCB defects in comparison with similar defect detection algorithms. 展开更多
关键词 printed circuit board defect detection small target
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Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method
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作者 郑小虎 阮浩 +2 位作者 陈宏博 刘骁佳 刘正好 《Journal of Donghua University(English Edition)》 CAS 2023年第5期525-530,共6页
The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole process... The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole processing.The problem of optimal control of its drilling force is one of the main factors affecting the quality of micro-hole machining.To address this problem,the thrust forces and torques in PCB drilling were first modeled and analyzed,and the corresponding prediction models were established.The drilling force analysis was carried out through the micro-hole drilling experiment,the specific cutting energy under different feed rates was calculated,the influence of the size effect was clarified,and the accuracy of the prediction model was verified.The result shows that during the drilling of glass fiber cloth,changes in the material removal mechanism are induced as the feed per revolution is varied.When the feed per revolution is less than the tool edge radius,the glass fiber is not cut by the main cutting edge,but is crushed and broken.When the feed per revolution is greater than the radius of the tool edge,the glass fiber is cut by the main cutting edge.At the same time,the established analytical model can accurately reflect the influence of the size effect on the drilling torque in PCB micro-hole drilling,and the error is within 10%.This method has certain practical application value in controlling PCB micro hole processing quality. 展开更多
关键词 printed circuit board(pcb) micro-hole drilling predictive model size effect multi-layer material
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Industry-Oriented Detection Method of PCBA Defects Using Semantic Segmentation Models
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作者 Yang Li Xiao Wang +10 位作者 Zhifan He Ze Wang Ke Cheng Sanchuan Ding Yijing Fan Xiaotao Li Yawen Niu Shanpeng Xiao Zhenqi Hao Bin Gao Huaqiang Wu 《IEEE/CAA Journal of Automatica Sinica》 SCIE EI CSCD 2024年第6期1438-1446,共9页
Automated optical inspection(AOI)is a significant process in printed circuit board assembly(PCBA)production lines which aims to detect tiny defects in PCBAs.Existing AOI equipment has several deficiencies including lo... Automated optical inspection(AOI)is a significant process in printed circuit board assembly(PCBA)production lines which aims to detect tiny defects in PCBAs.Existing AOI equipment has several deficiencies including low throughput,large computation cost,high latency,and poor flexibility,which limits the efficiency of online PCBA inspection.In this paper,a novel PCBA defect detection method based on a lightweight deep convolution neural network is proposed.In this method,the semantic segmentation model is combined with a rule-based defect recognition algorithm to build up a defect detection frame-work.To improve the performance of the model,extensive real PCBA images are collected from production lines as datasets.Some optimization methods have been applied in the model according to production demand and enable integration in lightweight computing devices.Experiment results show that the production line using our method realizes a throughput more than three times higher than traditional methods.Our method can be integrated into a lightweight inference system and pro-mote the flexibility of AOI.The proposed method builds up a general paradigm and excellent example for model design and optimization oriented towards industrial requirements. 展开更多
关键词 Automated optical inspection(AOI) deep learning defect detection printed circuit board assembly(pcbA) semantic segmentation.
