Design of ispPAC-based Humidity Sensor Signal Processing Circuits

The widely used sensitive elements of humidity sensors can be divided into 3 types,i.e.,resistor,capacitor,and electrolyte.Humidity sensors consisting of these sensitive elements have corresponding signal processing circuit unique to each type of sensitive elements.This paper presents an ispPAC (in-system programmable Programmable Analog Circuit) -based humidity sensor signal processing circuit designed with software method and implemented with in-system programmable simulators.Practical operation shows that humidity sensor signal processing circuits of this kind,exhibit stable and reliable performance.

Design of Low-Voltage, Low-Power FGMOS Based Voltage Buffer, Analog Inverter and Winner-Take-All Analog Signal Processing Circuits

This paper proposes novel floating-gate MOSFET (FGMOS) based Voltage Buffer, Analog Inverter and Winner-Take-All (WTA) circuits. The proposed circuits have low power dissipation. All proposed circuits are simulated using SPICE in 180 nm CMOS technology with supply voltages of ±1.25 V. The simulation results demonstrate increase in input range for FGMOS based voltage buffer and analog inverter and maximum power dissipation of 0.5 mW, 1.9 mW and 0.429 mW for FGMOS based voltage buffer, analog inverter and WTA circuits, respectively. The proposed circuits are intended to find applications in low voltage, low power consumer electronics.

Electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films

The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid films with different thicknesses were investigated using stereo microscopy and scanning electron microscopy（SEM）.Meanwhile,the corrosion tendency and kinetics rule of metal plates after bias application were analyzed with the aid of electrochemical impedance spectroscopy（EIS）and scanning Kelvin probe（SKP）.Results showed that under different humidity conditions,the amount of migrating corrosion products of silver for PCB-ImAg was limited,while on PCB-HASL both copper dendrites and precipitates such as sulfate and metal oxides of copper/tin were found under a high humidity condition（exceeding 85%）.SKP results indicated that the cathode plate of two kinds of PCB materials had a higher corrosion tendency after bias application.An ECM model involving multi-metal reactions was proposed and the differences of ECM behaviors for two kinds of PCB materials were compared.

Regrowth-Free Processing for GaAs and InP Photonic Integrated Circuits

Technologies are described for integrating multiple bandgaps and photonic crystal structures monolithically in a semiconductor chip. Practical devices examples include high power 980 nm pumps, 2×2 crosspoint switches and lasers modelocked at THz frequencies.

An improved single-π equivalent circuit model for on-chip inductors in GaAs process

An improved single-π equivalent circuit model for on-chip inductors in the GaAs process is presented in this paper. Considering high order parasites, the model is established by comprising an improved skin effect branch and a substrate lateral coupling branch. The parameter extraction is based on an improved characteristic function approach and vector fitting method. The model has better simulation than the previous work over the measured data of 2.5r and 4.5r on-chip inductors in the GaAs process.