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Study on High-power LED Heat Dissipation Based on Printed Circuit Board 被引量:2
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作者 WANG Yiwei ZHANG Jianxin +1 位作者 NIU Pingjuan LI Jingyi 《Semiconductor Photonics and Technology》 CAS 2010年第2期121-125,共5页
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi... In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp. 展开更多
关键词 high-power LED printed circuit board(pcb) substrate of heat dissipation thermal resistance junction temperature
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Research on Selective Shredding of Wasted Printed Circuit Boards
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作者 曹亦俊 文学峰 赵跃民 《Journal of China University of Mining and Technology》 2002年第1期25-29,共5页
Electronic scrap, especially wasted printed circuit boards (PCBs), is regarded as an environmental challenge. At present, the physical separation is thought to be the environmental friendly and economical method of tr... Electronic scrap, especially wasted printed circuit boards (PCBs), is regarded as an environmental challenge. At present, the physical separation is thought to be the environmental friendly and economical method of treating and reutilizing electronic waste. An effective liberation of metals from non metallic components is a crucial step towards mechanical separation and recycling of wasted PCBs. In this paper, the selective shredding theory and mechanics characteristics of wasted PCBs were analyzed, and the shredded experiments of wasted PCBs by hammer mill were investigated. The result shows that the selective shredding exists in the wasted PCBs shredded process by hammer mill. The shredding velocity of non metallic components is far greater than that of metals in the wasted PCBs shredding, which makes the metals concentrate in the coarser fraction. And the impact force of hammer mill is superior to metal liberation from non metallic components, a satisfied metal liberation degree can be achieved in the wasted PCBs shredding by hammer mill. 展开更多
关键词 wasted printed circuit boards (pcbs) selective shredding reclaim
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ViT和注意力融合的类别不均衡PCB缺陷检测方法
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作者 陈俊英 李朝阳 +1 位作者 席月芸 刘冲 《仪器仪表学报》 EI CAS CSCD 北大核心 2024年第4期294-306,共13页
针对实际环境下印刷电路板(PCB)缺陷样本难以收集造成的数据长尾分布和检测精度低以及ViT用于检测时计算复杂度高等问题,提出多尺度ViT特征提取和注意力特征融合的端到端PCB缺陷检测算法。首先结合ViT和部分卷积构建多尺度特征提取网络... 针对实际环境下印刷电路板(PCB)缺陷样本难以收集造成的数据长尾分布和检测精度低以及ViT用于检测时计算复杂度高等问题,提出多尺度ViT特征提取和注意力特征融合的端到端PCB缺陷检测算法。首先结合ViT和部分卷积构建多尺度特征提取网络,利用层级多头注意力对不同尺度的特征图执行自适应的注意力操作,使网络能够更好地捕捉局部和全局信息进而增强其特征提取能力,部分卷积可以降低计算开销。其次,基于能量空域抑制的无参数注意力机制将多尺度特征有效融合,提升网络融合特征图的表达能力。最后,引入对类别不均衡敏感的分类函数对网络的损失函数进行改进,增强网络对类别不平衡数据的拟合程度,提高网络的泛化能力。在3种不同类型的公开PCB数据集上的实验结果表明,所提出的检测算法在PCB表面缺陷数据集的平均精度均值(mAP)均有提升,分别为99.13%、98.67%,99.82%;在类别不均衡的PCB缺陷检测任务上,相较于改进前方法,mAP提升了11.94%,网络检测速度达到25 FPS,为PCB缺陷的检测提供了一种快速、有效的方法。 展开更多
关键词 缺陷检测 印刷电路板 Vision Transformer 注意力机制 多尺度特征提取
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PCB可靠性测试评估方法简述
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作者 刘立国 高蕊 张永华 《印制电路信息》 2024年第1期30-33,共4页
印制电路板(PCB)技术向高密度、高集成化等方向发展,导致PCB可靠性问题日益凸显。针对PCB失效机理,并结合现有PCB标准及实践应用情况,详细介绍了3种PCB可靠性测试评估的方法——失效率预计法、加速试验预计法和试验鉴定法,以期为从业者... 印制电路板(PCB)技术向高密度、高集成化等方向发展,导致PCB可靠性问题日益凸显。针对PCB失效机理,并结合现有PCB标准及实践应用情况,详细介绍了3种PCB可靠性测试评估的方法——失效率预计法、加速试验预计法和试验鉴定法,以期为从业者开展PCB可靠性测试评估提供一定的帮助。 展开更多
关键词 印制电路板(pcb) 失效机理 可靠性测试 可靠性评估
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融合浅层特征和注意力机制的PCB缺陷检测方法 被引量:1
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作者 廖鑫婷 张洁 吕盛坪 《计算机集成制造系统》 EI CSCD 北大核心 2024年第3期1092-1104,共13页
缺陷检测是印制电路板(PCB)生产过程中质量控制的重要环节。由于PCB表面缺陷尺寸微小,导线布局复杂多样,现有的检测算法难以充分利用微小缺陷的特征信息,其检测准确率难以满足生产需求。为解决上述问题,提出针对PCB微小缺陷检测的YOLOv5... 缺陷检测是印制电路板(PCB)生产过程中质量控制的重要环节。由于PCB表面缺陷尺寸微小,导线布局复杂多样,现有的检测算法难以充分利用微小缺陷的特征信息,其检测准确率难以满足生产需求。为解决上述问题,提出针对PCB微小缺陷检测的YOLOv5-TDD算法。该算法在YOLOv5基础上,首先在颈部网络中增加浅层特征融合分支,提升微小缺陷特征信息流通效率;其次引入SE-SiLU注意力机制模块,以对特征信息分配权重的方式,提高网络对浅层特征的微小缺陷信息关注度。实验结果表明,YOLOv5-TDD在PCB_DATASET缺陷数据集测试中,其检测精度mAP为99.12%,相较于YOLOv5提高了3.54%,检测精度优于其他算法。 展开更多
关键词 印制电路板 微小缺陷 YOLOv5 注意力机制 特征融合
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基于YOLOv8的PCB表面缺陷检测轻量化研究
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作者 徐淼 涂福泉 +2 位作者 吴淇 唐良彪 吴维崧 《包装工程》 CAS 北大核心 2024年第17期172-179,共8页
目的针对印制电路板(PCB)表面缺陷检测模型较大和速度慢的问题,提出一种基于YOLOv8的PCB轻量化表面缺陷检测框架EYOLOv8。方法该框架以YOLOv8网络结构为基础,使用RevCol网络特征融合思想重构网络主干,引入Slim-neck设计思想重构颈部结构... 目的针对印制电路板(PCB)表面缺陷检测模型较大和速度慢的问题,提出一种基于YOLOv8的PCB轻量化表面缺陷检测框架EYOLOv8。方法该框架以YOLOv8网络结构为基础,使用RevCol网络特征融合思想重构网络主干,引入Slim-neck设计思想重构颈部结构,使用卷积权重参数共享的机制重构检测头结构,在保持精度基本不变的同时,对整体网络结构进行了轻量优化设计,最终使用WIoU损失函数对轻量化模型训练过程进行优化。结果在公共数据集上的实验结果表明,EYOLOv8较YOLOv8模型大小减少了46%,检测精度mAP50值达97.7%,检测速度达256帧/s,模型大小为3.3 MB。结论相比其他算法,EYOLOv8在PCB表面缺陷检测设备上部署更有竞争力。 展开更多
关键词 RevCol YOLOv8 pcb 表面缺陷检测 深度学习 轻量化
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基于改进Faster RCNN的PCB表面缺陷检测研究
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作者 龚陈博 南卓江 陶卫 《自动化仪表》 CAS 2024年第7期99-103,109,共6页
印刷电路板(PCB)在制造过程中不可避免地存在焊点缺焊、短路、毛刺、缺口、开路、余铜等微小缺陷。传统的基于机器视觉检测的缺陷检测方法存在检测速度慢、误检率和漏检率高、抗干扰能力弱等问题。为解决上述问题,提出一种基于改进快速... 印刷电路板(PCB)在制造过程中不可避免地存在焊点缺焊、短路、毛刺、缺口、开路、余铜等微小缺陷。传统的基于机器视觉检测的缺陷检测方法存在检测速度慢、误检率和漏检率高、抗干扰能力弱等问题。为解决上述问题,提出一种基于改进快速区域卷积神经网络(Faster RCNN)的PCB表面缺陷检测方法。首先,在传统Faster RCNN框架的基础上,融入扩展特征金字塔网络(EFPN)以实现特征提取与融合,并进行多尺度检测,从而尽可能保留图像细节信息以提高检测性能。其次,利用K-means算法结合交并比(IoU)优化区域建议网络(RPN)结构中的锚框参数,使得生成的锚框方案更有针对性。试验结果表明,改进Faster RCNN在PCB缺陷数据集上的全类平均正确率(mAP)值达到93.4%、检测速度达到每秒21.79帧。所提方法可推广应用至芯片、光学器件表面微小缺陷在线检测,从而提升工业生产效率。 展开更多
关键词 印刷电路板 缺陷检测 快速区域卷积神经网络 扩展特征金字塔网络 K-MEANS 小目标检测 机器视觉
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PCB各向异性行为对焊点疲劳寿命的影响研究
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作者 潘浩东 彭伟 +3 位作者 孙国立 王剑 聂富刚 贺光辉 《印制电路信息》 2024年第4期43-48,共6页
当前微系统不断向着小型化、高密度和高可靠性方向发展,印制电路板(PCB)为微系统器件提供电气连接和机械支撑,对系统的服役可靠性起着至关重要的作用。根据PCB在不同方向上热膨胀系数(CTE)的差异,通过数值模拟研究了3种PCB模型在温度循... 当前微系统不断向着小型化、高密度和高可靠性方向发展,印制电路板(PCB)为微系统器件提供电气连接和机械支撑,对系统的服役可靠性起着至关重要的作用。根据PCB在不同方向上热膨胀系数(CTE)的差异,通过数值模拟研究了3种PCB模型在温度循环载荷下焊点的寿命和应力应变响应情况,并对比了3种模型得到的计算结果,发现3种模型得到的结果存在较大差别。通过试验结果验证了仿真的准确性,表明在进行板级有限元分析时,关注焊球寿命时应充分考虑PCB复合材料的各向异性行为。同时,定量分析了由不同类别PCB模型获得的焊点寿命,为建立板级高保真数值模型和调控焊点寿命提供依据。 展开更多
关键词 印制电路板 各向异性 焊点 热疲劳寿命
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An Experimental Study of the Printed-Circuit Elliptic Dipole Antenna with 1.5-16 GHz Bandwidth 被引量:1
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作者 Chun-Chi LEE Hsin-Sheng HUANG +1 位作者 Cheng-Da YANG Chia-Wei WANG 《International Journal of Communications, Network and System Sciences》 2008年第4期295-300,共6页
Printed-circuit board (PCB) elliptic antennas with useful bandwidth exceeding 10:1 ratio are suitable for wideband radar, wireless ultra wideband (UWB) and other wireless communication applications. We present wideban... Printed-circuit board (PCB) elliptic antennas with useful bandwidth exceeding 10:1 ratio are suitable for wideband radar, wireless ultra wideband (UWB) and other wireless communication applications. We present wideband PCB elliptic dipole antennas which are capable of achieving the bandwidth requirements for all the applications. A set of elliptic dipole antennas with varying eccentricities have been fabricated for demonstration. We find one specific size (specific eccentricity) dipole that can yield an impressive 1.5-16 bandwidth exceeding the currently available. A couple of elliptic dipole antennas suitable for UWB application have been presented. We have measured swept frequency response, impedance and radiation patterns of all dipoles. An empirical formula is given for calculating the starting resonant frequency within the operating band. The calculated values are found in good agreement with measured results. 展开更多
关键词 ELLIPTIC DIPOLE ANTENNA WIDEBAND Radar ANTENNA printed-circuit board (pcb) Ultra WIDEBAND (UWB)
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Advancing PCB Quality Control:Harnessing YOLOv8 Deep Learning for Real-Time Fault Detection
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作者 Rehman Ullah Khan Fazal Shah +1 位作者 Ahmad Ali Khan Hamza Tahir 《Computers, Materials & Continua》 SCIE EI 2024年第10期345-367,共23页
Printed Circuit Boards(PCBs)are materials used to connect components to one another to form a working circuit.PCBs play a crucial role in modern electronics by connecting various components.The trend of integrating mo... Printed Circuit Boards(PCBs)are materials used to connect components to one another to form a working circuit.PCBs play a crucial role in modern electronics by connecting various components.The trend of integrating more components onto PCBs is becoming increasingly common,which presents significant challenges for quality control processes.Given the potential impact that even minute defects can have on signal traces,the surface inspection of PCB remains pivotal in ensuring the overall system integrity.To address the limitations associated with manual inspection,this research endeavors to automate the inspection process using the YOLOv8 deep learning algorithm for real-time fault detection in PCBs.Specifically,we explore the effectiveness of two variants of the YOLOv8 architecture:YOLOv8 Small and YOLOv8 Nano.Through rigorous experimentation and evaluation of our dataset which was acquired from Peking University’s Human-Robot Interaction Lab,we aim to assess the suitability of these models for improving fault detection accuracy within the PCB manufacturing process.Our results reveal the remarkable capabilities of YOLOv8 Small models in accurately identifying and classifying PCB faults.The model achieved a precision of 98.7%,a recall of 99%,an accuracy of 98.6%,and an F1 score of 0.98.These findings highlight the potential of the YOLOv8 Small model to significantly improve the quality control processes in PCB manufacturing by providing a reliable and efficient solution for fault detection. 展开更多
关键词 printed circuit boards(pcb) YOLOv8 YOLOv8 Nano YOLOv8 Small deep learning object detection
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基于机器学习的PCB缺陷检测与分类方法研究 被引量:1
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作者 李娟 《印制电路信息》 2024年第3期57-59,共3页
印制电路板(PCB)在制造过程中难免会产生各种缺陷。为了提高生产效率和产品质量,针对PCB制造中常见的缺陷进行检测与分类。通过构建深度学习模型,采用图像处理技术,对PCB图像进行全面而高效的缺陷检测。通过大量的训练数据,模型能够学... 印制电路板(PCB)在制造过程中难免会产生各种缺陷。为了提高生产效率和产品质量,针对PCB制造中常见的缺陷进行检测与分类。通过构建深度学习模型,采用图像处理技术,对PCB图像进行全面而高效的缺陷检测。通过大量的训练数据,模型能够学习各类缺陷的特征,包括但不限于短路、断路、焊接不良等。使用举例说明和推导论证等方法对PCB缺陷进行分类研究,在深度学习模型的巧妙构建和分类算法的优化应用相辅相成的应用基础上,为提高生产效率和产品质量提供了可行的解决方案,推动了PCB制造业智能化方向的发展。 展开更多
关键词 机器学习 pcb缺陷检测 深度学习 分类算法
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汽车转向机PCBA锡焊缺陷自动检测装置研究
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作者 谢非 王宗荣 李楠 《现代制造技术与装备》 2024年第4期212-216,共5页
为了提高汽车转向机自动化装配生产线焊接检测的效率,将缺陷自动检测技术应用于汽车转向机印制电路板(Printed Circuit Board Assembly,PCBA)自动锡焊生产,研发出汽车转向机的自动锡焊检测装置。一方面对控制器、电缸、相机等硬件设备... 为了提高汽车转向机自动化装配生产线焊接检测的效率,将缺陷自动检测技术应用于汽车转向机印制电路板(Printed Circuit Board Assembly,PCBA)自动锡焊生产,研发出汽车转向机的自动锡焊检测装置。一方面对控制器、电缸、相机等硬件设备进行选型和设计,另一方面进行锡焊焊点的图像识别、特征提取等算法的设计。在现场对多组次产品进行拍照,对采集的焊点图像进行大量试验。结果显示,该装置准确率为98.2%,误检率为1.2%,漏检率为0.6%,每张图像平均检测时间为122.47ms,达到工程的质量要求,有效提高了PCBA锡焊缺陷的检测效率和可靠性。 展开更多
关键词 印制电路板(pcbA) 汽车转向机 锡焊 缺陷自动检测 图像识别 特征提取
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20000m^(3)/d PCB废水扩容改造工程设计研究
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作者 廖振龙 《中国资源综合利用》 2024年第8期53-56,共4页
以赣州市某工业园区20000m^(3)/d的印刷电路板(Printed Circuit Board,PCB)废水处理扩容改造为案例展开分析。介绍“格栅+沉砂池+调节池+混凝沉淀池+多段厌氧好氧(Anaerobic Oxic,A/O)+二沉池+高密度沉淀池+臭氧接触池+V型滤池+消毒池... 以赣州市某工业园区20000m^(3)/d的印刷电路板(Printed Circuit Board,PCB)废水处理扩容改造为案例展开分析。介绍“格栅+沉砂池+调节池+混凝沉淀池+多段厌氧好氧(Anaerobic Oxic,A/O)+二沉池+高密度沉淀池+臭氧接触池+V型滤池+消毒池”组合工艺中的工艺流程、设计参数、运行效果及运营成本等指标。结果表明,采用该组合工艺处理PCB线路板废水,出水各项污染指标均能稳定达到《城镇污水处理厂污染物排放标准》(GB18918-2002)中的一级A标准,其处理成本为3.61元/m^(3)。 展开更多
关键词 印刷电路板(pcb)废水 综合废水 扩容改造 工程实例
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融合RCS-OSA结构的PCB缺陷检测算法
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作者 王超 梁根 《信息与电脑》 2024年第3期86-88,共3页
针对当前印制电路板(Printed Circuit Board,PCB)检测参数庞大、人工误检率高等问题,文章研究了一种改进的YOLOv5检测模型。首先使用实时控制系统(Real-Time Control Systems,RCS)模块替换三卷积跨阶段局部瓶颈模块(Cross Stage Partial... 针对当前印制电路板(Printed Circuit Board,PCB)检测参数庞大、人工误检率高等问题,文章研究了一种改进的YOLOv5检测模型。首先使用实时控制系统(Real-Time Control Systems,RCS)模块替换三卷积跨阶段局部瓶颈模块(Cross Stage Partial Bottle Neck Mudule,C3)结构,通过重参数化卷积增强网络的特征提取能力;其次添加One-Shot聚合(One-Shot Aggregation,OSA)结构,一次性聚合多个特征级联;最后堆叠RCS-OSA模块,确保特征复用并加强不同层之间的信息流通。实验结果表明,改进后的算法检测精度达到94.6%,比原模型提高了2.2个百分点。该算法能够高效检测PCB的多种缺陷类型,对PCB质量检测有实际应用价值。 展开更多
关键词 缺陷检测 YOLOv5 印制电路板(pcb) 特征级联
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带OCP连接器端的PCB板厚改善研究
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作者 倪浩然 王国辉 张文杰 《印制电路信息》 2024年第6期1-5,共5页
开放计算项目(OCP)连接器是一种开放式的服务器架构,是用于服务器功能扩充的便捷、高效、快速安装的连接方案。OCP连接器有过大电流和较高的插拔可靠性要求,在印制电路板(PCB)制作端表现为较高的板厚监控要求。OCP连接器在图形设计上位... 开放计算项目(OCP)连接器是一种开放式的服务器架构,是用于服务器功能扩充的便捷、高效、快速安装的连接方案。OCP连接器有过大电流和较高的插拔可靠性要求,在印制电路板(PCB)制作端表现为较高的板厚监控要求。OCP连接器在图形设计上位于服务器板边,常表现为板厚偏薄。从PCB制作的角度出发,剖析了OCP连接器与PCB单元板厚设计差异和失效模式,提出了含有OCP连接器设计的PCB板在叠构设计方面的偏公差设计方法;在制作方面定义了OCP连接器对应废料区铺铜设计,以及在连接器内部保证屏蔽结构的前提下的图形优化设计方法。 展开更多
关键词 印制电路板 连接器 板边插头 板厚
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一种PCB的阶梯槽底部铜箔分层改善
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作者 徐胜 易雁 刘梦茹 《印制电路信息》 2024年第9期31-35,共5页
使用CO_(2)激光加工阶梯槽时,树脂和槽底铜箔吸收CO_(2)激光后导致阶梯槽底铜箔温度上升,当阶梯槽底铜箔较薄或者铜箔与槽底基材结合不良时,往往会出现阶梯槽底铜箔与基材分层问题。对一种特殊叠构的阶梯槽设计进行试验,发现取消阶梯槽... 使用CO_(2)激光加工阶梯槽时,树脂和槽底铜箔吸收CO_(2)激光后导致阶梯槽底铜箔温度上升,当阶梯槽底铜箔较薄或者铜箔与槽底基材结合不良时,往往会出现阶梯槽底铜箔与基材分层问题。对一种特殊叠构的阶梯槽设计进行试验,发现取消阶梯槽相连通孔设计、调整激光能量、更改铜箔类型等方式对此设计阶梯槽底的铜箔分层无改善,而通过更改叠层中铜箔与CO_(2)激光接触的面次可以改善阶梯槽底铜箔分层问题。此发现为后续类似产品的设计提供了依据,避免产品在制作过程中出现阶梯槽底部铜箔分层问题。 展开更多
关键词 印制电路板 阶梯槽 分层 激光能量
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1.6T高速传输光模块PCB阻抗研究
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作者 邹冬辉 王立刚 陶锦滨 《印制电路信息》 2024年第2期14-18,共5页
光模块是光纤通信中的重要组成部分,其中光模块印制电路板(PCB)表面有高速传输信号线,高可靠性和低信号损耗是5G光模块产品的新要求,控制好阻抗和信号损耗等是做好光模块产品的关键。选取一款14层1.6T高速光模块PCB产品,研究此类产品如... 光模块是光纤通信中的重要组成部分,其中光模块印制电路板(PCB)表面有高速传输信号线,高可靠性和低信号损耗是5G光模块产品的新要求,控制好阻抗和信号损耗等是做好光模块产品的关键。选取一款14层1.6T高速光模块PCB产品,研究此类产品如何从设计、工艺、品质方面进行管控作业,以期为业界技术工作者提供参考。 展开更多
关键词 光模块 印制电路板 阻抗 信号损耗
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